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Technical content

Features

t "&$2DPNQMJBOU t RoHS compliant t -FBEMFTT 0805, 1206 and 1210 chip sizes t .VMUJMBZFSDFSBNJD construction technology t ¡$UP operating temp. range t 0QFSBUJOHWPMUBHFSBOHF VM(DC) = 5.5V to 120V t 3BUFEGPSTVSHF current (8 x 20μs) t 3BUFEGPSFOFSHZ (10 x 1000μs) t *OIFSFOUCJEJSFDUJPOBM clamping t /PQMBTUJDPSFQPYZ packaging assures better than UL94V-0 flammability rating t 4UBOEBSEMPXDBQBDJUBODF types available

Applications

t &4%QSPUFDUJPOGPS*&$ 61000-4-2, MIL -STD- DNFUIPE and other industry specifications (see also the MLE or MLN Series) t 1SPWJEFTPOCPBSE transient voltage protection for ICS and transistors t 6TFEUPIFMQBDIJFWF electromagnetic compliance of end products t 3FQMBDFMBSHFSTVSGBDF mount TVS Zeners in many applications Size T able Metric EIA 1005 0402 1608 2012 0805 1206 1210 Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table. Continuous ML Series Units Steady State Applied Voltage: DC Voltage Range (VM(DC)) UP V AC Voltage Range (VM(AC)RMS) UP V Transient: Non-Repetitive Surge Current, 8/20μs Waveform, (ITM) 4 to 500 A Non-Repetitive Surge Energy, 10/1000μs Waveform, (WTM) 0.02 to 2.5 J 0QFSBUJOH"NCJFOU5FNQFSBUVSF3BOHF 5A) UP ºC Storage Temperature Range (TSTG) UP ºC Temperature Coefficient (DV) of Clamping Voltage (VC) at Specified Test Current <0.01 %/º C

©2010 Littelfuse, Inc. Revision: November 10, 2010 MLA Varistor Series Surface Mount Multilayer Varistors (MLVs) > MLA Series Specifications are subject to change without notice. Device Ratings and Specifications Part Number Maximum Ratings (125º C) Specifications (25ºC) Maximum Continuous Working Voltage Maximum Non- repetitive Surge Current (8/20μs) Maximum Non- repetitive Surge Energy (10/1000μs) Maximum Clamping Voltage at 1A (or as Noted) (8/20μs) Nominal Voltage at 1mA DC Test Current Typical Capacitance at f = 1MHz VM(DC) VM(AC) ITM WTM VC VN(DC) Min VN(DC) Max C (V) (V) (A) (J) (V) (V) (V) (pF) 7.-"/5 2.5 0.100 7.-"/ 2.5 120 7.-"/ 2.5 100 6000 V5.5MLA0805N 5.5 4.0 120 1840 V5.5MLA0805LN 5.5 4.0 40 0.100 400 V5.5MLA1206N 5.5 4.0 150 0.400 V14MLA0805N 14.0 10.0 120 15.9 560 V14MLA0805LN 14.0 10.0 40 0.100 15.9 V14MLA1206N 14.0 10.0 150 0.400 15.9 1400 V26MLA0805N 26.0 20.0 100 60.0 29.5 220 7.-"/ 26.0 180 0.800 49.0 500 V60MLA1210N 60.0 50.0 250 1 .500 BU 440 /05&4 1 'L' suffix is a low capacitance and energy version; Contact your Littelfuse sales representative for custom capacitance requir ements 2 Typical leakage at 25ºC<25 μA, maximum leakage 100μA at VM(DC); for 0402 size, typical leakage <5μA, maximum leakage <20μA at VM(DC) "WFSBHFQPXFSEJTTJQBUJPOPGUSBOTJFOUTGPS BOETJ[FTOPUUPFYDFFE8 8BOE8SFTQFDUJWFMZ *UFNJTBWBJMBCMFBTh3hQBDLJOHPQUJPOPOMZ"MMTJ[FJUFNTBWBJMBCMFBTh3hQBDLBHJOHPQUJPOPOMZ4FF1BDLBHJOHTFDUJPOGPSBEEJUJPOBMJOGPSNBUJPO *UFNJTBWBJMBCMFJOh)h h5hBOEh"hQBDLJOHPQUJPOPOMZ"MM BOEQBSUTDPNFBTh)h h5hBOEh"hQBDLJOHPQUJPOPOMZ4FF1BDLBHJOHTFDUJPOGPSBEEJUJPOBMJOGPSNBUJPO

