VN5E160AS-E STMICROELECTRONICS | Alldatasheet
Document overview
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- PDF pages: 37
Technical content
Datasheet sections
- 1 Block diagram and pin configuration
- 2 Electrical specifications
- 2.1 Absolute maximum ratings
- 2.2 Thermal data
- 2.3 Electrical characteristics
- 2.4 Waveforms
- 2.5 Electrical characteristics curves
- 3 Application information
- 3.1 GND protection network against reverse battery
- 3.1.1 Solution 1: resistor in the ground line (RGND only)
- 3.1.2 Solution 2: a diode (DGND) in the ground line
- 3.2 Load dump protection
- 3.3 MCU I/Os protection
- 3.4 Current sense and diagnostic
- 3.4.1 Short to VCC and OFF-state open load detection
- 4 Package and PCB thermal data
- 4.1 SO-8 thermal data
- 5 Package and packing information
- 5.1 ECOPACK ®
- 5.2 Package mechanical data
- 5.3 Packing information
- 6 Order codes
- 7 Revision history
Features
■ General – Inrush current active management by power limitation – Very low standby current – 3.0 V CMOS compatible inputs – Optimized electromagnetic emission – Very low electromagnetic susceptibility – In compliance with the 2002/95/EC european directive – Very low current sense leakage ■ Diagnostic functions – Proportional load current sense – High-precision current sense for wide-range currents – Current sense disable – OFF-state open-load detection – Output short to V CC detection – Overload and short to ground (power limitation) indication ■ Protections – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self-limiting of fast thermal transients – Protection against loss of ground and loss of V CC – Overtemperature shutdown with autorestart (thermal shutdown) – Reverse battery protected – Electrostatic discharge protection Application ■ All types of resistive, inductive and capacitive loads ■ Suitable as LED driver
Description
The VN5E160AS-E is a single-channel high-side driver manufactured in the ST proprietary VIPower™ M0-5 technology and housed in the tiny SO-8 package. The VN5E160AS-E is designed to drive 12 V automotive grounded loads delivering protection, diagnostics and easy
3 V and 5 V CMOS compatible interface with any
microcontroller. The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with auto-restart and overvoltage active clamp. A dedicated analog current sense pin is associated with every output channel in order to provide ehnanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication, overtemperature indication, short-circuit to V CC diagnosis and ON & OFF state open-load detection. The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to allow sharing of the external sense resistor with other similar devices. Max supply voltage V CC 41 V Operating voltage range V CC 4.5 V to 28 V Max ON-state resistance (per ch.) RON 160 mΩ Current limitation (typ) I LIMH 10 A OFF-state supply current I S 2 µA(1) 1. Typical value with all loads connected. ("1($'5
Table 6. Switching (V
1 Block diagram and pin configuration
Figure 1. Block diagram Table 1. Pin function CS Analog current sense pin, delivers a current proportional to the load current. CS_DIS Active high CMOS compatible pin, to disable the current sense pin.
Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins
2 Electrical specifications
Figure 3. Current and voltage conventions (1)
- V F = VOUT - VCC during reverse battery condition.
2.1 Absolute maximum ratings
STMicroelectronics SURE program and other relevant quality documents. Table 3. Absolute maximum ratings
2.2 Thermal data
Table 3. Absolute maximum ratings (continued) Table 4. Thermal data
2.3 Electrical characteristics
Table 5. Power section
- PowerMOS leakage included.
Table 6. Switching (V CC = 13 V; Tj = 25 °C)
Table 7. Logic inputs Table 8. Protection and diagnostics (1)
- To ensure long term reliability under heavy overload or short circuit conditions, protection and related
abnormal conditions, this software must limit the duration and number of activation cycles.
5 V < VCC < 28 V 14 A
Table 9. Current sense (8 V < V CC < 18 V)
- Parameter guaranteed by design; it is not tested.
- Fault condition includes: power limitation, ov ertemperature and open load OFF-state detection.
Table 10. Openload detection (8 V < V CC < 18 V) Table 9. Current sense (8 V < V CC < 18 V) (continued)
Table 11. Truth table
- If the V CSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents
Table 12. Electrical transient requirements (part 1) Table 13. Electrical transient requirements (part 2)
- The above test levels must be considered referred to V CC = 13.5 V except for pulse 5b
- Valid in case of external load dump clamp: 40 V maximum referred to ground.
Table 14. Electrical transient requirements (part 3) C All functions of the device are performed as designed after exposure to disturbance. disturbance and cannot be returned to proper operation without replacing the device.
