V40DL45BP_V01 VISHAY | Alldatasheet
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www.vishay.com Vishay General Semiconductor Revision: 18-Nov-2020 1 Document Number: 87789 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TMBS® (Trench MOS Barrier Schottky) Rectifier for PV Solar Cell Bypass Protection Ultra Low VF = 0.26 V at IF = 5 A LINKS TO ADDITIONAL RESOURCES
FEATURES
- Trench MOS Schottky technology
- Very low profile - typical height of 1.7 mm
- Ideal for automated placement
- Low forward voltage drop, low power losses
- High efficiency operation
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in solar cell junction box as a bypass diode for protection, using DC forward current without reverse bias. MECHANICAL DATA Case: SMPD (TO-263AC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test Polarity: As marked Note (1) With heatsink (2) Meets the requirements of IEC 61215 ed.2 bypass diode thermal test PRIMARY CHARACTERISTICS IF(AV) 40 A VRRM 45 V IFSM 240 A VF at IF = 40 A (TA = 125 °C) 0.53 V TOP max. (AC model) 150 °C TJ max. (DC forward current) 200 °C Package SMPD (TO-263AC) Circuit configuration Single Top View Bottom View Anode 1 Anode 2 K Cathode eSMP® Series SMPD (TO-263AC) K 333DDD3 D 3D Models MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL V40DL45BP UNIT Maximum repetitive peak reverse voltage V RRM 45 V Maximum DC forward current (fig. 1) I F(DC) (1) 40 A Peak forward surge current 10 ms single half sine-wave superimposed on rated load IFSM 240 A Operating junction temperature range (AC model) T OP -40 to +150 °C Junction temperature in DC forward current without reverse bias, t = ≤ 1 h T J (2) ≤ 200 °C
www.vishay.com Vishay General Semiconductor Revision: 18-Nov-2020 2 Document Number: 87789 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 5 ms Notes (1) The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA (2) Free air, without heatsink RATINGS AND CHARACTERISTICS CURVES (T A = 25 °C unless otherwise noted) Fig. 1 - Forward Current Derating Curve Fig. 2 - Forward Power Loss Characteristics ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT Instantaneous forward voltage I F = 5 A TA = 25 °C VF (1) 0.38 - V IF = 20 A 0.47 - IF = 40 A 0.58 0.66 IF = 5 A TA = 125 °C 0.26 - IF = 20 A 0.38 - IF = 40 A 0.53 0.61 Reverse current V R = 45 V TA = 25 °C IR (2) -5 mATA = 125 °C 36 125 THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL V40DL45BP UNIT Typical thermal resistance R θJC 0.9 °C/WRθJA (1)(2) 45 ORDERING INFORMATION (Example) PACKAGE PREFERRED P/N UNIT WEIGHT (g) PAC KAGE CODE BASE QUANTITY DELIVERY MODE SMPD (TO-263AC) V40DL45BP-M3/I 0.55 I 2000/reel 13" diameter plastic tape and reel 100 1000 10000 0 25 50 75 100 125 150 Axis Title 1st line 2nd line 2nd line Average Forward Rectified Current (A) Mount Temperature (°C) TM measured at cathode terminal mount typical values RthJM = 0.9 °C/W RthJA = 45 °C/W 100 1000 10000 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 0 5 10 15 20 25 30 35 40 45 Axis Title 1st line 2nd line 2nd line Average Power Loss (W) Average Forward Current (A) D = 0.1 D = 0.2 D = 0.3 D = 0.5 D = 0.8 D = 1.0 D = tp/T T tp
www.vishay.com Vishay General Semiconductor Revision: 18-Nov-2020 3 Document Number: 87789 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 4 - Typical Reverse Characteristics Fig. 5 - Typical Junction Capacitance Fig. 6 - Typical Transient Thermal Impedance Fig. 7 - Thermal Resistance Junction-to-Ambient vs. Copper Pad Areas 100 1000 10000 0.1 100 Axis Title 1st line 2nd line 2nd line Instantaneous Forward Current (A) Instantaneous Forward Voltage (V) TJ = 100 °C TJ = 125 °C TJ = 150 °C TJ = 25 °C TJ = -40 °C 100 1000 10000 0.001 0.01 0.1 100 1000 10 20 30 40 50 60 70 80 90 100 Axis Title 1st line 2nd line 2nd line Instantaneous Reverse Current (mA) Percent of Rated Peak Reverse Voltage (%) TJ = 100 °C TJ = 125 °C TJ = 25 °C TJ = -40 °C TJ = 150 °C 100 1000 10000 100 1000 10 000 0.1 1 10 100 Axis Title 1st line 2nd line 2nd line Junction Capacitance (pF) Reverse Voltage (V) TJ = 25 °C f = 1.0 MHz V sig = 50 mVp-p 100 1000 10000 0.1 100 0.01 0.1 1 10 100 Axis Title 1st line 2nd line 2nd line Transient Thermal Impedance (°C/W) t - Pulse Duration (s) Junction to ambient 100 1000 10000 100 123456789 Axis Title 1st line 2nd line 2nd line Thermal Resistance (°C/W) Copper Pad Areas (cm2) S (cm2) Epoxy printed circuit board FR4 copper thickness = 70 µm
www.vishay.com Vishay General Semiconductor Revision: 18-Nov-2020 4 Document Number: 87789 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE OUTLINE DIMENSIONS in inches (millimeters) 5() Mounting Pad Layout 0,1 0,1 5() 120 120 WR WR 5() SMPD (TO-263AC)
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