VC244A

SN74ALVC16244A TI | Alldatasheet

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(TOP VIEW) 1OE 1Y1 1Y2 GND 1Y3 1Y4 V CC 2Y1 2Y2 GND 2Y3 2Y4 3Y1 3Y2 GND 3Y3 3Y4 V CC 4Y1 4Y2 GND 4Y3 4Y4 4OE 2OE 1A1 1A2 GND 1A3 1A4 V CC 2A1 2A2 GND 2A3 2A4 3A1 3A2 GND 3A3 3A4 V CC 4A1 4A2 GND 4A3 4A4 3OE SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS250O JANUARY 1993 REVISED OCTOBER 2005 Member of the Texas Instruments Widebus Family Operates From 1.65 V to 3.6 V Max t pd of ns at 3.3 V 24-mA Output Drive at 3.3 V Latch-Up Performance Exceeds 250 mA Per JESD ESD Protection Exceeds JESD 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101) This 16-bit buffer/driver is designed for 1.65-V to 3.6-V V CC operation. The SN74ALVC16244A is designed specifically to improve the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable OE inputs. To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING FBGA GRD SN74ALVC16244AGRDR Tape and reel VC244A FBGA ZRD (Pb-free) SN74ALVC16244AZRDR Tube SN74ALVC16244ADL SSOP DL ALVC16244A Tape and reel SN74ALVC16244ADLR C to C SN74ALVC16244ADGGR TSSOP DGG Tape and reel ALVC16244A SN74ALVC16244ADGGRE4 VFBGA GQL SN74ALVC16244AGQLR Tape and reel VC244A VFBGA ZQL (Pb-free) SN74ALVC16244AZQLR (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical

applications

sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright 1993 2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com GQL OR ZQL PACKAGE (TOP VIEW) J H G F E D C B A 21 3 4 65 K ABC GRD OR ZRD PACKAGE (TOP VIEW) J H G F E D C B A 21 3 4 65 SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS250O JANUARY 1993 REVISED OCTOBER 2005 TERMINAL ASSIGNMENTS (1) (56-Ball GQL/ZQL Package) A OE NC NC NC NC OE B 1Y2 1Y1 GND GND 1A1 1A2 C 1Y4 1Y3 V CC V CC 1A3 1A4 D 2Y2 2Y1 GND GND 2A1 2A2 E 2Y4 2Y3 2A3 2A4 F 3Y1 3Y2 3A2 3A1 G 3Y3 3Y4 GND GND 3A4 3A3 H 4Y1 4Y2 V CC V CC 4A2 4A1 J 4Y3 4Y4 GND GND 4A4 4A3 K OE NC NC NC NC OE ABC (1) NC No internal connection TERMINAL ASSIGNMENTS (1) (54-Ball GRD/ZRD Package) A 1Y1 NC OE OE NC 1A1 B 1Y3 1Y2 NC NC 1A2 1A3 C 2Y1 1Y4 V CC V CC 1A4 2A1 D 2Y3 2Y2 GND GND 2A2 2A3 E 3Y1 2Y4 GND GND 2A4 3A1 F 3Y3 3Y2 GND GND 3A2 3A3 G 4Y1 3Y4 V CC V CC 3A4 4A1 H 4Y3 4Y2 NC NC 4A2 4A3 J 4Y4 NC OE OE NC 4A4 (1) NC No internal connection xxxxx FUNCTION TABLE (EACH 4-BIT BUFFER) INPUTS OUTPUT Y OE A L H H L L L H X Z

www.ti.com 1OE 1A1 1A2 1A3 1A4 1Y1 1Y2 1Y3 1Y4 2OE 2A1 2A2 2A3 2A4 2Y1 2Y2 2Y3 2Y4 3OE 3A1 3A2 3A3 3A4 3Y1 3Y2 3Y3 3Y4 4OE 4A1 4A2 4A3 4A4 4Y1 4Y2 4Y3 4Y4 Pin numbers shown are for the DGG and DL packages. Absolute Maximum Ratings (1) SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS250O JANUARY 1993 REVISED OCTOBER 2005 LOGIC DIAGRAM (POSITIVE LOGIC) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range 0.5 4.6 V V I Input voltage range (2) Control Inputs (3) 0.5 V CC 0.5 V Data Inputs -0.5 4.6 V O Output voltage range (2) (3) 0.5 V CC 0.5 V I IK Input clamp current V I mA I OK Output clamp current V O mA I O Continuous output current mA Continuous current through each V CC or GND 100 mA DGG package DL package θ JA Package thermal impedance (4) C/W GQL/ZQL package GRD/ZRD package T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) This value is limited to 4.6 V maximum. (4) The package thermal impedance is calculated in accordance with JESD 51-7.

www.ti.com Recommended Operating Conditions (1) Electrical Characteristics SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS250O JANUARY 1993 REVISED OCTOBER 2005 MIN MAX UNIT V CC Supply voltage 1.65 3.6 V V CC 1.65 V to 1.95 V 0.65 V CC V IH High-level input voltage V CC 2.3 V to 2.7 V 1.7 V V CC 2.7 V to 3.6 V V CC 1.65 V to 1.95 V 0.35 V CC V IL Low-level input voltage V CC 2.3 V to 2.7 V 0.7 V V CC 2.7 V to 3.6 V 0.8 Control Inputs V CC V I Input voltage V Data Inputs 3.6 V O Output voltage V CC V V CC 1.65 V V CC 2.3 V I OH High-level output current mA V CC 2.7 V V CC V V CC 1.65 V V CC 2.3 V I OL Low-level output current mA V CC 2.7 V V CC V Δ Δ v Input transition rise or fall rate ns/V T A Operating free-air temperature C (1) All unused inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs literature number SCBA004. over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS V CC MIN TYP (1) MAX UNIT I OH 100 µ A 1.65 V to 3.6 V V CC 0.2 I OH mA 1.65 V 1.2 I OH mA 2.3 V V OH 2.3 V 1.7 V I OH mA 2.7 V 2.2 V 2.4 I OH mA V I OL 100 µ A 1.65 V to 3.6 V 0.2 I OL mA 1.65 V 0.45 I OL mA 2.3 V 0.4 V OL V 2.3 V 0.7 I OL mA 2.7 V 0.4 I OL mA V 0.55 I I V I V CC or GND 3.6 V µ A I OZ V O V CC or GND 3.6 V µ A I CC V I V CC or GND, I O 3.6 V µ A Other inputs at V CC or Δ I CC One input at V CC 0.6 V to 3.6 V 750 µ A GND Control inputs C i V I V CC or GND 3.3 V pF Data inputs (1) All typical values are at V CC 3.3 T A

www.ti.com Switching Characteristics Operating Characteristics SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS250O JANUARY 1993 REVISED OCTOBER 2005 Electrical Characteristics (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS V CC MIN TYP (1) MAX UNIT C o Outputs V O V CC or GND 3.3 V pF over recommended operating free-air temperature range (unless otherwise noted) (see Figure V CC 2.5 V V CC 3.3 V V CC 1.8 V V CC 2.7 V FROM TO 0.2 V 0.3 V PARAMETER UNIT (INPUT) (OUTPUT) TYP MIN MAX MIN MAX MIN MAX t pd A Y (1) 3.7 3.6 ns t en OE Y (1) 5.7 5.4 4.4 ns t dis OE Y (1) 5.2 4.6 4.1 ns (1) This information was not available at the time of publication. T A C V CC 1.8 V V CC 2.5 V V CC 3.3 V TEST PARAMETER UNIT CONDITIONS TYP TYP TYP Outputs enabled (1) Power dissipation C pd C L pF, f MHz pF capacitance Outputs disabled (1) (1) This information was not available at the time of publication.

www.ti.com PARAMETER MEASUREMENT INFORMATION VM VM VMVM VMVM VMVM VOH VOL thtsu From Output Under Test CL (see Note A) LOAD CIRCUIT S1 Open GND RL RL Output Control (low-level enabling) Output Waveform 1 S1 at VLOAD (see Note B) Output Waveform 2 S1 at GND (see Note B) tPZL tPZH tPLZ tPHZ 0 V VOL + VΔ VOH − VΔ 0 V VI 0 V 0 V tw VI VI VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES Timing Input Data Input Input tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND TEST S1 NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ /char????????10 MHz, ZO = 50 Ω . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. 0 V VI VM tPHL VM VM VI 0 V VOH VOL Input Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM VM tPLH VLOAD VLOAD/2 1.8 V 2.7 V 1 kΩ 500 Ω 500 Ω 500 Ω VCC RL 2 × VCC 6 V 6 V VLOAD CL 30 pF 30 pF 50 pF 50 pF 0.15 V 0.15 V 0.3 V 0.3 V VΔ VCC VCC 2.7 V 2.7 V VI VCC/2 VCC/2 1.5 V 1.5 V VM tr/tf ≤ 2 ns ≤ 2 ns ≤ 2.5 ns ≤ 2.5 ns INPUT SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS250O JANUARY 1993 REVISED OCTOBER 2005 Figure Load Circuit and Voltage Waveforms

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 74ALVC16244ADGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVC16244ADLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244ADL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244ADLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244ADLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244AGQLR ACTIVE BGA MI CROSTA R JUNI OR GQL 56 1000 TBD SNPB Level-1-240C-UNLIM SN74ALVC16244AGRDR ACTIVE BGA MI CROSTA R JUNI OR GRD 54 1000 TBD SNPB Level-1-240C-UNLIM SN74ALVC16244AZQLR ACTIVE BGA MI CROSTA R JUNI OR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Addendum-Page 1

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Addendum-Page 2

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040048/E 12/01

48 PINS SHOWN

0.730 (18,54) 0.720 (18,29) 4828 0.370 (9,40) (9,65) 0.380 Gage Plane DIM 0.420 (10,67) 0.395 (10,03) A MIN A MAX 0.010 (0,25) PINS ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) Seating Plane 0.020 (0,51) 0.040 (1,02) 0.008 (0,203) 0.0135 (0,343) 0.008 (0,20) MIN A 0.110 (2,79) MAX 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) M0.005 (0,13) 0.025 (0,635) 0°–/C02578° 0.005 (0,13) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97 0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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