VEML3235 VISHAY | Alldatasheet

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www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 1 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Low Power, High Sensitivity, I2C Ambient Light Sensor

DESCRIPTION

VEML3235 is an advanced ambient light sensor with I 2C protocol interface and is designed by the CMOS process. It is easy to operate via a simple I2C command. VEML3235 incorporates a photodiode, amplifiers, and analog circuits in a single chip. The best spectral sensitivity is used to closely capture real human eye responses. VEML3235 has excellent temperature compensation and the robust refresh rate setting does not need an external RC low pass filter. Software shutdown mode is provided, which reduces power consumption to be less than 1 μA. VEML3235’s operating voltage ra nges from 2.6 V to 3.6 V. VEML3235 can detect a wide range of ambient light power.

FEATURES

  • Package type: surface-mount
  • Dimensions (L x W x H in mm): 2 x 2 x 0.87
  • Integrated modules: ambient light sensor (ALS)
  • Supply voltage range V DD: 2.6 V to 3.6 V
  • Communication via I2C interface
  • I 2C bus H-level range: 1.7 V to 3.6 V
  • Floor life: 168 h, MSL 3, according to J-STD-020
  • Low stand by current consumption: typ. 1 μA
  • Material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912

APPLICATIONS

  • Handheld device
  • Notebook
  • Consumer device
  • Industrial and medical application
  • Computing, and industrial devices and displays AMBIENT LIGHT FUNCTION
  • High ALS sensitivity with minimum detectable intensity of 0.0021 lux/cnt supports low transmittance lens design
  • Excellent temperature compensation
  • High dynamic detection resolution
  • Software shutdown mode control Note (1) MOQ: minimum order quantity PRODUCT SUMMARY PART NUMBER OPERATING VOLTAGE RANGE (V) I2C BUS VOLTAGE RANGE (V) AMBIENT LIGHT RANGE (lx) AMBIENT LIGHT RESOLUTION (lx) OUTPUT CODE ADC RESOLUTION PROXIMITY / AMBIENT LIGHT

ORDERING INFORMATION

ORDERING CODE PACKAGING VOLUME (1) REMARKS VEML3235 Tape and reel MOQ: 3000 2.00 mm x 2.00 mm x 0.87 mm

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 2 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes (1) VDD = 3.3 V, temperature: 25 °C (2) IT = 800 ms (3) IT = 50 ms CIRCUIT BLOCK DIAGRAM Fig. 1 - Block Diagram ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. MAX. UNIT Supply voltage V DD 04V Operation temperature range T amb -25 +85 °C Storage temperature range T stg -25 +85 °C BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Supply voltage V DD 2.6 3.3 3.6 V Shut down current (1) VDD is 3.3 V I sd -1- μ A Supply current (1) VDD is 3.3 V I DD - 250 - μA I2C clock rate range f SCL 10 - 400 kHz I2C bus input H-level range V DD is 3.3 V V ih 1.2 - - V I2C bus input L-level range V DD is 3.3 V V il 0- 0 . 4 V Digital resolution (LSB count) (2) With DG = x 2, Gain = x 4 - 0.0021 - lx/step Detectable minimum illuminance (2) With DG = x 2, Gain = x 4 E V min. - 0.0021 - lx Detectable maximum illuminance (3) With DG = x 1, Gain = x 1 E V max. - 17 867 - lx VDD GND SCL SDA Temperature compensation Low pass filter Timing controller Oscillator Output buffer with I2C interface

