VEML6031X00_V02 VISHAY | Alldatasheet

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www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 1 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 High Accuracy Ambient Light Sensor With I2C Interface LINKS TO ADDITIONAL RESOURCES

DESCRIPTION

VEML6031X00 is a high accuracy ambient light digital 16-bit resolution sensor in a miniature opaque 2.67 mm x 2.45 mm package. It includes a high sensitive photodiode, a low noise amplifier, a 16-bit A/D converter and supports an easy to use I2C bus communication interface and additional interrupt feature. The ambient light result is as digital value available.

APPLICATIONS

Ambient light sensor in automotive for

  • Display backlight controls
  • Infotainment systems
  • Rear view mirror dimming
  • Interior lighting control systems
  • Head-up displays

FEATURES

  • Package type: surface-mount
  • Dimensions (L x W x H in mm): 2.67 x 2.45 x 0.6
  • AEC-Q100 qualified
  • Integrated modules: ambient light sensor (ALS)
  • Supply voltage range V DD: 2.5 V to 3.6 V
  • Communication via I2C interface
  • I 2C bus H-level range: 1.7 V to 3.6 V
  • Floor life: 4 weeks, MSL 2a, according to J-STD-020
  • Low shut down current consumption: typ. 0.5 μA
  • Material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 AMBIENT LIGHT FUNCTION
  • F i l t r o nTM technology adaption: close to real human eye response
  • Typical ALS output tolerance of ≤ 10 % under different light sources
  • 16-bit dynamic range for a mbient light detection from 0 lx to about 228 klx with resolution down to 0.0034 lx/ct, supports low transmittance (dark) lens design
  • Excellent temperature compensation
  • High dynamic detection resolution Note (1) MOQ: minimum order quantity Design Tools Related Documents 333DDD3 D 3D Models Application Notes PRODUCT SUMMARY PART NUMBER OPERATING VOLTAGE RANGE (V) I2C BUS VOLTAGE RANGE (V) AMBIENT LIGHT RANGE (lx) AMBIENT LIGHT RESOLUTION (lx) OUTPUT CODE ADC RESOLUTION PROXIMITY / AMBIENT LIGHT

ORDERING INFORMATION

ORDERING CODE PACKAGING VOLUME (1) REMARKS VEML6031X00 Tape and reel MOQ: 3000 2.67 mm x 2.45 mm x 0.6 mm VEML6031X00-GS15 Tape and reel MOQ: 10 000 2.67 mm x 2.45 mm x 0.6 mm VEML60311X00 Tape and reel MOQ: 3000 2.67 mm x 2.45 mm x 0.6 mm VEML60311X00-GS15 Tape and reel MOQ: 10 000 2.67 mm x 2.45 mm x 0.6 mm

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 2 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes (1) Light conditions: dark (2) Light conditions: EV = 100 lx with 4300K white LED CIRCUIT BLOCK DIAGRAM Fig. 1 - Block Diagram SLAVE ADDRESS OPTIONS ORDERING CODE SLAVE ADDRESS (7 bit) VEML6031X00 0x29 VEML60311X00 0x10 ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. MAX. UNIT Supply voltage V DD 03 . 6 V Operation temperature range T amb -40 +110 °C Storage temperature range T stg -40 +110 °C Total power dissipation T amb ≤ 25 °C P tot -5 0 m W Junction temperature T j - 110 °C BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Supply voltage V DD 2.5 3.3 3.6 V Shut down current (1) VDD = VBUS Isd -0 . 5- μAVDD = VBUS = 3.0 V - - 1.2 VDD is 3.6 V and VBUS = 1.7 V - 3.1 - Operation mode current V DD is 3.3 V I DD - 280 - μA I2C clock rate range f SCL 10 - 400 kHz I2C bus input H-level range V BUS is 3.3 V V ih 0.7 x VDD -3 . 6 V I2C bus input L-level range V BUS is 3.3 V V il -0.3 - 0.2 x V DD V Digital current out (low, current sink) I ol 3-- m A Digital resolution (LSB count) (2) With ALS_GAIN = x 2, ALS_IT = 400 ms, PD_DIV4 = 4/4 PD - 0.0034 - lx/step Detectable maximum illuminance With ALS_GAIN = x 0.5, ALS_IT = 6.25 ms, PD_DIV4 = 1/4 PD EV max. - 228 000 - lx ALS dark offset (1) With ALS_GAIN = x 2, IT = 200 ms, PD_DIV4 = 4/4 PD -4- s t e p IR dark offset (1) With ALS_GAIN = x 2, IT = 200 ms, PD_DIV4 = 4/4 PD -4- s t e p VDD 6