©2010 Littelfuse, Inc. Revision: November 10, 2010 MLA Varistor Series Surface Mount Multilayer Varistors (MLVs) > MLA Series Specifications are subject to change without notice. Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are IR Re-flow and Wave soldering. Typical profiles are shown on the right. The recommended solder for the MLA suppressor is B 4O1C"H 4O1C PS 4O1C Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. When using a reflow process, care should be taken to ensure that the MLA chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. 0ODFUIFTPMEFSJOHQSPDFTTIBTCFFODPNQMFUFE JUJT still necessary to ensure that any further thermal shocks BSFBWPJEFE0OFQPTTJCMFDBVTFPGUIFSNBMTIPDLJTIPU printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50º C before cleaning. Lead–free (Pb-free) Soldering Recommendations Littelfuse offers the Nickel Barrier Termination option (see /TVGmYJO1BSU/VNCFSJOH4ZTUFNGPSPSEFSJOH GPSUIF optimum Lead–free solder performance, consisting of a Matte Tin outer surface plated on Nickel underlayer, plated on Silver base metal. 5IFQSFGFSSFETPMEFSJT 4O"H$V XJUIBO3." flux, but there is a wide selection of pastes and fluxes available with which the Nickel Barrier parts should be compatible. The reflow profile must be constrained by the maximums JOUIF-FBEoGSFF3FnPX1SPmMF'PS-FBEoGSFFXBWF TPMEFSJOH UIF8BWF4PMEFS1SPmMFTUJMMBQQMJFT /PUFUIF-FBEoGSFFQBTUF nVYBOEQSPmMFXFSFVTFEGPS evaluation purposes by Littelfuse, based upon industry standards and practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. PREHEAT ZONE PREHEAT DWELL RAMP RATE <2°C/s MAXIMUM TEMPERATURE 230°C TEMPERATURE °C TIME (MINUTES) 250 200 150 100 40-80 SECONDS ABOVE 183°C TIME (MINUTES) 300 250 200 150 100 MAXIMUM WA VE 260°C SECOND PREHEA T FIRST PREHEAT TEMPERATURE °C MAXIMUM TEMPERATURE 260˚C, TIME WITHIN 5˚C OF PEAK

20 SECONDS MAXIMUM

<3˚C/s 60 - 150 SEC > 217˚C TEMPERATURE °C TIME (MINUTES) 300 250 200 150 100 Reflow Solder Profile Wave Solder Profile Lead–free Re-flow Solder Profile Figure 14 Figure 15 Figure 16

©2010 Littelfuse, Inc. Revision: November 10, 2010 MLA Varistor Series Surface Mount Multilayer Varistors (MLVs) > MLA Series Specifications are subject to change without notice. MLA Series Product Dimensions (mm) /05&"WPJENFUBMSVOTJOUIJTBSFB QBSUTOPUSFDPNNFOEFEGPSVTFJOBQQMJDBUJPOTVTJOH Silver (Ag) epoxy paste. C B A NOTE E L W D Dimension