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 3 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Note (1) Data based on standard I2C protocol requirement, not tested in production Fig. 2 - I2C Timing Diagram I2C TIMING CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER SYMBOL STANDARD MODE (1) FAST MODE (1) UNITMIN. MAX. MIN. MAX. Clock frequency f (SMBCLK) 10 100 10 400 kHz Bus free time between start and stop condition t (BUF) 4.7 - 1.3 - μs Hold time after (repeated) start condition; after this period, the first clock is generated t(HDSTA) 4.0 - 0.6 - μs Repeated start condition setup time t (SUSTA) 4.7 - 0.6 - μs Stop condition setup time t (SUSTO) 4.0 - 0.6 - μs Data hold time t (HDDAT) - 3450 - 900 ns Data setup time t (SUDAT) 250 - 100 - ns I2C clock (SCL) low period t (LOW) 4.7 - 1.3 - μs I2C clock (SCL) high period t (HIGH) 4.0 - 0.6 - μs Clock / data fall time t (F) - 300 - 300 ns Clock / data rise time t (R) - 1000 - 300 ns VIH VIL t(BUF) P Stop condition S Start condition PS Start Stop I2C bus clock (SCL) I2C bus data (SDA) I2C bus clock (SCL) I2C bus data (SDA) t(LOW) t(R) t(F) VIH VIL t(HDSTA) t(HDDAT) t(HIGH) t(SUDAT) t(SUSTA) t(SUSTO) t(LOSEXT) t(LOWMEXT) t(LOWMEXT) t(LOWMEXT) SCLACK SDAACK

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 4 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PARAMETER TIMING INFORMATION Fig. 3 - I2C Bus Timing for Sending Word Command Format Fig. 4 - I2C Bus Timing for Receive Word Command Format ACK ACK ACKACK I2C bus clock (SCL) I2C bus data (SDA) I2C bus clock (SCL) I2C bus data (SDA) I2C bus slave address byte Command code Start by master Stop by master Data byte low Data byte high SA7 SA1SA2SA3SA4SA5SA6 SA7 SA1SA2SA3SA4SA5SA6 SA0 SA7 SA1SA2SA3SA4SA5SA6 SA0 SA7 SA1SA2SA3SA4SA5SA6 SA0 W ACK ACK ACK I2C bus clock (SCL) I2C bus data (SDA) I2C bus slave address byte Command code Start by master SA7 SA1SA2SA3SA4SA5SA6 SA7 SA1SA2SA3SA4SA5SA6 SA0W I2C bus clock (SCL) I2C bus data (SDA) Data byte low Data byte high ACK by master Start by master I2C bus slave address byte I2C bus clock (SCL) I2C bus data (SDA) NACK by master Stop by master SA7 SA1SA2SA3SA4SA5SA6 SA7 SA1SA2SA3SA4SA5SA6 SA0R SA7 SA1SA2SA3SA4SA5SA6 SA0

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 5 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Fig. 5 - Normalized Spectral Response Fig. 6 - View Angle Fig. 7 - IDD vs. Temperature Characteristics 100 300 500 600 700 800 900 1000 λ- Wavelength (nm) Relative Responsivity (%) ALS W 400 0.1 0.2 0.3 1.0 1.1 -90 -60 -30 0 30 60 90 Angular Displacement (°) Normalized Responsivity 0.9 0.8 0.7 0.6 0.5 0.4 230 235 240 245 250 255 275 -40 -20 0 20 40 60 100 Temperature (°C) Active Current (μA) 270 255 255

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 6 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

APPLICATION INFORMATION

  1. Pin Connection With the Host VEML3235 is a cost effective solution with I 2C interface. The standard seri al digital interface easily accesses “light intensity” without using complex calculations and programming by an external controller. The additional capacitor near the VDD pin in the circuit is used for power supply noise rejection. The value is recommended at 0.1 μF. The pull-high resistors for the I2C bus design are recommended to be 2.2 kΩ. Fig. 8 - Hardware Pin Connection Diagram (Slave Address 0x10) Digital Interface VEML3235 contains a command register written via the I 2C bus. All operations can be controlled by the command register. The simple command structure allows the user to easily program the operation setting and latch the light data from VEML3235. VEML3235’s I2C command format description for read and write oper ations between VEML3235 and the host is shown in Fig. 9. The white areas indicate the host activity and the gray areas indicate VEML3235’s acknowledgement of the host access activity. Fig. 9 - Command Protocol Format Host micro controller GPIO (interrupt) VEML3235 SDA (2) SCL (5) C2C1 100 nF10 μF 10R 2.6 V to 3.6 V 1.7 V to 3.6 V R2R1 GND (1) VDD (6) NC (4) I2C bus data SDA I2C bus clock SCL C1 and R4 are optional for very disturbed supply NC (3) S Slave address Wr A Command code A Data byte low A Data byte high A 17 8 11 1 81 8 P Send byte → write command to sensor Slave address Wr A Command code A S Slave address Rd A Data byte low A Data byte high N P 11 8 11 7 11 8 1 8 1 1 S Receive byte → read data from VEML3235 S = start condition P = stop condition A = acknowledge N = not acknowledge Host action Sensor acknowledge