3 INT

4 GND

1 GND

2 SDA

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 3 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Note (1) Data based on standard I2C protocol requirement, not tested in production Fig. 2 - I2C Timing Diagram I2C TIMING CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER SYMBOL STANDARD MODE (1) FAST MODE (1) UNITMIN. MAX. MIN. MAX. Clock frequency f (SMBCLK) 10 100 10 400 kHz Bus free time between start and stop condition t (BUF) 4.7 - 1.3 - μs Hold time after (repeated) start condition; after this period, the first clock is generated t(HDSTA) 4.0 - 0.6 - μs Repeated start condition setup time t (SUSTA) 4.7 - 0.6 - μs Stop condition setup time t (SUSTO) 4.0 - 0.6 - μs Data hold time t (HDDAT) 0 3450 0 900 ns Data setup time t (SUDAT) 250 - 100 - ns I2C clock (SCK) low period t (LOW) 4.7 - 1.3 - μs I2C clock (SCK) high period t (HIGH) 4.0 - 0.6 - μs Detect clock / data low timeout t (TIMEOUT) 25 35 - - ms Clock / data fall time t (F) - 300 - 300 ns Clock / data rise time t (R) - 1000 - 300 ns VIH VIL t(BUF) P Stop condition S Start condition PS Start Stop I2C bus clock (SLCK) I2C bus data (SDAT) I2C bus clock (SLCK) I2C bus data (SDAT) t(LOW) t(R) t(F) VIH VIL t(HDSTA) t(HDDAT) t(HIGH) t(SUDAT) t(SUSTA) t(SUSTO) t(LOSEXT) t(LOWMEXT) t(LOWMEXT) t(LOWMEXT) SCLKACK SDAACK

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 4 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PARAMETER TIMING INFORMATION Fig. 3 - I2C Bus Timing for Sending Word Command Format Fig. 4 - I2C Bus Timing for Receive Word Command Format I2C bus clock (SCLK) I2C bus data (SDAT) I2C bus clock (SCLK) I2C bus data (SDAT) SA7 SA1 SA2SA3SA4SA5SA6 SA7 SA1 SA2SA3SA4SA5SA6 SA0W ACK by slave Stop by master Data byte SA7 SA1 SA2SA3SA4SA5SA6 SA0 ACK by slave ACK by slave Start by master I2C bus slave address byte Command code Command codeI2C bus slave address byte ACK by slave ACK by slave ACK by slave Data byteI2C bus slave address byte Start by master Start by master NACK by master Stop by master I2C bus clock (SCLK) I2C bus data (SDAT) I2C bus clock (SCLK) I2C bus data (SDAT) SA7 SA1 SA2SA3SA4SA5SA6 SA7 SA1 SA2SA3SA4SA5SA6 SA0W SA7 SA1 SA2SA3SA4SA5SA6 SA7 SA1 SA2SA3SA4SA5SA6 SA0R

