VEMD2503X01_V01 VISHAY | Alldatasheet
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VEMD2503X01, VEMD2523X01 www.vishay.com Vishay Semiconductors Rev. 1.0, 05-Apr-13 1 Document Number: 84163 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Silicon PIN Photodiode
DESCRIPTION
VEMD2503X01 and VEMD2523X01 are high speed and high sensitive PIN photodiodes in a miniature surface mount package (SMD) with dome lens. The clear epoxy allows light detection of a wide wavelength range from 350 nm to 1120 nm. The photo sensitive area of the chip is 0.23 mm
FEATURES
- Package type: surface mount
- Package form: GW, RGW
- Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.55
- AEC-Q101 qualified
- High radiant sensitivity
- Suitable for visible and neat infrared radiation
- Fast response times
- Angle of half sensitivity: = ± 35°
- Package matched with IR emitter series VSMB2943X01
- Floor life: 4 weeks, MSL 2a, acc. J-STD-020
- Lead (Pb)-free reflow soldering
- Material categorization: For definitions of compliance please see www.vishay.com/doc?99912
APPLICATIONS
- High speed photo detector
- L i g h t c u r t a i n
- Detector for optical switch Note
- Test conditions see table “Basic Characteristics” Note
- MOQ: minimum order quantity VEMD2503X01 VEMD2523X01 PRODUCT SUMMARY COMPONENT Ira (μA) (deg) 0.1 (nm) VEMD2503X01 10 ± 35 350 to 1120 VEMD2523X01 10 ± 35 350 to 1120
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM VEMD2503X01 Tape and reel MOQ: 6000 pc s, 6000 pcs/reel Re verse gullwing VEMD2523X01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V R 60 V Power dissipation T amb 25 °C P V 215 mW Junction temperature T j 100 °C Operating temperature range T amb - 40 to + 100 °C Storage temperature range T stg - 40 to + 100 °C Soldering temperature Acc. reflow solder profile fig. 7 T sd 260 °C Thermal resistance junction/ambient Acc. J-STD-051 R thJA 250 K/W
VEMD2503X01, VEMD2523X01 www.vishay.com Vishay Semiconductors Rev. 1.0, 05-Apr-13 2 Document Number: 84163 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Fig. 1 - Reverse Dark Current vs. Ambient Temperature Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature Fig. 3 - Reverse Light Current vs. Irradiance Fig. 4 - Diode Capacitance vs. Reverse Voltage BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Forward voltage I F = 50 mA V F 1V Breakdown voltage I R = 100 μA, E = 0 V (BR) 32 V Reverse dark current V R = 10 V, E = 0 I ro 11 0 n A Diode capacitance VR = 0 V, f = 1 MHz, E = 0 C D 4p F VR = 5 V, f = 1 MHz, E = 0 C D 1.3 pF Open circuit voltage E e = 1 mW/cm2, = 950 nm V o 350 mV Temperature coefficient of Vo Ee = 1 mW/cm2, = 950 nm TK Vo - 2.6 mV/K Short circuit current E e = 1 mW/cm2, = 950 nm I k 10 μA Temperature coefficient of Ik Ee = 1 mW/cm2, = 950 nm TK Ik 0.1 %/K Reverse light current E e = 1 mW/cm2, = 950 nm, VR = 5 V I ra 71 0 1 4 μ A Angle of half sensitivity ± 35 deg Wavelength of peak sensitivity p 900 nm Range of spectral bandwidth 0.1 350 to 1120 nm Rise time V R = 10 V, RL = 1 k, = 820 nm t r 100 ns Fall time V R = 10 V, RL = 1 k, = 820 nm t f 100 ns 100 1000 Iro - Reverse Dark Current (nA) Tamb - Ambient Temperature (°C)94 8427 VR = 10 V 100806040 0.6 0.8 1.0 1.2 1.4 Ira, rel - Relative Reverse Light Current Tamb - Ambient Temperature (°C)94 8416 VR = 5 V λ = 950 nm 0 10080604020 0.1 100 0.01 Ira - Reverse Light Current (µA) Ee - Irradiance (mW/cm2) VR = 5 V 1010.1 0.1 CD - Diode Capacitance (pF) VR- Reverse Voltage (V)94 8430 E = 0 f = 1 MHz 100101
VEMD2503X01, VEMD2523X01 www.vishay.com Vishay Semiconductors Rev. 1.0, 05-Apr-13 3 Document Number: 84163 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 5 - Relative Spectral Sensitivity vs. Wavelength Fig. 6 - Relative Radiant Intensity vs. Angular Displacement REFLOW SOLDER PROFILE Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D DRYPACK Devices are packed in moistu re barrier bags (MBB) to prevent the products from mo isture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: T amb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. DRYING In case of moisture absorpt ion devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry us ing recommended conditions 0.2 0.4 0.6 0.8 1.0 1.2 400 500 600 700 800 900 1000 1100 21553 λ - Wavelength (nm) S ( λ)rel - Relative Spectral Sensitivity 0.4 0.2 00.6 0.9 0.8 0° 30° 10° 20° 40° 50° 60° 70° 80° 0.7 1.0 Srel - Relative Radiant Sensitivity ϕ - Angular Displacement 100 150 200 250 300 0 50 100 150 200 250 300 Time (s) Temperature (°C) 240 °C 245 °C max. 260 °C max. 120 s max. 100 s 217 °C max. 30 s max. ramp up 3 °C/s max. ramp down 6 °C/s 19841 255 °C
VEMD2503X01, VEMD2523X01 www.vishay.com Vishay Semiconductors Rev. 1.0, 05-Apr-13 4 Document Number: 84163 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE DIMENSIONS in millimeters: VEMD2503
VEMD2503X01, VEMD2523X01 www.vishay.com Vishay Semiconductors Rev. 1.0, 05-Apr-13 5 Document Number: 84163 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE DIMENSIONS in millimeters: VEMD2523
VEMD2503X01, VEMD2523X01 www.vishay.com Vishay Semiconductors Rev. 1.0, 05-Apr-13 6 Document Number: 84163 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TAPING AND REEL DIMENSIONS in millimeters: VEMD2503
VEMD2503X01, VEMD2523X01 www.vishay.com Vishay Semiconductors Rev. 1.0, 05-Apr-13 7 Document Number: 84163 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TAPING AND REEL DIMENSIONS in millimeters: VEMD2523
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