VN5160STR-E STMICROELECTRONICS | Alldatasheet
Document overview
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- PDF pages: 31
Technical content
Datasheet sections
- 1 Block diagram and pins descripti on
- 2 Electrical specifications
- 2.1 Absolute maximum ratings
- 2.2 Thermal data
- 2.3 Electrical characteristics
- 2.4 Electrical characteristics curves
- 3 Application Information
- 3.1 GND protection network against reverse battery
- 3.1.1 Solution 1: resistor in the ground line (RGND only)
- 3.1.2 Solution 2: a diode (DGND) in the ground line
- 3.2 Load dump protection
- 3.3 MCU I/Os protection
- 3.4 Open load detection in off-state
- 4 Package and PCB thermal data
- 4.1 SO-8 thermal data
- 5 Package and packing information
- 5.1 ECOPACK ® packages
- 5.2 Package mechanical data
- 5.3 Packing information
- 6 Revision history
Features
■ Main – Inrush current active management by power limitation – Very low stand-by current – 3.0V CMOS compatible input – Optimized electromagnetic emission – Very low electromag netic susceptibility – In compliance with the 2002/95/EC european directive ■ Diagnostic Functions – Open drain status output – On-state open load detection – Off-state open load detection – Thermal shutdown indication ■ Protection – Undervoltage shutdown – Overvoltage clamp – Output stuck to Vcc detection – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss of V CC – Thermal shutdown – Reverse battery protection (see Figure 28) – Electrostatic discharge protection
Applications
■ All types of resistive, inductive and capacitive loads
Description
The VN5160S-E is a monolithic device made using STMicroelectronics VIPower M0-5 technology. It is intended for driving resistive or inductive loads with one side connected to ground. Active V CC voltage clamp protects the device against low energy spikes.The device detects open load condition both in on and off- state, when STAT_DIS is left open or driven low. Output shorted to V CC is detected in the off-state. When STAT_DIS is driven high, STATUS is in a high impedance condition. Output current limitation protects the device in overload condition. In case of long duration overload, the device limits the dissipated power to safe level up to thermal shutdown intervention. Thermal shutdown with automatic restart allows the device to recover normal operation as soon as fault condition disappears. Max supply voltage V CC 41V Operating voltage range V CC 4.5 to 36V Max on-state resistance (per ch.) R ON 160 m Current limitation (typ) I LIMH 5.4 A Off-state supply current I S 2 µA(1) 1. Typical value with all loads connected SO-8 Table 1. Device summary
Table 8. Status pin (V
1 Block diagram and pins description
Figure 1. Block diagram Table 2. Pins function STATUS Open drain digital diagnostic pin. STAT_DIS Active high CMOS compatible pin, to disable the STATUS pin.
Figure 2. Configurati on diagram (top view) Table 3. Suggested connections for unused and N.C. pins
2 Electrical specifications
Figure 3. Current and voltage conventions Note: V F = VOUT - VCC during reverse battery condition.
2.1 Absolute maximum ratings
and other relevant quality documents. Table 4. Absolute maximum ratings
2.2 Thermal data
Table 4. Absolute maximum ratings (continued) Table 5. Thermal data
2.3 Electrical characteristics
Table 6. Power section
- Guaranteed by design/characterization
- PowerMOS leakage included
Table 7. Switching (V CC =1 3 V ; Tj = 25°C)
Table 8. Status pin (V SD=0) Table 9. Protection (1)
- To ensure long term reliability under heavy overload or short circuit conditions, protection and related
abnormal conditions, this software must limit the duration and number of activation cycles.
Figure 6. Switching characteristics Table 12. Truth table
- If the V SD is high, the STATUS pin is in a high impedance.
- The STATUS pin is low with a delay equal to t DSTKON after INPUT falling edge.
- The STATUS pin becomes hi gh with a delay equal to tPOL after INPUT falling edge.
Table 13. Electrical transient requirements (part 1/3)
- Valid in case of external load dump clamp: 40V maximum referred to ground.
Table 14. Electrical transient requirements (part 2/3)
- The above test levels must be considered referred to V CC = 13.5V except for pulse 5b.
- Valid in case of external load dump clamp: 40V maximum referred to ground.
Table 15. Electrical transient requirements (part 3/3) C All functions of the device are performed as designed after exposure to disturbance. disturbance and cannot be returned to proper operation without replacing the device.
Figure 7. Waveforms
2.4 Electrical char acteristics curves
Figure 8. Off-state output current Figure 9. Input clamp voltage Figure 10. High-level input current Figure 11. Input high-level voltage Figure 12. Input low-level voltage Figure 13. Input hysteresis voltage
Figure 26. High-level STAT_DIS voltage Figure 27. Low-level STAT_DIS voltage
3 Application Information
Figure 28. Application schematic
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resist or in the ground line (RGND only)
This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. maximum rating section of the device datasheet. maximum On-state currents of the different devices. high side drivers sharing the same RGND. the same resistor then ST suggests to utilize Solution 2 (see below).
3.1.2 Solution 2: a diode (D GND) in the ground line
A resistor (RGND=1kshould be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift (600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the µC I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of µC and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHµC 4.5V 5k Rprot 180k. Recommended Rprot values is 10k
3.4 Open load detec tion in off-state
Off-state open load detection requires an external pull-up resistor (RPU) connected between OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the microprocessor. The external resistor has to be selected according to the following requirements: 1. no false open load indication when load is connected: in this case we have to avoid VOUT to be higher than VOlmin; this results in the following condition VOUT= (VPU/(RL+RPU))RL<VOlmin. 2. no misdetection when load is disconnected: in this case the Vout has to be higher than VOLmax; this results in the following condition RPU<(VPU–VOLmax)/IL(off2). Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pull- up resistor RPU should be connected to a supply that is switched OFF when the module is in standby.
Figure 29. Open-load detection in off-state
Figure 30. Maximum turn-off current versus inductance
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 31. SO-8 PC board thickness=2 mm, Cu thickness= 35 µm, Copper areas: from minimum pad lay-out to 2 cm2). Figure 32. R thj-amb vs PCB copper area in open box free air condition
Table 16. Thermal parameter
5 Package and packing information
5.1 ECOPACK ® packages
specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
5.2 Package mechanical data
Figure 35. SO-8 package dimensions
Table 17. SO-8 mechanical data
5.3 Packing information
Figure 36. SO-8 tube shipment (no suffix) Figure 37. SO-8 tape and reel shipment (suffix “TR”)
6 Revision history
Table 18. Document revision history test level values III and IV for test pulse 5b and notes. Updated Section 2.3: Electrical characteristics. Updated Section 2.4: Electrical characteristics curves. Updated Table 6: Power section.