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 5 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Fig. 5 - Spectral Response Fig. 6 - IR Channel Response ALS sensitivity spectrum close to human eye photopic curve V(λ). Fig. 7 - Relative Sensitivity vs. Angular Displacement 100 1000 10000 0.2 0.4 0.6 0.8 1.0 1.2 400 500 600 700 800 1000 Axis Title 1st line 2nd line 2nd line Normalized Responsivity 900 λ - Wavelength (nm) VEML6031X00 V(λ) 100 1000 10000 0.2 0.4 0.6 0.8 1.2 400 500 600 700 800 1000 Axis Title 1st line 2nd line 2nd line Normalized Responsivity λ - Wavelength (nm) 900 1.0 80° 60° 40° 10000 0.6 0.7 0.8 0.9 1.0 0.5 0.2 0.1 00.4 /g77 - Angular Displacement 2nd line 2nd line Srel - Relative Sensitivity 0.3 2nd line 0° 20°

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 6 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

APPLICATION INFORMATION

Special care must be taken into consideration when hand ling the VEML6031X00. VEML6031X 00 is sensitive to dust and scratches, proper optical device handling procedures are recommended. The optical surface of the device must be kept clean for opti mal performance in both prototyping with the device and mass production manufacturing procedures. Tweezers with plastic or rubber contact surfaces are recommended to avoid scratches on the optical surface. Avoid manipulation with metal tools when possible. The optical surface must be kept clean of fingerprints, dust, and other optical-inhibiting contaminants. If the device optical surface requires cleaning, the use of is opropyl alcohol is recommended. A few gentle brushes with a soft swab are appropriate. Avoid potentially a brasive cleaning and manipu lating tools and excessive force that can scratch the optical surface. If the VEML6031X00 performs less than optimally, inspect the optical surface for dirt, scratches, or other optical artifacts. VEML6031X00 is a cost effective solution of ambient light sensor with I 2C bus interface. The standard serial digital interface is easy to access “Ambient Light Signal” without complex calculation and programming by external controller. Beside the digital output also a flexible programmable interrupt pin is available. 1. Application Circuit Fig. 8 - Application Circuit (x) = Pin Number Notes R2 (at SDA and SCL) and 10 kΩ to 100 kΩ for R3 (at interrupt). Normally just one decoupling capacitor is needed. This should be ≥ 100 nF and placed close to the V DD pin. For detailed description about set-up and us e of the interrupt as well as more application related information see AN: “Designi ng VEML6031X00 into an Application” Host Micro Controller VDD (6) GND (4) C2C1 100 nF10 µF 10R 2.5 V to 3.6 V 1.7 V to 3.6 V R1 R2 R3 GPIO (interrupt)INT (3) VEML6031X00 GND (1) I2C bus clock SCLSCL (5) I2C bus data SDASDA (2) C1 and R4 are optional for a noisy supply

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 7 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 2. I2C Interface The VEML6031X00 has eighteen register addresses responsible fo r operation control, paramete r setup and result buffering. All registers are accessible via I2C communication. Fig. 9 shows the basic I2C communication with VEML6031X00. The built in I2C interface is compatible with I2C modes “standard” and “fast”: 10 kHz to 400 kHz. Please refer to the I2C specification from NXP for details. Fig. 9 - Send Byte / Receive Byte Protocol Device Address The VEML6031X00 is available in two different pre-configured slave addresses. For one version the predefined 7 bit I 2C bus address is set to 0101001 = 0x29. The least significant bit (LSB) defines read or write mode. Accordingly the bus address is set to 0101 0010 = 0x52 for write and 0101 0011 = 0x53 for read. The second version comes with predefined 7 bit I 2C bus address of 0010000 = 0x10, so, here the write address is 0010 0000 = 0x20 for write and 0010 0001 = 0x21 for read. Register Addresses The VEML6031X00 has eighteen registers, accessible through there respective 8-bit command codes. The registers are 0x00 to 0x17 (0x02 and 0x03, 0x08 to 0x0F and 0x16 are not defined / reserved). Note that due to the location of the two shutdown bits (SD and ALS_IR_SD), one in register 0x00 and the other in 0x01, it is necessary to always write to both registers at once when configuring the device. Auto-Memorization The VEML6031X00 stores the last measured ambient data before the device is shutdown, keeping the data accessible. When VEML6031X00 is in shutdown mode, the host can freely read this data via read command directly. Receive byte Block read byte mode Host action VEML6031X00 response Send byte Block write byte mode AData byte (address = M) Data byte (address = M + 1) AWrSlave address Command code (address = M) AS 171 1818181 P Data byte (address = M + 2) A AData byte (address = M + 3) ASlave address Data byte (address = M) AWrSlave address Command code (address = M) AS 171 181 1 71 18 1 P Data byte (address = M + 1) A Data byte (address = M + N) N AData byte (address = M + 2) Sr R A Data byte (address = M + N) A A S = start condition P = stop condition A = acknowledge Sr = reapeated start condition

