SN74ACT16245-EP TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 14
Technical content
SCAS677A – MAY 2002 – REVISED JULY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068 Controlled Baseline – One Assembly/Test Site, One Fabrication Site /C0068 Extended Temperature Performance of –40°C to 125°C /C0068 Enhanced Diminishing Manufacturing Sources (DMS) Support /C0068 Enhanced Product Change Notification /C0068 Qualification Pedigree† /C0068 Member of the Texas Instruments Widebus Family /C0068 Inputs Are TTL-Voltage Compatible /C0068 3-State Outputs Drive Bus Lines Directly /C0068 Flow-Through Architecture Optimizes PCB Layout /C0068 Distributed VCC and GND Pins Minimize High-Speed Switching Noise † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, highly accelerated stress test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.
description
The SN74ACT16245Q-EP is a 16-bit bus transceiver organized as dual-octal noninverting 3-state transceivers and designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. The device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The enable (G ) input can be used to disable the devices so that the buses are effectively isolated.
ORDERING INFORMATION
TA PACKAGE ‡ ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 125°C SSOP – DL Tape and reel SN74ACT16245QDLREP ACT16245QEP ‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright 2002, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. DL PACKAGE (TOP VIEW) 1DIR 1B1 1B2 GND 1B3 1B4 V CC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 V CC 2B5 2B6 GND 2B7 2B8 2DIR 1A1 1A2 GND 1A3 1A4 V CC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 V CC 2A5 2A6 GND 2A7 2A8
SCAS677A – MAY 2002 – REVISED JULY 2002
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
(each section) CONTROL INPUTS OPERATION G DIR L L B data to A bus L H A data to B bus H X Isolation logic diagram (positive logic) 1DIR 1A1 1B1 To Seven Other Transceivers 2DIR 2A1 2B1 To Seven Other Transceivers absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
SCAS677A – MAY 2002 – REVISED JULY 2002 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions (see Note 3) MIN MAX UNIT VCC Supply voltage (see Note 4) 4.5 5.5 V VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V IOH High-level output current –16 mA IOL Low-level output current 16 mA ∆t/∆v Input transition rise or fall rate 0 10 ns/V TA Operating free-air temperature –40 125 °C NOTES: 3. Unused inputs should be tied to VCC through a pullup resistor of approximately 5 k/C0087 or greater to keep them from floating. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 4. All VCC and GND pins must be connected to the proper-voltage power supply.
SCAS677A – MAY 2002 – REVISED JULY 2002
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C MIN MAX UNITPARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX UNIT IOH = 50 /C0109 A 4.5 V 4.4 4.4 IOH = –50 /C0109 A 5.5 V 5.4 5.4 VOH IOH = 16 mA 4.5 V 3.94 3.94 V IOH = –16 mA 5.5 V 4.94 4.94 IOH = –24 mA/C0123 5.5 V 3.85 IOL =5 0/C0109 A 4.5 V 0.1 0.1 IOL = 50 /C0109 A 5.5 V 0.1 0.1 VOL IOL =1 6m A 4.5 V 0.36 0.5 V IOL = 16 mA 5.5 V 0.36 0.5 IOL = 24 mA/C0123 5.5 V 0.5 II Control inputs VI = VCC or GND 5.5 V ±0.1 ±1 /C0109 A IOZ A or B ports/C0125 VO = VCC or GND 5.5 V ±0.5 ±10 /C0109 A ICC VI = VCC or GND, IO = 0 5.5 V 8 160 /C0109 A ∆ICC /C0119 One input at 3.4 V,Other inputs at GND or VCC 5.5 V 0.9 1 mA C i Control inputs VI = VCC or GND 5 V 4.5 pF C io A or B ports VO = VCC or GND 5 V 16 pF † Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. ‡ For I/O ports, the parameter IOZ includes the input leakage current II. § This is the increase in supply current for each input that is at one of the specified TTL-voltage levels rather than 0 V or VCC . switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) PARAMETER FROM TO TA = 25°C MIN MAX UNITPARAMETER (INPUT) (OUTPUT) MIN TYP MAX MIN MAX UNIT tPLH Ao rB Bo rA nstPHL A or B B or A ns tPZH G Bo rA ns tPZL G B or A ns tPHZ G Bo rA ns tPLZ G B or A ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT C d Power dissipation capacitanceper transceiver Outputs enabled C L =5 0pF f=1M H z pFC pd Power dissipation capacitance per transceiver Outputs disabled C L = 50 pF, f = 1 MHz pF
NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω , tr = 3 ns, tf = 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) SN74ACT16245QDLREP ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/03601-01XE ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2007 Addendum-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ACT16245QDLREP SSOP DL 48 1000 346.0 346.0 49.0 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 Pack Materials-Page 2
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040048/E 12/01
48 PINS SHOWN
0.730 (18,54) 0.720 (18,29) 4828 0.370 (9,40) (9,65) 0.380 Gage Plane DIM 0.420 (10,67) 0.395 (10,03) A MIN A MAX 0.010 (0,25) PINS ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) Seating Plane 0.020 (0,51) 0.040 (1,02) 0.008 (0,203) 0.0135 (0,343) 0.008 (0,20) MIN A 0.110 (2,79) MAX 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) M0.005 (0,13) 0.025 (0,635) 0°–/C02578° 0.005 (0,13) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118
www.ti.com 16-Aug-2010 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 74ACT16245QDLREPG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74ACT16245QDLREP ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office V62/03601-01XE ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ACT16245QDLREP SSOP DL 48 1000 367.0 367.0 55.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040048/E 12/01 0.730 (18,54) 0.720 (18,29) 4828 0.370 (9,40) (9,65) 0.380 Gage Plane DIM 0.420 (10,67) 0.395 (10,03) A MIN A MAX 0.010 (0,25) PINS ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) Seating Plane 0.020 (0,51) 0.040 (1,02) 0.008 (0,203) 0.0135 (0,343) 0.008 (0,20) MIN A 0.110 (2,79) MAX 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) M0.005 (0,13) 0.025 (0,635) 0°–/C02578° 0.005 (0,13) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118
Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46C and todiscontinueany productorserviceperJESD48B. Buyersshould obtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.All semiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsalesuppliedatthetime oforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents whichmeet ISO/TS16949 requirements,mainlyforautomotiveuse.Components which have notbeen so designatedareneitherdesignednorintendedforautomotiveuse;and TIwillnotbe responsibleforany failureofsuch components tomeet such requirements. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP MobileProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2012,Texas InstrumentsIncorporated