High-side driver

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 27

Technical content

Datasheet sections

  • 1 Block diagram and pin description
  • 2 Electrical specifications
  • 2.1 Absolute maximum ratings
  • 2.2 Thermal data
  • 2.3 Electrical characteristics
  • 3 Application information
  • 3.1 GND protection network against reverse battery
  • 3.1.1 Solution 1: resistor in the ground line (RGND only)
  • 3.1.2 Solution 2: diode (DGND) in the ground line
  • 3.2 Microcontroller I/Os protection
  • 3.3 Electrical characteristics curves
  • 3.4 SO-8 maximum demagnetization energy
  • 4 Package and PCB thermal data
  • 4.1 SO-8 thermal data
  • 5 Package and packing information
  • 5.1 ECOPACK ®
  • 5.2 SO-8 package information
  • 5.3 SO-8 packing information
  • 6 Revision history

Features

■ ECOPACK®: lead free and RoHS compliant ■ Automotive Grade: compliance with AEC guidelines ■ Very low standby current ■ CMOS compatible input ■ Thermal shutdown protection and diagnosis ■ Undervoltage shutdown ■ Overvoltage clamp ■ Load current limitation ■ Reverse battery protection ■ Electrostatic discharge protection

Description

The VN800PS-E is monolithic device made by using STMicroelectronics™ VIPower™ M0-3 technology, intended for driving any kind of load with one side connected to ground. Active V CC pin voltage clamp protects the device against low energy spikes. Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection. This device is especially suitable for industrial applications in norms conformity with IEC1131 (Programmable Controllers International Standard). Type R DS(on) IOUT VCC VN800PS-E 135 m Ω 0.7 A 36 V Table 1. Device summary

Table 6. Switching (V

1 Block diagram and pin description

Figure 1. Block diagram Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins

2 Electrical specifications

Figure 3. Current and voltage conventions

2.1 Absolute maximum ratings

Table 3. Absolute maximum ratings

2.2 Thermal data

Table 3. Absolute maximum ratings (continued) Table 4. Thermal data

  1. When mounted on FR4 printed circuit board with 0.5 cm 2 of copper area (at least 35 µm thick) connected to all V CC pins.
  2. When mounted on FR4 printed circuit board with 2 cm 2 of copper area (at least 35 µm thick).

2.3 Electrical characteristics

Table 5. Power Table 6. Switching (V CC = 24 V) Table 7. Input pin

Table 7. Input pin (continued) Table 8. V CC - output diode Table 9. Status pin Table 10. Protections(1)

  1. To ensure long term reliability under heavy overload or shor t circuit conditions, protection and related diagnostic signals

limit the duration and number of activation cycles.

Figure 4. Status timing Table 11. Truth table

Figure 5. Switching time waveforms

Table 12. Electrical transient requirements on V CC pin (part 1/3) Table 13. Electrical transient requirements on V CC pin (part 2/3)

1 CCCC

2 CCCC

4 CCCC

5 CEEE

Table 14. Electrical transient requirements on V CC pin (part 3/3)

Figure 8. Waveforms

3 Application information

Figure 9. Application schematic

3.1 GND protection network against reverse battery

3.1.1 Solution 1: resistor in the ground line (R GND only)

This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. maximum rating section of the device’s datasheet. maximum on-state currents of the different devices.

If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggests to utilize Solution 2 (see Section 3.1.2).

3.1.2 Solution 2: diode (D GND) in the ground line

A resistor (RGND =1k Ω) should be inserted in parallel to DGND if the device is driving an inductive load. This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network produces a shift (≈600 mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift not varies if more than one HSD shares the same diode/resistor network. Series resistor in input and status lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. Safest configuration for unused input and status pin is to leave them unconnected.

3.2 Microcontroller I/Os protection

If a ground protection network is used and negative transients are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os. CCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax Calculation example: For VCCpeak = -100 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V 5k Ω ≤ Rprot ≤ 65 kΩ. Recommended Rprot value is 10 kΩ.

3.3 Electrical characteristics curves

Figure 10. Off-state output current Figure 11. High level input current Figure 12. Status leakage current Figure 13. On-state resistance vs T case Figure 14. On-state resistance vs V CC Figure 15. Input high level

3.4 SO-8 maximum demagnetization energy

Figure 22. SO-8 maximum turn off current versus load inductance must not exceed the temperature specified above for curves B and C. Figure 23. Demagnetization

4 Package and PCB thermal data

4.1 SO-8 thermal data

Figure 24. SO-8 PC board (1)

  1. Layout condition of R th and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm,

Cu thickness = 35 µm, Copper areas: 0.14 cm 2, 2 cm2). Figure 25. SO-8 R thj-amb vs PCB copper area in open box free air condition

Table 15. Thermal parameter

5 Package and packing information

5.1 ECOPACK ®

specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

5.2 SO-8 package information

Table 16. SO-8 mechanical data

Figure 28. SO-8 package dimensions

5.3 SO-8 packing information

Figure 29. SO-8 tube shipment (no suffix) Figure 30. SO-8 tape and reel shipment (suffix “TR”)

6 Revision history

Table 17. Document revision history Updated Table 3: Absolute maximum ratings. Reformatted entire document. 18-Sep-2013 4 Updated Disclaimer.