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 7 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Command Register Format VEML3235 uses 0x10 slave address for 7-bit I 2C addressing protocol. VEML3235 has 16-bit resolution for each channel (ALS and W). TABLE 1 - COMMAND CODE DESCRIPTION COMMAND CODE REGISTER NAME DATE BYTE LOW / HIGH BIT FUNCTION DESCRIPTION R / W 0x00 Reserved L 7S e t 0 R / W ALS/W_IT 6 : 4 ALS/W integration time setting (0 : 0 : 1) = 100 ms (0 : 1 : 0) = 200 ms (0 : 1 : 1) = 400 ms (1 : 0 : 0) = 800 ms AF 3 Auto / manual force mode TRIG 2 0 = trigger not active, 1 = triggers a single measurement cycle Reserved 1 Set 0 SD 0 Shutdown BG and LDO with SD = 1 (default) SD0 H

7 Shutdown ALS and white channel with SD0 = 1

(default) Reserved 6 Set 0 DG 5 0 = x 1, 1 = x 2 Gain 4 : 3 (0 : 0) = x 1 (0 : 1) = x 2 (1 : 0) = reserved (1 : 1) = x 4 Reserved 2 : 1 Set 0 Reserved 0 Set 1 0x02 Reserved L 7 : 0 Set 0 Reserved H 7 : 0 Set 0 0x04 W_LSB L 7 : 0 W LSB data R W_MSB H 7 : 0 W MSB data 0x05 ALS_LSB L 7 : 0 ALS LSB data ALS_MSB H 7 : 0 ALS MSB data 0x09 ID_L L 7 : 0 ID part number: 3235 = 0011 0101 Reserved H 7 : 0 Reserved

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 8 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Data Access VEML3235 has 16-bit high resolution sensitivity for each channel. To represent the 16-bit data, it has to apply two bytes. One byte is for LSB and the other byte is for MSB. The host needs to follow the read word protocol. The data format shows as below.Note

  • Data byte low represents LSB and data byte high represents MSB The table below shows these dependencies: Example: If the 16-bit word of the ALS data shows: 0000 0101 1100 1000 = 1480 (dec.), the programmed Gain = x 1, the digital gain DG = x 1 and the integration time is 100 ms, the corresponding lux level is: light level [lx] = 1480 x 0.13632 = 202 lx. For detailed description about set-up and more application related information see application note: “Designing VEML3235 into an Application”. TABLE 2 - 16-BIT DATA FORMAT VEML3235 16-BIT DATA FORMAT Data bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Data byte low Data byte high RESOLUTION AND MAXIMUM DETECTION RANGE AT DG = 1 GAIN: x 4 GAIN: x 2 GAIN: x 1 GAIN: x 4 GAIN: x 2 GAIN: x 1 IT (ms) TYPICAL RESOLUTI ON (lx/cnt) MAXIMUM POSS IBLE ILLUMINATION (lx) 800 0.00426 0.00852 0.01704 279 558 1117 400 0.00852 0.01704 0.03408 558 1117 2233 200 0.01704 0.03408 0.06816 1117 2233 4467 100 0.03408 0.06816 0.13632 2233 4467 8934 50 0.06816 0.13632 0.27264 4467 8934 17 867 RESOLUTION AND MAXIMUM DETECTION RANGE AT DG = 2 GAIN: x 4 GAIN: x 2 GAIN: x 1 GAIN: x 4 GAIN: x 2 GAIN: x 1 IT (ms) TYPICAL RESOLUTI ON (lx/cnt) MAXIMUM POSS IBLE ILLUMINATION (lx) 800 0.00213 0.00426 0.00852 140 279 558 400 0.00426 0.00852 0.01704 279 558 1117 200 0.00852 0.01704 0.03408 558 1117 2233 100 0.01704 0.03408 0.06816 1117 2233 4467 50 0.03408 0.06816 0.13632 2233 4467 8934 Slave address Wr A Command code A S Slave address Rd A Data byte low A Data byte high N PS

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 9 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE INFORMATION in millimeters Fig. 10 - VEML3235 A3OZ Package Dimensions Recommended footprint SCL 5 VDD 6

2 SDA

1 GND

3 NCNC 4

(0.6) 0.87 20.65 (4 x) Pin 1 marking Top view pinnning Optical center 0.55 (6 x) 0.35 (4 x) 2.3 1.6 0.3 (6 x) Technical drawings according to DIN specification. Not indicated tolerances ± 0.1 Drawing No.: AK-20.0014.00 Issue: preliminary 28.02.2019

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 10 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TAPE AND REEL DIMENSIONS in millimeters Fig. 11 - 7" Reel, 3000 Pieces Drawing-No.: 9.800-5096.01-4 Issue: 5; 20.12.2016 Form of the leave open of the wheel is supplier specific. Ø 177.8 max. Ø 55 min. 14.4 max. Ø13 +0.5 -0.2 1.5 min. Ø20.2 min. 8.4 +2.5 8.4 +0.15 Z Z 2:1 Technical drawings according to DIN specification.

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 11 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 12 - 13" Reel, 10 000 Pieces Z ( 2 : 1 ) Y ( 1 : 1 ) Z Y 8.4 - 0 2.5+ 14.4 max. 100 m in. Technical drawings according to DIN specification. Ø 20.2 min. 13Ø - 0.2 0.5+ 1.5 min. 330 m ax. Label unreel direction 8.4 - 0 0.15+ Drawing-No.: 9.800-5140.01-4 Issue: prel. 1; 02.03.2016 Form of the leave open of the wheel is supplier specific.

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 12 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 13 - Taping Drawing-No.: 9.700-5397.01-4 Issue: 1; 19.02.16 technical drawings according to DIN specifications PIN 1 (8) (1.75)(3.5) (2.3) (4)(Ø 1) (Ø 1.5) (4) (2) Reel off direction Y Y (0.25)(2.3) (1.25) Y - Y

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 13 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RECOMMENDED INFRARED REFLOW Soldering conditions which are based on J-STD-020 C Recommend Normal Solder Reflow is 235 °C to 255 °C Fig. 14 - VEML3235SL Solder Reflow Profile Chart RECOMMENDED STORAGE AND REBAKING CONDITIONS PARAMETER CONDITIONS MIN. MAX. UNIT Storage temperature 5 50 °C Relative humidity - 60 % Open time - 168 h Total time From the date code on the aluminized envelope (unopened) - 12 months Rebaking Tape and reel: 60 °C - 22 h Tube: 60 °C - 22 h IR REFLOW PROFILE CONDITION PARAMETER CONDITIONS TEMPERATURE TIME Peak temperature 255 °C + 0 °C / - 5 °C (max.: 260 °C) 10 s Preheat temperature range and timing 150 °C to 200 °C 60 s to 180 s Timing within 5 °C to peak temperature - 10 s to 30 s Timing maintained above temperature / time 217 °C 60 s to 150 s Timing from 25 °C to peak temperature - 8 min (max.) Ramp-up rate 3 °C/s (max.) - Ramp-down rate 6 °C/s (max.) - 200 150 217 255 Temperature (°C) Time (s)t2t1 Max. Temperature Ramp-Up Rate 3 °C/s (max.) Soldering Zone 60 s to 150 s Ramp-Up Rate 3 °C/s (max.) Pre-Heating Time t2 - t1 = 60 s to 180 s Ramp-Down Rate 6 °C/s (max.)

www.vishay.com Vishay Semiconductors Rev. 1.1, 22-Feb-2021 14 Document Number: 80131 For technical questions, contact: sensorstechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DRYPACK Devices are packed in mois ture barrier bags (MBB) to prevent the products from mo isture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: T amb < 30 °C, RH < 60 % Moisture sensitivity level 3, according to J-STD-020. DRYING In case of moisture absorpt ion devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions

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