VG0603S020R014

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Technical content

1© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 One world. One KEMET Benefits

• Surface mount form factor Operating a mbient t emperature o f − 55°C t o + 125°C
• Op erating voltage range of up to 18 VDC
• Av ailable cases sizes: 0603, 0805, 1206, 1210
• Sh ort response time
• Ch aracterized for inductance and capacitance
• Di mensional and weight savings on the board
• Non-sensitive t o mi ldly a ctivated fl uxes
• Ba rrier type end terminations solderable with Pb-free solders according to JEDEC J–STD–020C and IEC 60068–2–58
• Non-plastic c oating g uarantees i mproved fla mmability ra ting
• Av ailable in tape and reel for automatic pick and place
• UL 1 499, 3rd edition and CSA C22.2 File E326499 Section 8
• Ro HS 2 2011/65/EC, REACH compliant
• AEC-Q200 qu alified G rade 1 Overview KEMET's VG series of varistors are designed to suppress ESD e vents, including those specified in IEC 1000-4-2 or other standards used for Electr omagnetic Compliance testing. VG varistors are typically applied to protect integrated circuits and other components at the circuit board level operating at 18 Vdc or less. The manufacturing method, design and materials of these devices result in capacitance characteristics suitable for high fr equency attenuation/low-pass filter cir cuit functions, pro viding suppr ession and filtering in a single de vice.

Applications

Typical applications include the protection of components and circuits sensitive to ESD transients occurring on power supply, control and signal lines in mobile communication, computer/EDP products, medical products, hand held/ portable devices, industrial equipment, including diagnostic port protection and I/O interfaces. Suppression of ESD e vents as specified in IEC 1000-4- 2, MILSTD 883C, method 3015.7 or AEC-Q200-002 for Electr omagnetic Compliance (EMC). Surface Mount Varistors VG Series ESD Suppression 125°C

2© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C

Ordering Information

Series Chip Size Code Tolerances Rated Peak Single Pulse Transient Current (A) Packaging/ Termination Maximum Continuous Working Voltage (Vrms AC) Varistor SMD 1 25°C ESD Suppression Multilayer Chip 0603 = 0603 0805 = 0805 1206 = 1206 1210 = 1210 S = Special 020 = 2 Amps (First two digits represent significant fi gures. T hird d igit sp ecifies n umber o f z eros.) R = Reel 180 mm/Ni Sn Barrier Terminations 014 = 14 Dimensions – Millimeters W L 0.5±0.25 t Size Code L W tmax Environmental Compliance RoHS 2 2011/65/EC, REACH

3© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Performance Characteristics Continuous Units Value Steady State Applied Voltage DC Voltage Range (V dc) V 18 AC Voltage Range (V rms) V 14 Transient Non-Repetitive Surge Current, 8/20 µs Waveform (Imax) A 20 to 30 Non-Repetitive Surge Energy, 10/1000 µs Waveform (Wmax) J 0.05 to 0.1 Operating Ambient Temperature °C −55 t o + 125 Storage Temperature Range °C −55 t o + 150 Threshold V oltage T emperature C oefficient %/°C < +0 .05 Response Time ns < 2 Climatic Category 55/125/56 Qualifications Reliability Parameter Test Tested According to Condition to be Satisfied after Testing AC/DC Bias Reliability AC/DC Life Test CECC 42200, Test 4.20 or IEC 1051–1, Test 4.20. AEC–Q200 Test 8 – 1,000 hours at UCT |δVn (1 mA)| < 10 % Pulse Current Capability Imax 8/20 µs CECC 42200, Test C 2.1 or IEC 1051–1, Test 4.5. 10 pulses in the same direction at 2 pulses per minute at maximum peak current for 10 pulses Vn (1 mA)| < 10 % no visible damage Pulse Energy Capability Wmax 10/1,000 µs CECC 42200, Test C 2.1 or IEC 1051–1, Test 4.5. 10 pulses in the same direction at 1 pulses every 2 minutes at maximum peak current for 10 pulses Vn (1 mA)| < 10 % no visible damage WLD Capability WLD x 10 ISO 7637, Test pulse 5, 10 pulses at rate 1 per minute |δVn (1 mA)| < 15 % no visible damage Vjump Capability Vjump 5 min Increase o f s upply vo ltage t o V ≥ Vjump for 1 minute |δVn (1 mA)| < 15 % no visible damage

4© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Qualifications cont'd Reliability Parameter Test Tested According to Condition to be Satisfied after Testing Environmental and Storage Reliability Climatic Sequence CECC 42200, Test 4.16 or IEC 1051–1, Test 4.17. a) Dry heat, 16 hours, UCT, Test Ba, IEC 68–2–2 b) D amp h eat, c yclic, t he fi rst c ycle: 5 5°C, 9 3 % R 24 h ours, Test Db 68–2–4 c) Cold, LCT, 2 hours Test Aa IEC 68–2–1 D amp h eat c yclic, r emaining 5 c ycles: 5 5°C, 9 3 % RH , 24 hour/cycle, Test Bd, IEC 68–2–30 |δVn (1 mA)| < 10 % Thermal Shock CECC 42200, Test 4.12, Test Na, IEC 68–2–14, AEC–Q200 Test 16, 5 cycles UCT/LCT, 30 minutes |δVn (1 mA)| < 10 % no visible damage Steady State Damp Heat CECC 42200, Test 4.17, Test Ca, IEC 68–2–3, AEC–Q200 T est 6 , 5 6 d ays, 4 0°C, 9 3% R H. A EC–Q200 Te st7: Bias, Rh, T all at 85. |δVn (1 mA)| < 10 % Storage Test IEC 68–2–2, Test Ba, AEC–Q200 Test 3, 1,000 hours at maximum storage temperature Vn (1 mA)| < 5 % Mechanical Reliability Solderability CECC 42200, Test 4.10.1, Test Ta IEC 68–2–20 solder b ath a nd r eflow m ethod Solderable at shipment and after 2 year of storage, criteria > 95% must be covered b y s older f or r eflow me niscus Resistance to Soldering Heat CECC 42200, Test 4.10.2, Test Tb, IEC 68–2–20 solder bath a nd r eflow m ethod |δVn (1 mA)| < 5 % Terminal Strength JIS–C–6429, App. 1, 18N for 60 seconds – same for AEC–Q200 Test 22 no visual damage Board Flex JIS–C–6429, App. 2, 2 mm minimum AEC–Q200 t est 2 1 – B oard fl ex: 2 m m fl ex m inimum |δVn (1 mA)| < 2 % no visible damage Vibration CECC 42200, Test 4.15, Test Fc, IEC 68–2–6, AEC– Q200 Test 14. Frequency range 10 to 55 Hz (AEC: 10 – 2,000 Hz) Amplitude 0.75 m/s2 or 98 m/s2 (AEC: 5 g's for 20 minutes) Total duration 6 hours (3x2h) (AEC: 12 cycles each of 3 directions) Waveshape – half sine Vn (1 mA)| < 10 % no visible damage Mechanical Shock CECC 42200, Test 4.14, Test Ea, IEC 68–2–27, AEC–Q200 Test 13. Acceleration = 490 m/s2 (AEC: MIL-STD–202–Method 213), Pulse duration = 11 ms, Waveshape – half sine; Number of shocks = 3x6 Vn (1 mA)| < 10 % no visible damage Electrical Transient Conduction ISO–7637–1 Pulses AEC–Q200 Test 30: Test pulses 1 to 3. Also other pulses – freestyle. Vn (1 mA)| < 10 % no visible damage

5© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Reliability In general, reliability is the ability of a component to perform and maintain its functions in routine circumstances, as well as hostile or unexpected circumstances. The mean life of series components is a function of:

• Fa ctor of Applied Voltage
• Am bient temperature Mean life is closely related to Failure rate (formula). Mean life (ML) is the arithmetic mean (average) time to failure of a component. Failure rate is the frequency with which an engineered system or component fails, expressed for example in failures per hour. Failure rate is usually time dependent, an intuitive corollary is that the rate changes over time versus the expected life cycle of a system. Failure rate formula – calculation 109 [fit]ML[h] FAV – Factor of Applied Voltage Λ= Vapl Vmax Vapl = applied voltage V max = maximum operating voltage Table 1 – Ratings & Part Number Reference KEMET Part Number L (mm) W (mm) tmax (mm) Vrms VDC Vn 1 mA Vc 8/20 µs Ic 8/20 µs (A) Wmax 10/1000 µs (J) Pmax (W) Ctyp at 1 kHz (pF) Ltyp 100 mA/ns (nH) Years Mean Life on Arrhenius model 1,000 100 103 104 105 106 107 108 h 120 100 80 60 40 20 °C Ta Mean life (ML) FAV 0,7 0,8 0,9 1,0

6© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Soldering Popular soldering techniques used for surface mounted components are Wave and Infrared Reflow processes. Both processes can be performed with Pb-containing or Pb-fr ee solders. The termination option available for these soldering techniques is Barrier Type End Terminations. End Termination Designation Recommended and Suitable for Component RoHS Compliant Ni Sn Barrier Type End Termination Ni R1 Pb-containing and Pb-free soldering Yes Wave Soldering – this process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc. SMD v aristors t o be wa ve solder ed ar e first glued t o the cir cuit boar d, usually with an epo xy adhesiv e. When all components on the PCB hav e been positioned and an appropriate time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and run through a single, double wave process. Infrared Reflow Soldering – these r eflow pr ocesses ar e typically associated with t op-side component placement. This technique utiliz es a mixtur e of adhesiv e and solder compounds (and sometimes flux es) that ar e blended int o a paste. The paste is then scr eened ont o PCB soldering pads specifically designed t o accept a par ticular siz ed SMD component. The r ecommended solder paste wet la yer thickness is 100 t o 300 µm. Once the cir cuit boar d is fully populated with MD components, it is placed in a r eflow envir onment, wher e the paste is heated t o slightly abo ve its eutectic temper ature. When the solder paste r eflows, the SMD components ar e attached t o the solder pads. Solder Flux es – solder flux es ar e gener ally applied t o populated cir cuit boar ds t o clean o xides forming during the heating pr ocess and t o facilitate the flowing of the solder . Solder flux es can be either a par t of the solder paste compound or can be separ ate materials, usually fluids. Recommended flux es ar

• non-activ ated (R) flux es, whene ver possible
• mildly activ ated (RM A) flux es of class L3CN
• class ORLO Activated (RA), water soluble or str ong acidic flux es with a chlorine content > 0.2 wt. % ar e NO T RECOMMENDED . The use of such flux es could create high leakage curr ent paths along the body of the varistor components. When a flux is applied prior t o wa ve soldering, it is impor tant t o completely dr y any r esidual flux solv ents prior t o the soldering pr ocess. Thermal Shock – to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100 °C of the peak soldering pr ocess temper ature is r ecommended. Additionally , SMD v aristors should not be subjected t o a temper ature gradient gr eater than 4 °C/sec., with an ideal gr adient being 2 °C/sec. P eak temper atures should be contr olled. W ave and Reflow soldering conditions for SMD v aristors with Pb-containing solders are shown in Fig. 1 and 2 respectiv ely, while Wa ve and Reflow soldering conditions for SMD varist ors with Pb-free solders are shown in Fig, 1 and 3

7© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Soldering cont'd Whenever several different types of SMD components are being soldered, each having a specific soldering profile, the soldering profile with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessar y to minimize the possibility of thermal shock b y allowing the hot PCB t o cool t o less than 50 °C befor e cleaning. Inspection Criteria – the inspection criteria t o determine acceptable solder joints, when W ave or Infr ared Reflow pr ocesses ar e used, will depend on se veral k ey v ariables, principally termination material pr ocess pr ofiles. Pb-contining Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations can be seen in Fig. 4. Barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the solder pads. The bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral (horizontal) push tests. The results exceed established industry standards for adhesion. The solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy (over the barrier layer), and due to its small volume “climbs” the outer surface of the terminations, the meniscus will be slightly lower. This optical appearance should be taken into consideration when programming visual inspection of the PCB after soldering. Ni Sn Barrier Type End Terminations Fig. 4 – Soldering Criterion in case of Wave and IR Reflow Pb-containing Soldering Pb-free W ave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations are given in a phenomenon knows as “mirror” or “negative” meniscus. Solder forms a metallurgical junction with the entire volume of the end termination, i.e. it diffuses from pad to end termination across the inner side, forming a “mirror” or “negative” meniscus. The height of the solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height.

8© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Soldering cont'd Solder Test and Retained Samples – r eflow soldering test based on J-STD-020D .1 and soldering test b y dipping based on IEC 60068- 2 for Pb-fr ee solders are preformed on each production lot as shown in the following chart. Test results and accompanying samples are r etained for a minimum of two (2) y ears. The solder ability of a specific lot can be check ed at any time within this period should a customer r equire this information. Test Resistance to Flux Solderability Static leaching (Simulation of Reflow Soldering) Dynamic Leaching (Simulation of Wave Soldering) Parameter Soldering method dipping dipping dipping dipping with agitation Flux L3CN, ORL0 L3CN, ORL0, R L3CN, ORL0, R L3CN, ORL0, R Pb Solder 62Sn/36Pb/2 Ag Pb So ldering te mperature (° C) 235±5 235±5 260±5 235±5 Pb-FREE Solder Sn96/Cu0,4–0,8/3–4Ag Pb-FREE Soldering Temperature ( °C) 250±5 250±5 280±5 250±5 Soldering Time (s) 2 210 10 > 15 Burn-in Conditions VDCmax, 48 h Acceptance Criterion dVn < 5 %, idc must stay unchanged > 95 % of end termination must be covered by solder > 95 % of end termination must be intact and covered by solder > 95 % of end termination must be intact and covered by solder Rework Criteria Soldering Iron – unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistor chips. If no other means of rework is available, the following criteria must be strictly followed:

• Do not allow the tip of the iron to directly contact the top of the chip
• Do not ex ceed the following soldering ir on specifications: Output Power: 30 Watts maximum Temperature of Soldering Ir on Tip: 280°C maximum Soldering Time: 10 Seconds maximum Stor age Conditions – SMD varistors should be used within 1 year of purchase to avoid possible soldering problems caused by oxidized terminals. The st orage envir onment should be contr olled, with humidity less than 40% and temper ature between -25 and 45 °C. V aristor chips should always be st ored in their original packaged unit.

9© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Soldering Pad Configuration W L t M B C B A D A Size L (mm) W (mm) h (mm) tmax (mm) A (mm) B (mm) C (mm) D (mm) Packaging Voltage Range (V) Chip Size 0603 0805 1206 1210 Reel Size 180 180 180 180 14 4000 4000 4000 4000

10© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Construction Glass Passivation Detailed Cross Section Inner Electrodes (Ag) Terminate Edge Terminate Edge ZnO Layer Inner Electrodes (Ag) Glass Passivation Termination (Ag/Pd, Ni/Sn) Termination (Ag/Pd, Ni/Sn)

11© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Taping & Reel Specifications Tape Size (mm) 8 mm 0603 0805 1206 1210 Ao 1.2 1.6 1.9 2.9 Bo 1.9 2.4 3.75 3.7 Ko Maximum 1.1 1.1 1.8 2 B1 Maximum 4.35 4.35 4.35 4.35 D1 Minimum 0.3 0.3 0.3 0.3 E2 Minimum 6.25 6.25 6.25 6.25 P1 4 4 4 4 F 3.5 3.5 3.5 3.5 W 8.0 8.0 8.0 8.0 T2 Maximum 3.5 3.5 3.5 3.5 W2 Maximum 14.4 14.4 14.4 14.4 A 180 180 180 180

12© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C Terms and Definitions Term Symbol Definition Rated AC Voltage Vrms Maximum continuous sinusoidal AC voltage (<5% total harmonic distortion) which may be applied t o t he c omponent u nder c ontinuous o peration c onditions a t 2 5°C Rated DC Voltage Vdc Maximum continuous DC voltage (<5% ripple) which may be applied to the component under continuous operating conditions at 25°C Supply Voltage V The voltage by which the system is designated and to which certain operating characteristics of the system are referred; V rms = 1,1 x V Leakage Current Idc The current passing through the varistor at Vdc and at 25°C or at any other specified temperature Varistor Voltage Vn Voltage across the varistor measured at a given reference current In Reference Current In Reference current = 1 mA DC Clamping Voltage Protection Level Vc The peak voltage developed across the varistor under standard atmospheric conditions, when passing an 8/20 μs class current pulse Class Current Ic A peak value of current which is 1/10 of the maximum peak current for 100 pulses at two per minute for the 8/20 μs pulse Voltage Clamping Ratio Vc/Vapp A figure of merit measure of the varistor clamping effectiveness as defined by the symbols Vc/Vapp, where (Vapp = Vrms or Vdc) Jump Start Transient Vjump The jump start transient resulting from the temporary application of an overvoltage in excess of the rated battery voltage. The circuit power supply may be subjected to a temporary overvoltage condition due to the voltage regulation failing or it may be deliberately generated when it becomes necessary to boost start the car Rated Single Pulse Transient Energy Wmax Energy which may be dissipated for a single 10/1000 μs pulse of a maximum rated current, with rated AC voltage or rated DC voltage also applied, without causing device failure Load Dump Transient WLD Load Dump is a transient which occurs in an automotive environment. It is an exponentially decaying positive voltage which occurs in the event of a battery disconect while the alternator is still generating charging current with other loads remaining on the alternator circuit at the time of battery disconect Rated Peak Single Pulse Transient Current Imax Maximum peak current which may be applied for a single 8/20 μs pulse, with, rated line vol tage also applies, without causing device failure Rated Transient Average Power Dissipation P Maximum average power which may be dissipated due to a group of pulses occurring within a specified i solated t ime p eriod, w ithout c ausing d evice f ailure a t 2 5°C Capacitance C Capacitance between two terminals of the varistor measured at at 1 kHz Response Time tr The time lag between application of a surge and varistor's "turn-on" conduction action Varistor Voltage Temperature Coefficient TC (Vn at 85°C – Vn at 25°C)/(Vn at 25°C) x 60°C) x 100 In sulation Resistance IR Minimum resistance between shorted terminals and varistor surface Isolation Voltage The maximum peak voltage which may be applied under continuous operating conditions between the varistor terminations and any conducting mounting surface Operating Temperature The range of ambient temperature for which the varistor is designed to operate continuously as defined by the temperature limits of its climatic category Climatic Category LCT/UCT/DHD UCT = Upper Category Temperature – the maximum ambient temperature for which a varistor has been designed to operate continuously, LCT = Lower Category Temperature – the minimum ambient temperature at which a varistor has been designed to operate continuously DHD = Dump Heat Test Duration Storage Temperature Storage temperature range without voltage applied

13© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0 004_VG • 10/26/2016 Surface Mount Varistors VG Series ESD Suppression 125°C KEMET Electronic Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation.