V62/03624-08XE

UCC2805-EP TI | Alldatasheet

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UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Controlled Baseline − One Assembly − One Test Site − One Fabrication Site /C0068Extended Temperature Performance of −55°C to 125°C /C0068Enhanced Diminishing Manufacturing Sources (DMS) Support /C0068Enhanced Product Change Notification /C0068Qualification Pedigree† /C0068ESD Protection Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) /C0068100 μA Typical Starting Supply Current /C0068500 μA Typical Operating Supply Current † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. /C0068Operation to 1 MHz /C0068Internal Soft Start /C0068Internal Fault Soft Start /C0068Internal Leading-Edge Blanking of the Current Sense Signal /C00681 Amp Totem-Pole Output /C006870 ns Typical Response from Current-Sense to Gate Drive Output /C00681.5% Tolerance Voltage Reference /C0068Same Pinout as UC3842 and UC3842A

description

The UCC2800/1/2/3/4/5 family of high-speed, low-power integrated circuits contain all of the control and drive components required for off-line and dc-to-dc fixed frequency current-mode switching power supplies with minimal parts count. These devices have the same pin configuration as the UC2842/3/4/5 family and also offer the added features of internal full-cycle soft start and internal leading-edge blanking of the current-sense input. The UCC2800/1/2/3/4/5 family offers choice of maximum duty cycle and critical voltage levels. Lower reference parts such as the UCC2803 and UCC2805 fit best into battery operated systems, while the higher reference and the higher UVLO hysteresis of the UCC2802 and UCC2804 make these ideal choices for use in off-line power supplies. PART NUMBER MAXIMUM DUTY CYCLE REFERENCE VOLTAGE TURN-ON THRESHOLD TURN-OFF THRESHOLD UCC2800 100% 5 V 7.2 V 6.9 V UCC2801 50% 5 V 9.4 V 7.4 V UCC2802 100% 5 V 12.5 V 8.3 V UCC2803 100% 4 V 4.1 V 3.6 V UCC2804 50% 5 V 12.5 V 8.3 V UCC2805 50% 4 V 4.1 V 3.6 V Copyright © 2007, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. /Em Please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. COMP FB CS RC REF VCC OUT GND D PACKAGE (TOP VIEW)

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010

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ORDERING INFORMATION† TA PACKAGE‡ ORDERABLE PART NUMBER TOP-SIDE MARKING UCC2800QDREP 2800EP UCC2801QDREP 2801EP 40°C to 125°C SOP D Tape and reel UCC2802QDREP 2802EP −40°C to 125°C SOP − D Tape and reel UCC2803QDREP 2803EP UCC2804QDREP 2804EP UCC2805QDREP 2805EP UCC2800MDREP 2800EP −55°C to 125°C SOP − D Tape and reel UCC2801MDREP 2801EPp UCC2803MDREP 2803EP † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. block diagram

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Ordering Information

D = Plastic SOIC PRODUCT OPTION 0 through 5 TEMPERATURE RANGE INDICATOR D TAPE and REEL INDICATOR R80 EP ENHANCED PLASTIC INDICATOR UCC280XXD−EP Operating Life Derating Chart 100 1000 100 110 120 130 140 150 160 Years estimated life Wirebond Voiding Fail Mode Continuous Tj (/C0053C) NOTES: A. See datasheet for Absolute Maximum and Minimum Recommended Operating Conditions B. Silicon operating life design Goal is 10 @ 105 °C junction temperature (does not include package interconnect life). C. Enhanced plastic product disclaimer applies.

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010

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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†‡ † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditi ons” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ‡ Unless otherwise indicated, voltages are reference to ground and currents are positive into and negative out of the specified terminals. /C0119In normal operation, V CC is powered through a current limiting resistor. Absolute maximum of 12 V applies when V CC is driven from a low impedance source such that ICC does not exceed 30 mA (which includes gate drive current requirement). electrical characteristics, TA = −40/C0095C to 125/C0095C for Q temp and TA= −55/C0095C to 125/C0095C for M temp, VCC = 10 V (see Note 1), RT = 100 kΩ from REF to RC, CT = 330 pF from RC to GND, 0.1 F capacitor from VCC to GND, 0.1 F capacitor from VREF to GND and TA = TJ (unless otherwise stated) PARAMETER TEST CONDITIONS UCC280XQ, UCC280XM UNITPARAMETER TEST CONDITIONS MIN TYP MAX UNIT Reference Section Output voltage T 25 /C0095C I 02 A UCC2800/01/02/04 4.925 5 5.075 VOutput voltage TJ = 25/C0095C, I = 0.2 mA UCC2803/05 3.94 4 4.06 V Load regulation voltage I = 0.2 mA to 5 mA 10 30 mV TJ = 25/C0095C 1.9 Line regulation voltage VCC = 10 V to clamp TJ = −40/C0095C to 125/C0095C and TJ = −55/C0095C to 125/C0095C 2.5 mV/V Total variation voltage See Note 5 UCC2800/01/02/04 4.88 5 5.1 VTotal variation voltage See Note 5 UCC2803/05 3.9 4 4.08 V Output noise voltage f = 10 Hz to 10 kHz, See Note 7 TJ = 25/C0095C 130 μV Long term stability 1000 hours, See Note 7 TA = 125/C0095C 5 mV Output short-circuit current −5 −35 mA