1210 Size 1206 Size 0805 Size 0603 Size 0402 Size

IN MM IN MM IN MM IN MM IN MM E 0.020 0.50 0.020 0.50 0.010 0.25 0.015 0.4 0.010 0.25 L 0.125 0.125 2.01 1 .6 1. 0 0 W 0.100 2.54 0.060 1 .60 0.049 1 .25 0.8 0.020 0.50 Part Numbering System V 18 1206 PACKING OPTIONS (see Packaging table for quantities) DEVICE SIZE: DEVICE FAMILY Littelfuse TVSS Device X MAXIMUM DC WORKING VOLTAGE MLA X X CAPACITANCE OPTION No Letter: Standard No Letter: Standard L: Low Capacitance Version END TERMINATION OPTION MULTILAYER SERIES DESIGNATOR N: Nickel Barrier Option (Matte Tin outer surface, plated on Nickel underlayer plated on silver base metal) T: 13in (330mm) Diameter Reel, Plastic Carrier Tape H: 7in (178mm) Diameter Reel, Plastic Carrier Tape R: 7in (178mm) Diameter Reel, Paper Carrier Tape A: Bulk Pack 0201 = .024 inch x .012 inch (0.6 mm x 0.3 mm) 0402 = .04 inch x .02 inch (1 .0 mm x 0.5 mm) 0603 = .063 inch x .031 inch (1 .6 mm x 0.8 mm) 0805 = .08 inch x .08 inch (2.0 mm x 1 .25 mm) 1206 = .126 inch x .063 inch (3.2 mm x 1 .6 mm) 1210 = .126 inch x .1 inch (3.2 mm x 2.5 mm) Packaging* Device Size Quantity 13” Inch Reel ("T" Option) 7” Inch Reel ("H" Option) 7” Inch Reel ("R" Option) Bulk Pack ("A" Option) 1210 8,000 2,000 N/A 2,000 1206 10,000 2,500 N/A 2,500 0805 10,000 2,500 N/A 2,500 10,000 2,500 4,000 2,500

0402 N/A N/A 10,000 N/A

*UJTSFDPNNFOEFEUIBUQBSUTCFLFQUJOUIFTFBMFECBHQSPWJEFEBOEUIBUQBSUTCFVTFEBTTPPOBTQPTTJCMFXIFOSFNPWFEGSPNCBHT /05&4 1 V120MLA1210 standard shipping quantities are 1000 pieces per reel for the "H" option and 4000 pieces per reel for "T" option. 7.-" 7.-"BOE7.-"POMZBWBJMBCMFJO) 5BOE"QBDLJOHPQUJPOT

©2010 Littelfuse, Inc. Revision: November 10, 2010 MLA Varistor Series Surface Mount Multilayer Varistors (MLVs) > MLA Series Specifications are subject to change without notice. T ape and Reel Specifications Symbol Description Dimensions in Millimeters

0402 Size 0603, 0805, 1206 & 1210 Sizes

A0 Width of Cavity Dependent on Chip Size to Minimize Rotation. B0 Length of Cavity Dependent on Chip Size to Minimize Rotation. K0 Depth of Cavity Dependent on Chip Size to Minimize Rotation. W Width of Tape F Distance Between Drive Hole Centers and Cavity Centers E Distance Between Drive Hole Centers and Tape Edge P1 Distance Between Cavity Centers P2 Axial Drive Distance Between Drive Hole Centers & Cavity Centers P0 Axial Drive Distance Between Drive Hole Centers D0 Drive Hole Diameter D1 %JBNFUFSPG$BWJUZ1JFSDJOH N/A T1 Top Tape Thickness 0.1 Max 0.1 Max /05&4 t$POGPSNTUP&*" 3FWJTJPO" t$BOCFTVQQMJFEUP*&$QVCMJDBUJPO D0 P0 P1 A0 F E W For T and H Pack Options: PLASTIC CARRIER TAPE For R Pack Options: EMBOSSED PAPER CARRIER TAPE EMBOSSMENT TOP TAPE 8mm NOMINAL PRODUCT IDENTIFYING LABEL 178mm OR 330mm DIA. REEL