V30DL50C VISHAY | Alldatasheet

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www.vishay.com Vishay General Semiconductor Revision: 17-Mar-2020 1 Document Number: 89963 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Dual TMBS® (Trench MOS Barrier Schottky) Rectifier Ultra Low VF = 0.29 V at IF = 5 A ADDITIONAL RESOURCES

FEATURES

  • Trench MOS Schottky technology
  • Very low profile - typical height of 1.7 mm
  • Ideal for automated placement
  • Low forward voltage drop, low power losses
  • High efficiency operation
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
  • AEC-Q101 qualified available - Automotive ordering code; base P/NHM3
  • Material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in high frequency DC/DC converters, switching power supplies, freewheeling diodes, OR-ing diode, and reverse battery protection. MECHANICAL DATA Case: SMPD (TO-263AC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3_X - halogen-free, RoHS-compliant, and AEC-Q101 qualified Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test Polarity: as marked PRIMARY CHARACTERISTICS IF(AV) 2 x 15 A VRRM 50 V IFSM 300 A VF at IF = 15 A 0.42 V TJ max. 150 °C Package SMPD (TO-263AC) Circuit configuration Common cathode Top View Bottom View Anode 1 Anode 2 K Cathode eSMP® Series SMPD (TO-263AC) K 333DDD3 D 3D Models Available MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL V30DL50C UNIT Maximum repetitive peak reverse voltage V RRM 50 V Maximum average forward rectified current (fig. 1) per device IF(AV) A per diode 15 Peak forward surge current 10 ms single half sine-wave superimposed on rated load IFSM 300 A Operating junction and storage temperature range T J, TSTG -40 to +150 °C

www.vishay.com Vishay General Semiconductor Revision: 17-Mar-2020 2 Document Number: 89963 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: pulse width ≤ 40 ms Notes (1) The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA (2) Free air, without heatsink Note (1) AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) Fig. 1 - Forward Current Derating Curve Fig. 2 - Forward Power Loss Characteristics Per Diode ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT Instantaneous forward voltage per diode I F = 5 A TA = 25 °C VF (1) 0.39 - V IF = 7.5 A 0.42 - IF = 15 A 0.49 0.57 IF = 5 A TA = 125 °C 0.29 - IF = 7.5 A 0.33 - IF = 15 A 0.42 0.50 Reverse current per diode V R = 50 V TA = 25 °C IR (2) -1 8 0 0 μ A TA = 125 °C 25 60 mA Typical junction capacitance 4.0 V, 1 MHz T A = 25 °C C J 2800 - pF THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL V30DL50C UNIT Typical thermal resistance per diode R θJC 1.7 °C/Wper device 0.9 per device R θJA (1)(2) 45 ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE V30DL50C-M3/I 0.55 I 2000/reel 13" di ameter plastic tape and reel V30DL50CHM3_A/I (1) 0.55 I 2000/reel 13" diameter plastic tape and reel 100 1000 10000 0 25 50 75 100 125 150 Axis Title 1st line 2nd line Average Forward Rectified Current (A) Mount Temperature (°C) TM measured at cathode terminal mount typical values RthJM = 0.9 °C/W RthJA = 45 °C/W 100 1000 10000 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 02468 1 0 1 2 1 4 1 6 1 8 Axis Title 1st line 2nd line 2nd line Average Power Loss (W) Average Forward Current (A) D = 0.1 D = 0.2 D = 0.3 D = 1.0 D = tp/T T tp D = 0.8D = 0.5

www.vishay.com Vishay General Semiconductor Revision: 17-Mar-2020 3 Document Number: 89963 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 3 - Typical Instantaneous Forward Characteristics Per Diode Fig. 4 - Typical Reverse Characteristics Per Diode Fig. 5 - Typical Junction Capacitance Per Diode Fig. 6 - Typical Transient Thermal Impedance Per Device Fig. 7 - Thermal Resistance Junction-to-Ambient vs. Copper Pad Areas 100 1000 10000 0.1 100 0 0.2 0.4 0.6 0.8 Axis Title 2nd line Instantaneous Forward Current (A) Instantaneous Forward Voltage (V) TJ = 100 °C TJ = 125 °C TJ = 150 °C TJ = -40 °C TJ = 25 °C 100 1000 10000 0.001 0.01 0.1 100 20 40 60 80 100 Axis Title 1st line 2nd line Instantaneous Reverse Current (mA) Percent of Rated Peak Reverse Voltage (%) TJ = 150 °C TJ = 125 °C TJ = 100 °C TJ = -40 °C TJ = 25 °C 100 1000 10000 100 1000 10 000 0.1 1 10 100 Axis Title 1st line 2nd line 2nd line Junction Capacitance (pF) Reverse Voltage (V) TJ = 25 °C f = 1.0 MHz V sig = 50 mVp-p 100 1000 10000 0.1 100 0.01 0.1 1 10 100 Axis Title 1st line 2nd line 2nd line Transient Thermal Impedance (°C/W) t - Pulse Duration (s) Junction to Ambient 100 1000 10000 123456789 1 0 Axis Title 1st line 2nd line 2nd line Thermal Resistance (°C/W) Copper Pad Areas (cm2) S (cm2) Epoxy printed circuit board FR4 copper thickness = 70 µm

www.vishay.com Vishay General Semiconductor Revision: 17-Mar-2020 4 Document Number: 89963 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE OUTLINE DIMENSIONS in inches (millimeters) 0.059 (1.50) REF. 0.339 (8.60) 0.323 (8.20) 0.063 (1.60) 0.047 (1.20) 0.048 (1.21) 0.032 (0.81) 0.020 (0.52) 0.011 (0.27) 0.071 (1.80) 0.063 (1.60) 0.069 (1.74) 0.053 (1.34) 0.020 (0.52) 0.011 (0.27) 0.052 (1.23) 0.028 (0.72) 0.276 (7.00) 0.260 (6.60) Mounting Pad Layout 0.420 (10.66) MIN. 0.080 (2.03) MIN. 0.120 (3.05) REF. 0.105 (2.67) 0.095 (2.41) SMPD (TO-263AC) NOM.0.194 (4.93) NOM. 0 to 0.01 (0 to 0.254) REF.0.330 (8.38) 0.604 (15.33) 0.525 (13.33) 0.200 (5.08) 0.354 (8.99) 0.338 (8.59) 0.509 (12.93) 0.485 (12.33) 0.402 (10.20) 0.386 (9.80)

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