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics, TA = −40/C0095C to 125/C0095C for Q temp and TA= −55/C0095C to 125/C0095C for M temp, VCC = 10 V (see Note 1), RT = 100 kΩ from REF to RC, CT = 330 pF from RC to GND, 0.1 F capacitor from VCC to GND, 0.1 F capacitor from VREF to GND and TA = TJ (unless otherwise stated) PARAMETER TEST CONDITIONS UCC280XQ, UCC280XM UNITPARAMETER TEST CONDITIONS MIN TYP MAX UNIT Oscillator Section Oscillator frequency See Note 2 UCC2800/01/02/04 40 46 52 kHzOscillator frequency See Note 2 UCC2803/05 26 31 36 kHz Temperature stability See Note 7 2.5% Amplitude peak-to-peak 2.25 2.4 2.55 V Oscillator peak voltage 2.45 V Error Amplifier Section Input voltage COMP = 2.5 V UCC2800/01/02/04 2.44 2.5 2.56 VInput voltage COMP = 2 V UCC2803/05 1.95 2 2.05 V Input bias current −1 1 μA Open loop voltage gain 60 80 db COMP sink current FB = 2.7 V, COMP = 1.1 V 0.3 3.5 mA Gain bandwidth product See Note 7 2 MHz PWM Section Maximum duty cycle UCC2800/02/03 97% 99% 100% Maximum duty cycle UCC2801/04/05 48% 49% 50% Minimum duty cycle COMP = 0 V 0 Current Sense Section Gain See Note 3 1.1 1.65 1.8 V/V Maximum input signal COMP = 5 V, See Note 4 0.9 1 1.1 V Input bias current −200 200 nA CS blank time 50 100 150 ns Overcurrent threshold voltage 1.42 1.55 1.68 V COMP to CS offset voltage CS = 0 V 0.45 0.9 1.35 V Output Section (OUT) IOUT = 20 mA All parts 0.1 0.4 Low level output voltage IOUT = 200 mA All parts 0.35 0.9 VLow-level output voltage IOUT = 50 mA, VCC = 5 V UCC2803/05 0.15 0.4 V IOUT = 20 mA, VCC = 0 V All parts 0.7 1.2 IOUT = −20 mA All parts 0.15 0.4 High-level output voltage VSAT (VCC − OUT) IOUT = −200 mA All parts 1 1.9 VHigh level output voltage VSAT (VCC OUT) IOUT = −50 mA, VCC = 5 V UCC2803/05 0.4 0.9 V Rise time CL = 1 nF 41 70 ns Fall time CL = 1 nF 44 75 ns

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010

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electrical characteristics, TA = −40/C0095C to 125/C0095C for Q temp and TA= −55/C0095C to 125/C0095C for M temp, VCC = 10 V (see Note 1), RT = 100 kΩ from REF to RC, CT = 330 pF from RC to GND, 0.1 F capacitor from VCC to GND, 0.1 F capacitor from VREF to GND and TA = TJ (unless otherwise stated) PARAMETER TEST CONDITIONS UCC280XQ, UCC280XM UNITPARAMETER TEST CONDITIONS MIN TYP MAX UNIT Undervoltage Lockout Section UCC2800 6.6 7.2 7.8 Start threshold See Note 6 UCC2801 8.6 9.4 10.2 VStart threshold See Note 6 UCC2802/04 11.5 12.5 13.5 V UCC2803/05 3.7 4.1 4.5 UCC2800 6.3 6.9 7.5 Stop threshold See Note 6 UCC2801 6.8 7.4 8 VStop threshold See Note 6 UCC2802/04 7.6 8.3 9 V UCC2803/05 3.2 3.6 4 UCC2800 0.12 0.3 0.48 Start to stop hysteresis UCC2801 1.6 2 2.4 VStart to stop hysteresis UCC2802/04 3.5 4.2 5.1 V UCC2803/05 0.2 0.5 0.8 Soft Start Section COMP rise time FB = 1.8 V, Rise from 0.5 V to REF − 1 V 4 10 ms Overall Section Start-up current VCC < Start threshold 0.1 0.2 mA Operating supply current FB = 0 V, CS = 0 V 0.5 1 mA VCC internal zener voltage ICC = 10 mA, See Note 6 and Note 8 12 13.5 15 V VCC internal zener voltage minus start threshold voltage See Note 6 UCC2802/04 0.5 1 V NOTES: 1. Adjust V CC above the start threshold before setting at 10 V. 2. Oscillator frequency for the UCC2800, UCC2802, and UCC2803 is the output frequency. Oscillator frequency for the UCC2801, UCC2804, and UCC2805 is twice the output frequency. 3. Gain is defined by: A = /C0068VCOMP /C0068VCS 0 /C0118 VCS /C0118 0.8 V 4. Parameter measured at trip point of latch with Pin 2 at 0 V 5. Total variation includes temperature stability and load regulation. 6. Start threshold, stop threshold, and zener shunt thresholds track one another. 7. Not production tested 8. The device is fully operating in clamp mode as the forcing current is higher than the normal operating supply current.

