V30MLA1210LN | DigiCamel IC Datasheet

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V3.5MLA0603NH LITTELFUSE | Alldatasheet

Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 8

Technical content

Features

AEC - Q200 compliant
RoHS compliant
Leadless 0402, 0603, 0805, 1206 and 1210 chip sizes
Multilayer ceramic construction technology
-55°C to +125°C operating temp. range
Operating voltage range VM(DC) = 5.5V to 120V
Rated for surge current (8 x 20μs)
Rated for energy (10 x 1000μs)
Inherent bi-directional clamping
No plastic or epoxy packaging assures better than UL94V-0 ﬂammability rating
Standard low capacitance types available

Applications

Suppression of inductive switching or other transient events such as EFT and surge voltage at the circuit board level
ESD protection for IEC 61000-4-2, MIL -STD- 883c method 3015.7 , and other industry speciﬁcations (see also the MLE or MLN Series)
Provides on-board transient voltage protection for ICS and transistors
Used to help achieve electromagnetic compliance of end products
Replace larger surface mount TVS Zeners in many applications Size T able Metric EIA 1005 0402 1608 0603 2012 0805 3216 1206 3225 1210 Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and speciﬁcations table. Continuous ML Series Units Steady State Applied Voltage: DC Voltage Range (VM(DC)) 3.5 to 120 V AC Voltage Range (VM(AC)RMS) 2.5 to 107 V Transient: Non-Repetitive Surge Current, 8/20μs Waveform, (ITM) 4 to 500 A Non-Repetitive Surge Energy, 10/1000μs Waveform, (WTM) 0.02 to 2.5 J Operating Ambient Temperature Range (TA) -55 to +125 ºC Storage Temperature Range (TSTG) -55 to +150 ºC Temperature Coefficient (/g68V) of Clamping Voltage (VC) at Specified Test Current <0.01 %/º C

©2009 Littelfuse, Inc. Revision: January 15, 2010 ML Varistor Series Surface Mount Multilayer Varistors (MLVs) > ML Series Speciﬁcations are subject to change without notice. Please refer to www.littelfuse.com/series/ML.html for current information. Device Ratings and Speciﬁcations Part Number Maximum Ratings (125º C) Speciﬁcations (25ºC) Maximum Continuous Working Voltage Maximum Non- repetitive Surge Current (8/20μs) Maximum Non- repetitive Surge Energy (10/1000μs) Maximum Clamping Voltage at 1A (or as Noted) (8/20μs) Nominal Voltage at 1mA DC Test Current Typical Capacitance at f = 1MHz VM(DC) VM(AC) ITM WTM VC VN(DC) Min VN(DC) Max C (V) (V) (A) (J) (V) (V) (V) (pF) V5.5MLA0603N V9MLA0603N NOTES: 1 'L' sufﬁx is a low capacitance and energy version; Contact your Littelfuse sales representative for custom capacitance requir ements 2 Typical leakage at 25ºC<25 μA, maximum leakage 100μA at VM(DC); for 0402 size, typical leakage <5μA, maximum leakage <20μA at VM(DC)

4 Only available in 'R' packing option

5 Only available in 'H','T'and 'A' packing options

©2009 Littelfuse, Inc. Revision: January 15, 2010 ML Varistor Series Surface Mount Multilayer Varistors (MLVs) > ML Series Speciﬁcations are subject to change without notice. Please refer to www.littelfuse.com/series/ML.html for current information. Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are IR Re-ﬂow and Wave soldering. Typical proﬁles are shown on the right. The recommended solder for the ML suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder ﬂux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. When using a reﬂow process, care should be taken to ensure that the ML chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50º C before cleaning. Lead–free (Pb-free) Soldering Recommendations Littelfuse offers the Nickel Barrier Termination option (see "N" sufﬁx in Part Numbering System for ordering) for the optimum Lead–free solder performance, consisting of a Matte Tin outer surface plated on Nickel underlayer, plated on Silver base metal. The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA ﬂux, but there is a wide selection of pastes and ﬂuxes available with which the Nickel Barrier parts should be compatible. The reﬂow proﬁle must be constrained by the maximums in the Lead–free Reﬂow Proﬁle. For Lead–free wave soldering, the Wave Solder Proﬁle still applies. Note: the Lead–free paste, ﬂux and proﬁle were used for evaluation purposes by Littelfuse, based upon industry standards and practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. PREHEAT ZONE PREHEAT DWELL RAMP RATE <2°C/s MAXIMUM TEMPERATURE 230°C TEMPERATURE °C TIME (MINUTES) 250 200 150 100 40-80 SECONDS ABOVE 183°C TIME (MINUTES) 300 250 200 150 100 MAXIMUM WA VE 260°C SECOND PREHEA T FIRST PREHEAT TEMPERATURE °C MAXIMUM TEMPERATURE 260˚C, TIME WITHIN 5˚C OF PEAK

20 SECONDS MAXIMUM

<3˚C/s 60 - 150 SEC > 217˚C TEMPERATURE °C TIME (MINUTES) 300 250 200 150 100 Reﬂow Solder Proﬁle Wave Solder Proﬁle Lead–free Re-ﬂow Solder Proﬁle Figure 14 Figure 15 Figure 16