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 8 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes

  • Command code 0x00 default valu e is 0x01 = device is shutdown
  • Command 0x00 and command 0x01 must be executed together, they cannot be executed independently Note
  • Command code 0x00 default valu e is 0x01 = device is shutdown COMMAND REGISTER FORMAT COMMAND CODE REGISTER NAME BIT DEFAULT VALUE FUNCTION / DESCRIPTION R / W 0x00 ALS_CONF 0 0 : 7 0x01 ALS integratio n time, measurement mode, shutdown R/W 0x01 ALS_CONF 1 0 : 7 0x00 ALS and IR shut down, ALS gain, interrupt persistance R/W 0x04 ALS_WH_L 0 : 7 0x00 ALS high th reshold window setting (LSB) R/W 0x05 ALS_WH_H 0 : 7 0x00 ALS high th reshold window setting (MSB) R/W 0x06 ALS_WL_L 0 : 7 0x00 ALS low threshold window setting (LSB) R/W 0x07 ALS_WL_H 0 : 7 0x00 ALS low th reshold window setting (MSB) R/W 0x10 ALS_DATA_L 0 : 7 0x00 Low byte of 16-bit ALS result DATA R 0x11 ALS_DATA_H 0 : 7 0x00 High byte of 16-bit ALS result DATA R 0x12 IR_DATA_L 0 : 7 0x00 Low byte of 16-bit IR result DATA R 0x13 IR_DATA_H 0 : 7 0x00 High byte of 16-bit IR result DATA R 0x14 ID_L 0 : 7 0x01 ID code R 0x15 ID_H 0 : 7 0x00 Packa ge and version code R 0x17 ALS_INT 0 : 7 0x00 ALS INT trigger event R TABLE 1 - REGISTER: ALS_CONF_0 - 0x00 REGISTER NAME BIT FUNCTION / DESCRIPTION R / W Reserved 7 Must be set to “0” R / W ALS_IT 6 : 4 ALS integration time setting 000 = 3.125 ms 001 = 6.25 ms 010 = 12.5 ms 011 = 25 ms 100 = 50 ms 101 = 100 ms 110 = 200 ms 111 = 400 ms R / W ALS_AF 3 Active force mode enable setting 0 = AF disable 1 = AF enable Once enabled, a single measurement can be triggered with the “ALS_TRIG” bit R / W ALS_TRIG 2 ALS active force trigger setting 0 = no active force mode trigger 1 = trigger active force mode This bit resets to “0” automatically after every trigger R / W ALS_INT_EN 1 ALS interrupt setting 0 = interrupt disable 1 = interrupt enable R / W SD 0 Band gap and LDO shutdown setting 0 = band gap and LDO on 1 = band gap and LDO shutdown (default) R / W