2.4 Waveforms
Figure 11. Normal operation Figure 12. Overload or short to GND
2.5 Electrical characteristics curves
Figure 17. OFF-state output current Figure 18. High-level input current Figure 19. Input voltage clamp Figure 20. Low-level input voltage Figure 21. High-level input voltage Figure 22. Hysteresis input voltage
3 Application information
Figure 32. Application schematic
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resistor in the ground line (R GND only)
This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. maximum rating section of the device datasheet. maximum ON-state currents of the different devices.
values. This shift varies depending on how many devices are ON in the case of several high- side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see Section 3.1.2: Solution 2: a diode (DGND) in the ground line).
3.1.2 Solution 2: a diode (D GND) in the ground line
A resistor (RGND = 1 kΩ) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (≈600 mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift not varies if more than one HSD shares the same diode/resistor network.
3.2 Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO T/R 7637/1 table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transients are present on the VCC line, the control pins is pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/O pins to latch-up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (input levels compatibility) with the latch-up limit of microcontroller I/Os. Equation 2 -VCCpeak / Ilatchup ≤ Rprot ≤ (VOHμC - VIH - VGND) / IIHmax Calculation example: For VCCpeak = - 100 V, Ilatchup ≥ 20 mA, VOHμC ≥ 4.5 V 5 kΩ ≤ Rprot ≤ 180 kΩ. Recommended values: Rprot =10 kΩ, CEXT = 10 nF.
3.4 Current sense and diagnostic
- Current mirror of the load current in normal operation, delivering a current proportional to the load one according to a known ratio KX. The current ISENSE can be easily converted to a voltage VSENSE by means of an external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5 V minimum (see parameter VSENSE in Table 9: Current sense (8 V < VCC < 18 V)). The current sense accuracy depends on the output current (refer to current sense electrical characteristics Table 9: Current sense (8 V < V CC < 18 V)).
- Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a maximum current ISENSEH in case of the following fault conditions (refer to Truth table): – Power limitation activation – Overtemperature – Short to V CC in OFF-state – Open-load in OFF-state with additional external components. A logic high-level on CS_DIS pin sets at the same time all the current sense pins of the devices in a high-impedance-state, thus disabling the current monitoring and diagnostic detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of sense resistance and ADC line among different devices.
Figure 33. Current sense and diagnostic
3.4.1 Short to V CC and OFF-state open load detection
A short-circuit between VCC and output is indicated by the relevant current sense pin set to VSENSEH during the device OFF-state. Small or no current is delivered by the current sense during the ON-state depending on the nature of the short-circuit. OFF-state open-load with external circuitry Detection of an open-load in off-mode requires an external pull-up resistor RPU connecting the output to a positive supply voltage VPU. It is preferable VPU to be switched-off during the module standby-mode in order to avoid the overall standby current consumption to increase in normal conditions, i.e. when load is connected. An external pull-down resistor R PD connected between output and GND is mandatory to avoid misdetection in case of floating outputs in OFF-state (see Figure 33: Current sense and diagnostic). RPD must be selected in order to ensure VOUT < VOLmin unless pulled up by the external circuitry: Equation 3 RPD ≤ 22 KΩ is recommended. For proper open load detection in OFF-state, the external pull-up resistor must be selected according to the following formula: Equation 4 For the values of VOLmin ,VOLmax, IL(off2)r and IL(off2)f (see Table 10: Openload detection (8 V < VCC < 18 V). VVIRV minOLf)off(LPDOFF_upPullOUT 22 =<⋅=− () ( ) () VVRR IRRVRV maxOL PDPU r)off(LPDPUPUPD ON_upPullOUT 4 =>+
Figure 34. Maximum turn-off current versus inductance (for each channel) (1)
- Values are generated with R L =0 Ω.
the temperature specified above for curves A and B.
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 35. SO-8 PC board (1)
- Layout condition of R th and Zth measurements (PCB: FR4 area = 4.8 mm x 4.8 mm,
PCB thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 2 cm 2). Figure 36. R thj-amb vs PCB copper area in open box free air condition
Table 15. Thermal parameters
5 Package and packing information
5.1 ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
5.2 Package mechanical data
Figure 39. SO-8 package dimensions
Table 16. SO-8 mechanical data
5.3 Packing information
Figure 40. SO-8 tube shipment (no suffix) Figure 41. SO-8 tape and reel shipment (suffix “TR”)
6 Order codes
Table 17. Device summary
7 Revision history
Table 18. Document revision history 28-Apr-2009 1 Initial release. 25-Jan-2010 2 Updated Table 10: Openload detection (8 V < VCC < 18 V). 18-Sep-2013 4 Updated Disclaimer.