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010 7POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 detailed terminal descriptions COMP COMP is the output of the error amplifier and the input of the PWM comparator. Unlike other devices, the error amplifier in the UCC2800 family is a true, low output-impedance, 2 MHz operational amplifier. As such, the COMP terminal can both source and sink current. However, the error amplifier is internally current limited, so that one can command zero duty cycle by externally forcing COMP to GND. The UCC2800 family features built-in full cycle soft start. Soft start is implemented as a clamp on the maximum COMP voltage. CS CS is the input to the current sense comparators. The UCC2800 family has two different current sense comparators - the PWM comparator and an overcurrent comparator. The UCC2800 family contains digital current sense filtering, which disconnects the CS terminal from the current sense comparator during the 100 ns interval immediately following the rising edge of the OUT pin. This digital filtering, also called leading-edge blanking, means that in most applications, no analog filtering (RC filter) is required on CS. Compared to an external RC filter technique, the leading-edge blanking provides a smaller effective CS to OUT propagation delay. Note, however, that the minimum non-zero on-time of the OUT signal is directly affected by the leading-edge-blanking and the CS to OUT propagation delay. The overcurrent comparator is only intended for fault sensing, and exceeding the over-current threshold will cause a soft start cycle. FB FB is the inverting input of the error amplifier. For best stability, keep FB lead length as short as possible and FB stray capacitance as small as possible. ground (GND) GND is reference ground and power ground for all functions on this part. OUT OUT is the output of a high-current power driver capable of driving the gate of a power MOSFET with peak currents exceeding 750 mA. OUT is actively held low when V CC is below the UVLO threshold. The high-current power driver consists of FET output devices, which can switch all of the way to GND and all of the way to VCC. The output stage also provides a low impedance to overshoot and undershoot. This means that in many cases, external schottky clamp diodes are not required.

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010

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detailed descriptions (continued) RC RC is the oscillator timing pin. For fixed frequency operation, set timing capacitor charging current by connecting a resistor from REF to RC. Set frequency by connecting timing capacitor from RC to GND. For the best perfomance, keep the timing capacitor lead to GND as short and direct as possible. If possible, use separate ground traces for the timing capacitor and all other functions. The frequency of oscillation can be estimated with the following equations: UCC2800/C032401/C032402/C032404 : F /C00431.5 R /C0032C UCC2803/C0324UCC2805 : F /C00431.0 R /C0032C where frequency is in Hz, resistance is in ohms, and capacitance is in farads. The recommended range of timing resistors is between 10k and 200k and timing capacitor is 100 pF to 1000 pF. Never use a timing resistor less than 10k. To prevent noise problems, bypass VCC to GND with a ceramic capacitor as close to the VCC pin as possible. An electrolytic capacitor may also be used in addition to the ceramic capacitor. voltage reference (REF) REF is the voltage reference for the error amplifier and also for many other functions on the IC. REF is also used as the logic power supply for high speed switching logic on the IC. When VCC is greater than 1 V and less than the UVLO threshold, REF is pulled to ground through a 5 kΩ resistor. This means that REF can be used as a logic output indicating power system status. It is important for reference stability that REF is bypassed to GND with a ceramic capacitor as close to the pin as possible. An electrolytic capacitor may also be used in addition to the ceramic capacitor. A minimum of 0.1 μF ceramic is required. Additional REF bypassing is required for external loads greater than 2.5 mA on the reference. To prevent noise problems with high speed switching transients, bypass REF to ground with a ceramic capacitor close to the IC package. power (VCC) VCC is the power input connection for this device. In normal operation, VCC is powered through a current limiting resistor. Although quiescent VCC current is very low, total supply current will be higher, depending on the OUT current. Total VCC current is the sum of quiescent V CC current and the average OUT current. Knowing the operating frequency and the MOSFET gate charge (Qg), average OUT current can be calculated from: IOUT /C0043Qg /C0032F (1) (2)