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 9 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TABLE 2 - REGISTER: ALS_CONF_1 - 0x01 REGISTER NAME BIT FUNCTION / DESCRIPTION R / W ALS_IR_SD 7 ALS and IR channel shutdown setting 0 = ALS and IR channels on 1 = ALS and IR channels shutdown R / W PD_DIV4 6 Effective photodiode size ALS and IR 0 = 4/4 PD used 1 = 1/4 PD used R / W Reserved 5 Reserved R / W ALS_GAIN 4 : 3 Gain selection 00 = ALS gain x1 01 = ALS gain x2 10 = ALS gain x 0.66 11 = ALS gain x 0.5 R / W ALS_PERS 2 : 1 ALS persistence protect number setting Number of persistent measurements above threshold to trigger the interrupt 00 = 1 01 = 2 10 = 4 11 = 8 R / W ALS_CAL 0 Must be set to “1” when power on ready R / W TABLE 3 - REGISTER: ALS_WH - 0x04, 0x05 COMMAND CODE REGISTER NAME BIT FUNCTION / DESCRIPTION R / W 0x04 ALS_WH_L 7 : 0 ALS high threshold window setting (data byte low) R / W 0x05 ALS_WH_H 7 : 0 ALS high threshold wi ndow setting (data byte high) R / W TABLE 4 - REGISTER: ALS_WL - 0x06, 0x07 COMMAND CODE REGISTER NAME BIT FUNCTION / DESCRIPTION R / W 0x06 ALS_WL_L 7 : 0 ALS low threshold wi ndow setting (data byte low) R / W 0x07 ALS_WL_H 7 : 0 ALS low threshold wi ndow setting (data byte high) R / W TABLE 5 - REGISTER: ALS_DATA - 0x10, 0x11 COMMAND CODE REGISTER NAME BIT FUNCTION / DESCRIPTION R / W 0x10 ALS_DATA_L 7 : 0 ALS result channel (data byte low) R 0x11 ALS_DATA_H 7 : 0 ALS result channel (data byte high) R TABLE 6 - REGISTER: IR_DATA - 0x12, 0x13 COMMAND CODE REGISTER NAME BIT FUNCTION / DESCRIPTION R / W 0x12 IR_DATA_L 7 : 0 IR result channel (data byte low) R 0x13 IR_DATA_H 7 : 0 IR result channel (data byte high) R TABLE 7 - REGISTER: ID - 0x14, 0x15 COMMAND CODE REGISTER NAME BIT FUNCTION / DESCRIPTION R / W 0x14 ID_L 7 : 0 ID code: 0x01 R 0x15 ID_H 7 : 6 5 : 4 3 : 0 Package code: 00 Slave address: 00 = 0x29; 01 = 0x10 Version code: 0000 = A01 R

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 10 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CALCULATING THE LUX LEVEL Command code 0x10 and 0x11 contain the results of the ALS measurement. This 16-bit code needs to be converted to a decimal value to determine the corresponding lux value. The calculation of the corresponding lux level is dependent on the programmed gain setting and the chosen integration time. The component is most sensitive with ALS_GAIN = x2, PD_DIV4 = 4/4 and an integration time of 400 ms, specified to 0.0034 lx/step. Every time the integration time is halved, the resolution is doubled but also the possible detection range is doubled. The same principle is valid for the gain setting. For ALS_GAIN = x1 it is doubled. For PD_DIV4 = 1/4 the size of the photodiode is just 1/4, so, also the sensitivity is just 1/4, resolution and max. possible de tection range is times 4, to allow for higher illuminations up to about 228 klx. Note (1) For integration time of 3.125 ms the maximum count level is no longer 16 bit, so, half the integratio n time no longer leads to double the max. lux level Example: If the 16-bit word of the ALS data shows: 0000 0101 1100 1000 = 1480 (dec.), the programmed ALS_GAIN = x1, PD_DIV4 = 4/4 (= x1) and ALS_IT = 100 ms, the corresponding lux level is: light level (lx) = 1480 x 0.0272 = 40.256 lx. TABLE 8 - REGISTER: ALS_INT - 0x17 REGISTER NAME BIT FUNCTION / DESCRIPTION R / W Reserved 7 : 4 Reserved R ALS_AF_DATA_READY 3 ALS active force mode data ready flag R ALS_IF_L 2 ALS low threshold INT flag R ALS_IF_H 1 ALS high threshold INT flag R Reserved 0 Reserved R TABLE 9 - RESOLUTION AND MAXIMUM DETECTION RANGE AT PD_DIV4 = 0 (= x 4/4) GAIN x 2 GAIN x 1 GAIN x 0.66 GAIN x 0.5 GAIN x 2 GAIN x 1 GAIN x 0.66 GAIN x 0.5 IT (ms) TYPICAL RESOLUTION (lx/cnt) MAXIMUM POSSIBLE ILLUMINATION (lx) 400 0.0034 0.0068 0.0103 0.0136 223 446 675 891 200 0.0068 0.0136 0.0206 0.0272 446 891 1350 1783 100 0.0136 0.0272 0.0412 0.0544 891 1783 2701 3565 50 0.0272 0.0544 0.0824 0.1088 1783 3565 5402 7130 25 0.0544 0.1088 0.1648 0.2176 3565 7130 10803 14260 TABLE 10 - RESOLUTION AND MAXIMUM DETECTION RANGE AT PD_DIV4 = 1 (= x 1/4) GAIN x 2 GAIN x 1 GAIN x 0.66 GAIN x 0.5 GAIN x 2 GAIN x 1 GAIN x 0.66 GAIN x 0.5 IT (ms) TYPICAL RESOLUTION (lx/cnt) MAXIMUM POSSIBLE ILLUMINATION (lx) 400 0.0136 0.0272 0.0412 0.0544 891 1783 2701 3565 200 0.0272 0.0544 0.0824 0.1088 1783 3565 5402 7130 100 0.0544 0.1088 0.1648 0.2176 3565 7130 10803 14260 50 0.1088 0.2176 0.3297 0.4352 7130 14260 21607 28521 25 0.2176 0.4352 0.6594 0.8704 14260 28521 43213 57042

