VN5E025ASO-E STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Block diagram and pin description
  • 2 Electrical specifications
  • 2.1 Absolute maximum ratings
  • 2.2 Thermal data
  • 2.3 Electrical characteristics
  • 2.4 Waveforms
  • 2.5 Electrical characteristics curves
  • 3 Application information
  • 3.1 GND protection network against reverse battery
  • 3.1.1 Solution 1: resistor in the ground line (RGND only)
  • 3.1.2 Solution 2: diode (D GND) in the ground line
  • 3.2 Load dump protection
  • 3.3 MCU I/O protection
  • 3.4 Current sense and diagnostic
  • 3.4.1 Short to VCC and off-state open-load detection
  • 4 Package and PC board thermal data
  • 4.1 SO-16L thermal data
  • 5 Package and packing information
  • 5.1 ECOPACK® packages
  • 5.2 Package mechanical data
  • 5.3 Packing information
  • 6 Order codes
  • 7 Revision history

Features

■ General – Inrush current active management by power limitation – Very low standby current – 3.0 V CMOS compatible inputs – Optimized electromagnetic emissions – Very low electromagnetic susceptibility – Compliant with European directive 2002/95/EC – Very low current sense leakage – AEC-Q100 qualified ■ Diagnostic functions – Proportional load current sense – High current sense precision for wide currents range – Current sense disable – Off-state open-load detection – Output short to V CC detection – Overload and short to ground (power limitation) indication – Thermal shutdown indication ■ Protections – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss of V CC – Overtemperature shutdown with autorestart (thermal shutdown) – Reverse battery protected – Electrostatic discharge protection Application ■ All types of resistive, inductive and capacitive loads ■ Suitable as LED driver

Description

The VN5E025ASO-E is a single channel high- side driver manufactured using ST proprietary VIPower ® M0-5 technology and housed in SO-16L package. The device is designed to drive

12 V automotive grounded loads, and to provide

protection and diagnostics. It also implements a

3 V and 5 V CMOS-compatible interface for use

with any microcontroller. The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with auto- restart and overvoltage active clamp. A dedicated analog current sense pin is associated with every output channel providing enhanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication, overtemperature indication, short- circuit to V CC diagnosis and on-state and off-state open-load detection. The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to share the external sense resistor with similar devices. Max supply voltage V CC 41 V Operating voltage range V CC 4.5 to 28 V Max on-state resistance R ON 25 mΩ Current limitation (typ) I LIMH 60 A Off-state supply current I S 2µ A(1) 1. Typical value with all loads connected. SO-16L ("1($'5

Table 9. Current sense (8 V < V

1 Block diagram and pin description

Figure 1. Block diagram Table 1. Pin function CURRENT SENSE Analog current sense pin, it delivers a current proportional to the load current. CS_DIS Active high CMOS compatible pin, to disable the current sense pin.

Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins

2 Electrical specifications

Figure 3. Current and voltage conventions Note: V F = VOUT - VCC during reverse battery condition.

2.1 Absolute maximum ratings

periods may affect device reliability. Table 3. Absolute maximum ratings

2.2 Thermal data

2.3 Electrical characteristics

Table 3. Absolute maximum ratings (continued) Table 4. Thermal data

  1. The measure is done in accordance with the JESD 51-8.
  2. Four Layers PCB characteristics:
  • Device soldered at about 2cm from the PC B edge with two sqcm of exposed copper.

Table 5. Power section

Table 8. Protection and diagnostics (1)

  1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related

abnormal conditions this software must limit the duration and number of activation cycles. Table 9. Current sense (8 V < V CC <1 8V ) Table 7. Logic inputs (continued)

0.5 A < IOUT <1 0A ;

Table 9. Current sense (8 V < V CC < 18 V) (continued)

  1. Parameter guaranteed by design, it is not tested.
  2. Fault condition includes: power limitation, overtemperature and open-load off-state detection.

Table 10. Open-load detection (8 V < V CC <1 8V )

Table 11. Truth table

  1. If the V CSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents

Table 12. Electrical transient requirements (part 1)

  1. The above test levels must be considered referred to V CC = 13.5V except for pulse 5b.
  2. Valid in case of external load dum p clamp: 40V maximum referred to ground.

Table 13. Electrical transient requirements (part 2)

  1. Valid in case of external load dum p clamp: 40V maximum referred to ground.

Table 14. Electrical transient requirements (part 3) C All functions of the device performed as designed after exposure to disturbance. disturbance and cannot be returned to proper operation without replacing the device.