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010

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PARAMETER MEASUREMENT INFORMATION Figure 5 UCC1803/05 Oscillator Frequency vs RT and CT Figure 6 UCC1800/02/03 Maximum Duty Cycle vs Oscillator Frequency Figure 7 UCC1801/04/05 Maximum Duty Cycle vs Oscillator Frequency Figure 8 UCC1800 ICC vs Oscillator Frequency

UCC2800/2801/2802/2803/2804/2805-EP LOW-POWER BICMOS CURRENT-MODE PWM /Em /Em SGLS135F − SEPTEMBER 2002 − REVISED OCTOBER 2010

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D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

8 PINS SHOWN

0.197 (5,00)A MAX A MIN (4,80) 0.189 0.337 (8,55) (8,75) 0.344 0.386 (9,80) (10,00) 0.394 16DIM PINS ** 4040047/E 09/01 0.069 (1,75) MAX Seating Plane 0.004 (0,10) 0.010 (0,25) 0.010 (0,25) 0.016 (0,40) 0.044 (1,12) 0.244 (6,20) 0.228 (5,80) 0.020 (0,51) 0.014 (0,35) 1 4 8 5 0.150 (3,81) 0.157 (4,00) 0.008 (0,20) NOM 0°− 8° Gage Plane A 0.004 (0,10) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). D. Falls within JEDEC MS-012

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) UCC2800MDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -55 to 125 2800EP UCC2800MDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -55 to 125 2800EP UCC2800QDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (C2800D, C2800DEP) EP UCC2800QDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 (C2800D, C2800DEP) EP UCC2801MDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 2801EP UCC2801MDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 2801EP UCC2801QDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -40 to 125 2801EP UCC2801QDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -55 to 125 2801EP UCC2802QDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2802EP UCC2802QDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2802EP UCC2803MDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -55 to 125 2803EP UCC2803MDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -55 to 125 2803EP UCC2803QDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2803EP UCC2803QDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 2803EP UCC2804QDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2804EP UCC2804QDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2804EP UCC2805QDREP Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2805EP UCC2805QDREP.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2805EP V62/03624-01XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 (C2800D, C2800DEP) EP V62/03624-02XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -40 to 125 2801EP V62/03624-03XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2802EP V62/03624-04XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2803EP V62/03624-05XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2804EP V62/03624-06XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2805EP V62/03624-07XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 2801EP Addendum-Page 1

www.ti.com 23-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) V62/03624-08XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -55 to 125 2803EP V62/03624-09XE Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-2-250C-1 YEAR -55 to 125 2800EP (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UCC2800-EP, UCC2801-EP, UCC2802-EP, UCC2803-EP, UCC2804-EP, UCC2805-EP :

• Catalog : UCC2800 , UCC2801 , UCC2802 , UCC2803 , UCC2804 , UCC2805
• Automotive : UCC2800-Q1 , UCC2801-Q1 , UCC2802-Q1 , UCC2803-Q1 , UCC2804-Q1 , UCC2805-Q1 Addendum-Page 2

www.ti.com 23-May-2025

• Military : UCC2802M NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC2800MDREP SOIC D 8 2500 350.0 350.0 43.0 UCC2800QDREP SOIC D 8 2500 350.0 350.0 43.0 UCC2801MDREP SOIC D 8 2500 350.0 350.0 43.0 UCC2801QDREP SOIC D 8 2500 350.0 350.0 43.0 UCC2802QDREP SOIC D 8 2500 350.0 350.0 43.0 UCC2803MDREP SOIC D 8 2500 350.0 350.0 43.0 UCC2803QDREP SOIC D 8 2500 350.0 350.0 43.0 UCC2804QDREP SOIC D 8 2500 350.0 350.0 43.0 UCC2805QDREP SOIC D 8 2500 350.0 350.0 43.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) UCC2800MDREP D SOIC 8 2500 506.6 8 3940 4.32 UCC2800MDREP.A D SOIC 8 2500 506.6 8 3940 4.32 UCC2801QDREP D SOIC 8 2500 506.6 8 3940 4.32 UCC2801QDREP.A D SOIC 8 2500 506.6 8 3940 4.32 UCC2803MDREP D SOIC 8 2500 506.6 8 3940 4.32 UCC2803MDREP.A D SOIC 8 2500 506.6 8 3940 4.32 V62/03624-02XE D SOIC 8 2500 506.6 8 3940 4.32 V62/03624-08XE D SOIC 8 2500 506.6 8 3940 4.32 V62/03624-09XE D SOIC 8 2500 506.6 8 3940 4.32 Pack Materials-Page 3

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