VCA2615PFBT

VCA2615 TI | Alldatasheet

Document overview

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Technical content

FEATURES

/C0068VERY LOW NOISE: 0.7nV/ /C0047H z /C0068LOW-NOISE PREAMP (LNP) − Active Termination − Programmable Gains: 3, 12, 18, 22dB − Programmable Input Impedance (R − Buffered, Differential Outputs for CW Processing − Excellent Input Signal Handling Capabilities /C0068LOW-NOISE VARIABLE-GAIN AMPLIFIER − High/Low-Mode (0/+6dB) − 52dB Gain Control Range − Linear Control Response: 22dB/V − Switchable Differential Inputs − Adjustable Output Clipping-Level /C0068BANDWIDTH: 42MHz /C0068HARMONIC DISTORTION: −55dB /C00685V SINGLE SUPPLY /C0068LOW-POWER: 154mW/Channel /C0068POWER-DOWN MODES

APPLICATIONS

/C0068MEDICAL AND INDUSTRIAL ULTRASOUND SYSTEMS − Suitable for 10-Bit and 12-Bit Systems /C0068TEST EQUIPMENT

DESCRIPTION

The VCA2615 is a dual-channel, variable gain amplifier consisting of a Low-Noise Preamplifier (LNP) and a Variable- Gain Amplifier (VGA). This combination along with the device features makes it well-suited for a variety of ultrasound systems. The LNP offers a high level of flexibility to adapt to a wide range of systems and probes. The LNP gain can be programmed to one of four settings (3dB, 12dB, 18dB, 22dB), while maintaining excellent noise and signal handling characteristics. The input impedance of the LNP can be controlled by selecting one of the built-in feedback resistors. This active termination allows the user to closely match the LNP to a given source impedance, resulting in optimized overall system noise performance. The differential LNP outputs are provided either as buffered outputs for further CW processing, or fed directly into the variable-gain amplifier (VGA). Alternatively, an external signal can be applied to the differential VGA inputs through a programmable switch. Following a linear-in-dB response, the gain of the VGA can be varied over a 52dB range with a 0.2V to 2.5V control voltage common to both channels of the VCA2615. In addition, the overall gain can be switched between a 0dB and +6dB postgain, allowing the user to optimize the output swing of VCA2615 for a variety of high-speed Analog-to-Digital Converters (ADCs). As a means to improve system overload recovery time, the VCA2615 provides an internal clipping function where an externally applied voltage sets the desired clipping level. The VCA2615 operates on a single +5V supply and is available in a small QFN-48 (7x7mm) or TQFP package. MUX 52dB Range Feedback Resistors (3, 12, 18, 22dB) LNP 1/2 VCA2615 LNP IN+ LNP OUT −FB1 FB2 FB3 FB4 LNP OUT + VCA IN+ VCA IN− H/L (0dB or +6dB) G1 G1 VCNTL VCLMPVCA INSEL LNP IN− VCA OUT + VCA OUT − VGA VCA2615 SBOS316D − JULY 2005 − REVISED OCTOBER 2008 Dual, Low-Noise Variable-Gain Amplifier with Preamp www.ti.com Copyright  2005−2008, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 All trademarks are the property of their respective owners.

/C0086/C0067/C0065/C0050/C0054/C0049/C0053 SBOS316D − JULY 2005 − REVISED OCTOBER 2008 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (1)Stresses above those listed under Absolute Maximum Ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may affect device reliability. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY QFN-48 RGZ −40°C to +85°C VCA2615 VCA2615RGZR Tape and Reel, 2500 VCA2615 QFN-48 RGZ −40°C to +85°C VCA2615 VCA2615RGZT Tape and Reel, 250 VCA2615 TQFP-48 PFB −40°C to +85°C VCA2615 VCA2615PFBR Tape and Reel, 1000 TQFP-48 PFB −40°C to +85°C VCA2615 VCA2615PFBT Tape and Reel, 250 (1)For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. FUNCTIONAL BLOCK DIAGRAM INPUT B Feedback Network Gain Control Logic LNP OUT −B VCA IN−B LNP OUT +B LN P VCA IN+B H/ LV CLMP V CNTL VCA OUT +B VCA OUT −B VCA OUT +A VCA OUT −A VCA INSEL C EXT B2 C EXT B1 C EXT A2 C EXT A1 VGA INPUT A FB1 FB2 FB3 FB4 Feedback Network Gain Control Logic LNP OUT −A VCA IN−A LN P Buffer Buffer VCA IN+ALNP OUT +A VGA Buffer Buffer

/C0086/C0067/C0065/C0050/C0054/C0049/C0053 SBOS316D − JULY 2005 − REVISED OCTOBER 2008 www.ti.com

ELECTRICAL CHARACTERISTICS

All specifications at TA = +25°C, VDD = 5V, load resistance = 500Ω on each output to ground; the input to the preamp (LNP) is single-ended; fIN = 5MHz, LNP Gain (G1, G2) = 10, H/L = 0, VCNTL = 2.5V; VCA output is 1VPP differential; CA, CB = 3.9µF, unless otherwise noted. VCA2615 PARAMETER CONDITIONS MIN TYP MAX UNIT PREAMPLIFIER (LNP and Buffer) Input Resistance, RIN With Active Feedback Termination See Note(1) kΩ Input Resistance Feedback Termination Open 100 kΩ Input Capacitance 45 pF Maximum Input Voltage LNP Gain (G1, G2) = 00 − Linear Operation(2) 2.3 VPP LNP Gain (G1, G2) = 01 − Linear Operation(2) 0.78 VPP LNP Gain (G1, G2) = 10 − Linear Operation(2) 0.39 VPP LNP Gain (G1, G2) = 11 − Linear Operation(2) 0.23 VPP Maximum Input Voltage Any LNP Gain − Overload (symmetrical clipping) 5 VPP Input Voltage Noise R S = 0Ω; Includes Buffer Noise, LNP Gain = 11 0.8 nV/√Hz Input Current Noise 1 pA/√Hz Bandwidth 50 MHz 2nd-Harmonic Distortion fIN = 5MHz −55 dBc 3rd-Harmonic Distortion fIN = 5MHz −55 dBc LNP Gain Change Response Time LNP Gain 00 to 11; to 90% Signal Level 0.1 µs BUFFER (LNP OUT+ A/B, LNPOUT− A/B) Output Signal Range(2) R L > = 500Ω 3.3 VPP Output Common-Mode Voltage 1.85 V Output Short-Circuit Current 60 mA Output Impedance 3 Ω ACTIVE TERMINATION Feedback Resistance(3), RF FB (1-4) = 0111 1500 Ω FB (1-4) = 1011 1000 Ω FB (1-4) = 1101 500 Ω FB (1-4) = 1110 250 Ω FB (1-4) = 0000 130 Ω VARIABLE-GAIN AMPLIFIER (VGA) Peak Input Voltage Linear Operation(2), VCNTL = 0.7V 2 VPP Upper −3dB Bandwidth 50 MHz 2nd-Harmonic Distortion VCNTL = 2.5V, 1VPP Differential Output −60 dBc 3rd-Harmonic Distortion VCNTL = 2.5V, 1VPP Differential Output −63 dBc Slew-Rate ±100 V/µs PREAMPLIFIER AND VARIABLE-GAIN AMPLIFIER (LNP AND VGA) Input Voltage Noise 0.7 nV/√Hz Clipping Voltage Range (VCLMP ) 0.25 to 2.6 V Clipping Voltage Variation VCLMP = 0.5V, VCAOUT = 1.0VPP ±50 mV Output Impedance fIN = 5MHz, Single-Ended, Either Output 3 Ω Output Short-Circuit Current 60 mA Overload Distortion (2nd-Harmonic) VIN = 250mVPP −44 dBc Crosstalk fIN = 5MHz −70 dBc Delay Matching ±1 ns Overload Recovery Time 25 ns Maximum Output Load 100 Ω Maximum Capacitive Output Loading 50Ω in Series 80 pF Maximum Output Signal(2) 6 VPP Output Common-Mode Voltage 2.5 V 2nd-Harmonic Distortion Input Signal = 5MHz, VCNTL = 1V −45 −55 dB 3rd-Harmonic Distortion Input Signal = 5MHz, VCNTL = 1V −45 −55 dB Upper −3dB Bandwidth VCNTL = 2.5V 42 MHz (1) R IN /C0043R F (1/C0041 ALNP 2 ) (2)2nd−harmonic, 3rd-harmonic distortion less than or equal to −30dBc. (3)See Table 5. (4)Referred to best-fit dB linear curve. (5)Parameters ensured by design; not production tested. (6)Do not leave inputs floating; no internal pull-up/pull-down resistors.

/C0086/C0067/C0065/C0050/C0054/C0049/C0053 SBOS316D − JULY 2005 − REVISED OCTOBER 2008 www.ti.com ELECTRICAL CHARACTERISTICS (continued) All specifications at TA = +25°C, VDD = 5V, load resistance = 500Ω on each output to ground; the input to the preamp (LNP) is single-ended; fIN = 5MHz, LNP Gain (G1, G2) = 10, H/L = 0, VCNTL = 2.5V; VCA output is 1VPP differential; CA, CB = 3.9µF, unless otherwise noted. PARAMETER UNIT VCA2615 CONDITIONSPARAMETER UNITMAXTYPMINCONDITIONS ACCURACY Gain Slope VCNTL = 0.4V to 2.0V 22 dB/V Gain Range VCNTL = 0.2V to 2.5V 52 dB Gain Range VCNTL = 0.4V to 2.0V 36.5 dB Gain Range (H/L) H /L = 0 (+6dB); VGA High Gain; VCNTL = 0.2V to 2.5V −12 to +40 dB H /L = 1 (0dB); VGA Low Gain; VCNTL = 0.2V to 2.5V −18 to +34 dB Output Offset Voltage, Differential ±50 mV Channel-to-Channel Gain Matching VCNTL = 0.4V to 2.0V, CHA to CHB ±0.33 dB GAIN CONTROL INTERFACE (VCNTL ) Input Voltage Range 0.2 to 2.5 V Input Resistance Response Time

1 M ΩInput Resistance

Response Time VCNTL = 0.2V to 2V; to 90% Signal Level 0.6 µs DIGITAL INPUTS(5), (6) (G1, G2, PDL, PDV, H/L, FB1-FB4, VCAINSEL) VIH, High-Level Input Voltage 2.0 V VIL, Low-Level Input Voltage 0.8 V Input Resistance 1 M Ω Input Capacitance 5 pF POWER SUPPLY Supply Voltage 4.75 5.0 5.25 V Power-Up Response Time 25 µs Power-Down Response Time 2 µs Total Power Dissipation PDV, PDL = 1 308 350 mW VGA Power-Down PDV = 0, PDL = 1 236 mW LNP Power-Down PDL = 0, PDV = 1 95 mW THERMAL CHARACTERISTICS Temperature Range Ambient, Operating −40 +85 °C Thermal Resistance, /C0113JA QFN−48 Soldered Pad; Four-Layer PCB with Thermal Vias 29.1 °C/W /C0113JC 2.2 °C/W /C0113JA TQFP−48 58 °C/W (1) R IN /C0043R F (1/C0041 ALNP 2 ) (2)2nd−harmonic, 3rd-harmonic distortion less than or equal to −30dBc. (3)See Table 5. (4)Referred to best-fit dB linear curve. (5)Parameters ensured by design; not production tested. (6)Do not leave inputs floating; no internal pull-up/pull-down resistors.

/C0086/C0067/C0065/C0050/C0054/C0049/C0053 SBOS316D − JULY 2005 − REVISED OCTOBER 2008 www.ti.com PIN CONFIGURATION V DD A C EXTA1 C EXTA2 VCA IN−A VCA IN+A LNP OUT −A LNP OUT +A NC VB VDDAL GNDAL LNP IN−A V DD B C EXT B1 C EXT B2 VCA IN−B VCA IN+B LNP OUT −B LNP OUT +B NC NC VDDBL GNDBL LNP IN−B VCA2615 (Thermal Pad tied to Ground Potential, QFN only) GNDA VCA OUT −A VCA OUT +A FB4 VCA INSEL V CNTL FB3 FB2 FB1 VCA OUT +B VCA OUT −B GNDB V DD A LNP IN+A V DD R V CLMP VCM GNDR LNP IN+B PDL PDV H/L PIN CONFIGURATION PIN DESIGNATOR DESCRIPTION PIN DESIGNATOR DESCRIPTION

1 VDD A Channel A + Supply 25 LNP IN−B Channel B LNP Inverting Input

2 C EXT A1 External Capacitor 26 GNDBL GND B Channel LNP

3 C EXT A2 External Capacitor 27 VDDBL VDD B Channel LNP

4 VCA IN−A Channel A VCA Negative Input 28 NC Do Not Connect

5 VCA IN+A Channel A VCA Positive Input 29 NC Do Not Connect

6 LNP OUT −A Channel A LNP Negative Output 30 LNP OUT +B Channel B LNP Positive Output

7 LNP OUT +A Channel A LNP Positive Output 31 LNP OUT −B Channel B LNP Negative Output

8 NC Do Not Connect 32 VCA IN+B Channel B VCA Positive Input

9 VB 0.01µF Bypass 33 VCA IN−B Channel B VCA Negative Input

10 VDDAL VDD A Channel LNP 34 C EXT B2 External Capacitor

11 GNDAL GND A Channel LNP 35 C EXT B1 External Capacitor

12 LNP IN−A Channel A LNP Inverting Input 36 VDD B Channel B + Supply

13 G1 LNP Gain Setting Pin (MSB) 37 GNDB Channel B Ground

14 G2 LNP Gain Setting Pin (LSB) 38 VCA OUT −B Channel B VCA Negative Output

15 VDD A Supply Pin for Gain Setting 39 VCA OUT +B Channel B VCA Positive Output

16 LNP IN+A Channel A LNP Noninverting Input 40 FB1 Feedback Control Pin

17 VDD R Supply for Internal Reference 41 FB2 Feedback Control Pin

18 VCLMP VCA Clamp Voltage Setting Pin 42 FB3 Feedback Control Pin

19 VCM 0.1µF Bypass 43 VCNTL VCA Control Voltage Input

20 GNDR Ground for Internal Reference 44 VCA INSEL VCA Input Select, Hi = External

21 LNP IN+B Channel B LNP Noninverting Input 45 FB4 Feedback Control Pin

22 PDL Power Down LNPs 46 VCA OUT +A Channel A VCA Positive Pin

23 PDV Power Down VCAs 47 VCA OUT −A Channel A VCA Negative Pin

24 H /L VCA High/Low Gain Mode 48 GNDA Channel A Ground

Table 1. Gain and Noise Performance of Various given by the graph shown in Figure 48. selection bits, G1 and G2, and the corresponding gain. Table 2. Gain Selection of LNP Figure 55. Programmable LNP

either a 10-bit or 12-bit analog-to-digital converter (ADC). Figure 63. Block Diagram of VCA

SBOS316D − JULY 2005 − REVISED OCTOBER 2008 www.ti.com

Revision History

DATE REV PAGE SECTION DESCRIPTION

1 Features Deleted SMALL QFN−48 PACKAGE (7x7mm)

1 Description Text added to last paragraph. 10/08 D 2 Package/Ordering Added TQFP−48 package information. 4 Electrical CharacteristicsThermal Characteristics section; added text.

1 Features Changed 20dB/V to 22dB/V under LOW-NOISE VARIABLE-GAIN AMPLIFIER

3 Electrical CharacteristicsAdded CA, CB = 3.9µF to the overall conditions. 8/05 C 4 Electrical Characteristics Accuracy section; moved Gain Slope line under accurary, added “VCNTL = 0.4V to 2.0V” to conditions, and changed typical value from 20dBv to 22dB/V. Thermal Characteristics section; removed “Specified” and added “Operating” to conditions. 5 Pin Configuration Pin 19 description; changed 0.01µF to 0.1µF. 22 Programmable Clipping Reworded paragraph three to clarify description of setting VCA clipping level. NOTE : Page numbers for previous revisions may differ from page numbers in the current version.

www.ti.com 7-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) VCA2615PFBR Active Production TQFP (PFB) | 48 1000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 VCA2615 VCA2615PFBR.B Active Production TQFP (PFB) | 48 1000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 VCA2615 VCA2615PFBRG4 Active Production TQFP (PFB) | 48 1000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 VCA2615 VCA2615PFBRG4.B Active Production TQFP (PFB) | 48 1000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 VCA2615 VCA2615RGZR Active Production VQFN (RGZ) | 48 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 VCA 2615 VCA2615RGZR.B Active Production VQFN (RGZ) | 48 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 VCA 2615 VCA2615RGZRG4 Active Production VQFN (RGZ) | 48 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 VCA 2615 VCA2615RGZRG4.B Active Production VQFN (RGZ) | 48 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 VCA 2615 VCA2615RGZT Active Production VQFN (RGZ) | 48 250 | SMALL T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 VCA 2615 VCA2615RGZT.B Active Production VQFN (RGZ) | 48 250 | SMALL T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 VCA 2615 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Addendum-Page 1

www.ti.com 7-Oct-2025 Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 25-Jul-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 25-Jul-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) VCA2615PFBR TQFP PFB 48 1000 350.0 350.0 43.0 VCA2615PFBRG4 TQFP PFB 48 1000 350.0 350.0 43.0 VCA2615RGZR VQFN RGZ 48 2500 353.0 353.0 32.0 VCA2615RGZRG4 VQFN RGZ 48 2500 353.0 353.0 32.0 VCA2615RGZT VQFN RGZ 48 250 213.0 191.0 35.0 Pack Materials-Page 2

www.ti.com GENERIC PACKAGE VIEW Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. VQFN - 1 mm max heightRGZ 48 PLASTIC QUADFLAT PACK- NO LEAD7 x 7, 0.5 mm pitch 4224671/A

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. PACKAGE OUTLINE 4219044/D 02/2022 www.ti.com VQFN - 1 mm max height PLASTIC QUADFLAT PACK- NO LEAD RGZ0048A A 0.08 C

0.1 C A B

0.05 C B SYMM SYMM PIN 1 INDEX AREA 7.1 6.9 7.1 6.9

1 MAX

0.05 0.00 SEATING PLANE C 5.15±0.1 2X 5.5 5.5 44X 0.5 48X 0.5 0.3 48X 0.30 0.18PIN1 ID (OPTIONAL) (0.2) TYP 13 24 3748 (0.1) TYP SIDE WALL DETAIL OPTIONAL METAL THICKNESS SEE SIDE WALL DETAIL CHAMFERED LEAD CORNER LEAD OPTION (0.45) TYP SEE LEAD OPTION

NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. EXAMPLE BOARD LAYOUT 4219044/D 02/2022 www.ti.com VQFN - 1 mm max heightRGZ0048A PLASTIC QUADFLAT PACK- NO LEAD SYMM SYMM LAND PATTERN EXAMPLE SCALE: 15X ( 5.15) 2X (6.8) (6.8) 48X (0.6) 48X (0.24) 44X (0.5) 2X (5.5) (5.5) 21X (Ø0.2) VIA TYP (R0.05) TYP NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED METAL SOLDER MASK OPENING EXPOSED METAL SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL

0.07 MAX

0.07 MIN

(1.26) (1.065) 13 24 3748

NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. EXAMPLE STENCIL DESIGN 4219044/D 02/2022 www.ti.com VQFN - 1 mm max heightRGZ0048A PLASTIC QUADFLAT PACK- NO LEAD SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 67% PRINTED COVERAGE BY AREA SCALE: 15X SYMM SYMM ( 1.06) 2X (6.8) (6.8) 48X (0.6) 48X (0.24) 44X (0.5) 2X (5.5) (5.5) (R0.05) TYP (0.63) 2X (0.63) 2X (1.26) (1.26) 13 24 3748

www.ti.com PACKAGE OUTLINE C 48X 0.27 0.1744X 0.5 PIN 1 ID (0.13) TYP

0.05 MIN0 -7

4X 5.5 9.2

8.8 TYP

0.75 0.45 B7.2 6.8 NOTE 3 A 7.2 6.8 NOTE 3 0.25 GAGE PLANE

1.2 MAX

(1) PLASTIC QUAD FLATPACK TQFP - 1.2 mm max heightPFB0048A PLASTIC QUAD FLATPACK 4215157/A 03/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration MS-026. 13 24 3748

0.08 C A B

0.08 A 16 DETAIL A TYPICAL SCALE 1.900

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

(8.5) (8.5) 44X (0.5) 48X (1.35) 48X (0.25) (R0.05) TYP TQFP - 1.2 mm max heightPFB0048A PLASTIC QUAD FLATPACK 4215157/A 03/2024 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM SYMM 48 37 13 24 SEE DETAILS METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN 44X (0.5) 48X (1.35) 48X (0.25) (R0.05) TYP (8.5) (8.5) TQFP - 1.2 mm max heightPFB0048A PLASTIC QUAD FLATPACK 4215157/A 03/2024 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE SCALE:8X SYMM SYMM 48 37 13 24

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