2.4 Waveforms

Figure 11. Normal operation Figure 12. Overload or short to GND

2.5 Electrical characteristics curves

Figure 17. Off-state output current Figure 18. High level input current Figure 19. Input clamp level Figure 20. Input low level Figure 21. Input high level Figure 22. Input hysteresis voltage

3 Application information

Figure 32. Application schematic

3.1 GND protection network against reverse battery

3.1.1 Solution 1: resistor in the ground line (R GND only)

This can be used with any type of load. maximum rating section of the device datasheet. maximum on-state currents of the different devices.

values. This shift varies depending on how many devices are ON in case of several high- side drivers sharing the same RGND. If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using the here below solution 2.

3.1.2 Solution 2: diode (D GND) in the ground line

Note that a resistor (RGND =1k Ω) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (≈600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift not varies if more than one HSD shares the same diode/resistor network.

3.2 Load dump protection

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC maximum DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.

3.3 MCU I/O protection

If a ground protection network is used and negative transients are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/O pins from latching up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os: CCpeak/Ilatchup ≤ Rprot ≤ (VOHμC-VIH-VGND) / IIHmax Calculation example: For VCCpeak = - 100V and Ilatchup ≥ 20mA; VOHµC ≥ 4.5V 5kΩ ≤ Rprot ≤ 180kΩ Recommended values: Rprot =1 0 kΩ, CEXT = 10nF.

3.4 Current sense and diagnostic

  • Current mirror of the load current in normal operation, delivering a current proportional to the load current according to a known ratio KX. The current ISENSE can be easily converted to a voltage VSENSE by means of an external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5V minimum (see parameter VSENSE in Table 9: Current sense (8 V < VCC <1 8V )). The current sense accuracy depends on the output current (refer to current sense electrical characteristics Table 9: Current sense (8 V < V CC <1 8V )).
  • Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a maximum current ISENSEH in case of the following fault conditions (refer to Truth table): – Power limitation activation – Overtemperature – Short to V CC in off-state – Open-load in off-state with additional external components. A logic level high on the CS_DIS pin simultaneously sets all the current sense pins of the device in a high impedance state, thus disabling the current monitoring and diagnostic detection. This feature allows multiplexing of the microcontroller analog inputs by sharing the sense resistance and ADC line among different devices.

Figure 33. Current sense and diagnostic

3.4.1 Short to V CC and off-state open-load detection

A short circuit between VCC and output is indicated by the relevant current sense pin set to VSENSEH during the device off-state. Little or no current is delivered by the current sense during the on-state depending on the nature of the short circuit. Off-state open-load with external circuitry Detection of an open-load in off mode requires an external pull-up resistor (R PU) connecting the output to a positive supply voltage (VPU). It is preferable that VPU is switched off during the module standby mode to avoid an increase in overall standby current consumption in normal conditions, that is, when the load is connected. An external pull-down resistor (R PD) connected between output and GND is mandatory to avoid misdetection in case of floating outputs in off-state (see Figure 33: Current sense and diagnostic). RPD must be selected in order to ensure VOUT < VOLmin unless pulled up by the external circuitry: RPD ≤ 22 KΩ is recommended. For proper open-load detection in off-state, the external pull-up resistor must be selected according to the following formula: For the values of VOLmin,VOLmax, IL(off2)r and IL(off2)f see Table 10: Open-load detection (8 V < VCC <1 8V ). VVIRV OLfoffLPDOFFupPullOUT 2min)2(_ =<⋅=− VVRR IRRVR V OL PDPU roffLPDPUPUPD ONupPullOUT 4max )2( _ =>+ ⋅⋅−⋅

Figure 34. Maximum turn off current versus inductance Note: Values are generated with R L =0 Ω. must not exceed the temperature specified above for curves A and B.

4 Package and PC board thermal data

4.1 SO-16L thermal data

Figure 35. SO-16L PC board Copper area from minimum pad lay- out to 24 cm2 ). Figure 36. R

Table 15. Thermal parameter

5 Package and packing information

5.1 ECOPACK ® packages

specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

5.2 Package mechanical data

Figure 39. SO-16L package dimensions

Table 16. SO-16L mechanical data

5.3 Packing information

Figure 40. SO-16L tube shipment (no suffix) Figure 41. SO-16L tape and reel shipment (suffix “TR”)

6 Order codes

Table 17. Device summary

7 Revision history

Table 18. Document revision history 10-Nov-2011 1 Initial release. 18-Sep-2013 5 Updated disclaimer.