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 11 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE DIMENSIONS in millimeters PIN 1 IDENTIFICATION All dimensions in mm incl. burrs Not indicated tolerances ± 0.1 Drawing No.: 6.550-5357.01-4 Issue: 1; 14.04.2021 Technical drawings according to DIN specification Recommended footprint 0.8 0.80.8 0.4 chip surface 0.6 0.1 0.2 0.2 2.45 2.67

0.2 Active area

0.15 Pin 1 marking: exposed pad offset 0.54 1.2 (0.33) 0.79 0.85 1.5 1.2 1.28 0.79 0.85 (0.35) Pinning top view Pin 4 GND Pin 2 SDA Pin 3 INT Pin 6 V DD Pin 5 SCL Pin 1 GND Pin 1 marking dotmarking on top side elongated feature on bottom side

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 12 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TAPE AND REEL DIMENSIONS in millimeters Not indicated tolerances ± 0.1 Technical drawings according to DIN specification Reel size: VEML6031: Ø 180 mm ± 2 mm = 3000 pcs. VEML6031-GS 15: Ø 330 mm ± 2 mm = 10 000 pcs. Reel design is representative for different types. Unreel direction A Label posted here Pin 1 Sensor orientation A (5:1) Drawing No.: 9.800-5148.01-4 Issue: prelminary; 16.10.19 1.1 0.2524 5.5 1.75 Ø 1.5

www.vishay.com Vishay Semiconductors Rev. 1.2, 15-Oct-2021 13 Document Number: 80007 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DRYPACK Devices are packed in mois ture barrier bags (MBB) to prevent the products from mo isture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: T amb < 30 °C, RH < 60 % Moisture sensitivity level 2a, according to J-STD-020. DRYING I n c a s e o f m o i s t u r e a b s o r p t ion devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on re el dry using recommended conditions REFLOW SOLDER PROFILE Fig. 10 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 240 °C Max. 260 °C 217 °C 255 °C 19841 100 1000 10000 100 200 300 0 50 100 150 200 300 Axis Title 1st line 2nd line 2nd line Temperature (°C) Time (s) 150 250 250 245 °C Max. 100 s Max. 30 s Max. 120 s Max. ramp down 6 °C/s Max. ramp up 3 °C/s

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