©2009 Littelfuse, Inc. Revision: January 15, 2010 ML Varistor Series Surface Mount Multilayer Varistors (MLVs) > ML Series Speciﬁcations are subject to change without notice. Please refer to www.littelfuse.com/series/ML.html for current information. ML Series Product Dimensions (mm) NOTE : Avoid metal runs in this area, parts not recommended for use in applications using Silver (Ag) epoxy paste. PAD LAYOUT DIMENSIONS C B A NOTE CHIP LAYOUT DIMENSIONS E L W D Dimension

1210 Size 1206 Size 0805 Size 0603 Size 0402 Size

IN MM IN MM IN MM IN MM IN MM E 0.020 -/+0.010 0.50 -/+0.25 0.020 -/+0.010 0.50 -/+0.25 0.020 -/+ 0.010 0.50 -/+ 0.25 0.015 -/+0.008 0.4 -/+0.20 0.010 -/+0.006 0.25 -/+0.15 L 0.125 -/+0.012 3.20 -/+0.30 0.125 -/+0.012 3.20 -/+0.30 0.079 -/+0.008 2.01 -/+0.20 0.063 -/+0.006 1 .6 -/+0.15 0.039 -/+0.004 1. 0 0 -/+0.10 W 0.100 -/+0.012 2.54 -/+0.30 0.060 -/+0.011 1 .60 -/+0.28 0.049 -/+0.008 1 .25 -/+0.20 0.032 -/+0.060 0.8 -/+0.15 0.020 -/+0.004 0.50 -/+0.10 Part Numbering System V 18 1206 PACKING OPTIONS (see Packaging table for quantities) DEVICE SIZE: i.e., 120 mil x 60 mil DEVICE FAMILY Littelfuse TVSS Device X MAXIMUM DC WORKING VOLTAGE MLA X X CAPACITANCE OPTION No Letter: Standard No Letter: Standard L: Low Capacitance Version END TERMINATION OPTION MULTILAYER SERIES DESIGNATOR (3mm x 1 .5mm) N: Nickel Barrier Option (Matte Tin outer surface, plated on Nickel underlayer plated on silver base metal) T: 13in (330mm) Diameter Reel, Plastic Carrier Tape H: 7in (178mm) Diameter Reel, Plastic Carrier Tape R: 7in (178mm) Diameter Reel, Paper Carrier Tape Packaging* Device Size Quantity 13” Inch Reel ("T" Option) 7” Inch Reel ("H" Option) 7” Inch Reel ("R" Option) Bulk Pack ("A" Option) 1210 8,000 2,000 N/A 2,000 1206 10,000 2,500 N/A 2,500 0805 10,000 2,500 N/A 2,500 0603 10,000 2,500 4,000 2,500

0402 N/A N/A 10,000 N/A

*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags. *NOTES: 1 V120MLA1210 standard shipping quantities are 1000 pieces per reel for the "H" option and 4000 pieces per reel for "T" option. 2 V3.5 MLA0603, V5.5MLA0603 and V9MLA0603 only available in "H," "T" and "A" packing options.

©2009 Littelfuse, Inc. Revision: January 15, 2010 ML Varistor Series Surface Mount Multilayer Varistors (MLVs) > ML Series Speciﬁcations are subject to change without notice. Please refer to www.littelfuse.com/series/ML.html for current information. T ape and Reel Speciﬁcations Symbol Description Dimensions in Millimeters

0402 Size 0603, 0805, 1206 & 1210 Sizes

A0 Width of Cavity Dependent on Chip Size to Minimize Rotation. B0 Length of Cavity Dependent on Chip Size to Minimize Rotation. K0 Depth of Cavity Dependent on Chip Size to Minimize Rotation. W Width of Tape 8 -/+0.2 8 -/+0.3 F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+0.05 3.5 -/+0.05 E Distance Between Drive Hole Centers and Tape Edge 1 .75 -/+0.1 1 .75 -/+0.1 P1 Distance Between Cavity Centers 2-/+0.05 4 -/+0.1 P2 Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2 -/+0.1 2 -/+0.1 P0 Axial Drive Distance Between Drive Hole Centers 4 -/+0.1 4 -/+0.1 D0 Drive Hole Diameter 1 .55 -/+0.05 1 .55 -/+0.05 D1 Diameter of Cavity Piercing N/A 1 .05 -/+0.05 T1 Top Tape Thickness 0.1 Max 0.1 Max NOTES:

Conforms to EIA-481-1, Revision A
Can be supplied to IEC publication 286-3 D0 P0 P1 A0 F E W For T and H Pack Options: PLASTIC CARRIER TAPE For R Pack Options: EMBOSSED PAPER CARRIER TAPE EMBOSSMENT TOP TAPE 8mm NOMINAL PRODUCT IDENTIFYING LABEL 178mm OR 330mm DIA. REEL

Product Information

V30MLA1210LN specifications and overview.

Summary

Varistor Products

Description

The MLA Series (also known as "ML" series) family of transient voltage surge suppression devices is based on the Littelfuse Multilayer fabrication technology. These components are designed to suppress a variety of transient events, including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance (EMC). The MLA Series is typically applied to protect integrated circuits and other components at the circuit board level.

Source title V30MLA1210LN Datasheet(PDF) - Littelfuse

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