V200Z-R ETC | Alldatasheet
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FN-LINK TECHNOLOGY LIMITED 1 PRODUCT SPECIFICATION V200Z-R AIOT Wi-Fi/Bluetooth Combo Module Version:v1.4
FN-LINK TECHNOLOGY LIMITED 2 V200Z-R Module Datasheet Customer: Customer P/N: Signature: Date: Office: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen Factory: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha, CHINA TEL:+86-755-2955-8186 Website:www.fn-link.com Ordering Information Part NO. Description FGV200ZRXX-00 BES2600, Wi-Fi dual-band, a/b/g/n 1T1R, BT5.2, on-chip 16MB PSRAM and 16MB Flash, 28X20mm, with shielding, printing antenna FGV200ZRXX-01 BES2600, Wi-Fi dual-band, a/b/g/n 1T1R, BT5.2, on-chip 40MB PSRAM and 32MB Flash, 28X20mm, with shielding, printing antenna
FN-LINK TECHNOLOGY LIMITED 4
Revision History
Version Date ContentsofRevisionChange Draft Checked Approved V1.0 2021/10/25 Newversion FC LSP QJP V1.1 2021/12/29 Refine RF spec, add EVB info, add package info,updatemarkinginfoandorderinginfo. FC LSP QJP V1.2 2022/04/27 RefineRFspec ModifyPinDefinition FC LSP QJP V1.3 2022/05/13 Updatepackaginginformation FC LSP QJP V1.4 2022/07/08 Updatereelpicture,addconsumptiondata FC LSP QJP
FN-LINK TECHNOLOGY LIMITED 5 1. General Description
1.1 Introduction
V200Z-Risahighlyintegratedwirelessmodulewithvoice&audiofunctions.ItisbasedonBES2600 solutionwhichfeaturesaCortex-M33Stardual-coreMCUsubsystemandaCortex-A7dual-coreAP subsystem.BothMCUandAPsubsystemareabletorunRTOSanduserapplications. ThemodulesupportslowpowerWi-Fi4(1x1802.11a/b/g/ndual-band)andBluetooth5.2dual-mode(support BT/BLE,LEAudio).Besides,itprovidesahigh-performanceon-boardprintingantennatoreducethe complexityofhardwaredesign. V200Z-Ralsoprovidesavoice&audioCODECsubsystemandadisplaysubsystemwith2Dgraphicsengine. ItsupportsMIPIDSIHDdisplayuptoHD(720P60),supportsMIPICSICameraupto2MPixel,andsupports microphonearrayswithuptothreeanalogmicrophonesorsixdigitalmicrophonesforfar-fieldvoice application.MCUsubsystemrunsBluetoothupperprotocolstack,andAPsubsystemand2Dhardware GraphicsEnginecanaccelerateGUI&VUI,voice&audioprocessingandAItasks. Thiscompactmoduleisaperfectchoiceforsmartappliance,smartpanel,entranceguardandothersmart homeapplications.
1.2 Description
1.3 EVB information
Fn-LinkprovidesaevaluationsuiteforthedevelopmentandtestofV200Z-Rmodule.Itincludesan evaluationboard,a4inchLCDmodule,acameraModuleandUSBtype-Ccable. PleasecontactFn-LinksalesforEVBdocumentationandordering. ModelName V200Z-R ProductDescription SupportWi-Fi&Bluetooth,voice&audio,LCD&camera Dimension LxWxH:28x20x2.55mm Interface USB2.0,UART,I2C,I2S,SDIOdevice,MIPI,PWM,GPIO OS RTOS,OpenHarmony Operatingtemperature -20°Cto80°C Storagetemperature -30°Cto125°C
FN-LINK TECHNOLOGY LIMITED 6 2. Features CPU CMOSsingle-chipfully-integratedPMU,CODEC,RF,BB,MCUandAPsubsystem 300MHzARMCortex-M33Stardual-coreMCUsubsystem 1GHzARMCortex-A7dual-coreAPsubsystemwithNEON. Shared2MBSRAM,on-chipPSRAMandon-chipNORflashNote1 SupportTrustZoneandsecureboot Wi-Fi / BT 2.4GHz&5GHzdual-bandWi-Fi,1T1R,complianttoIEEE802.11a/b/g/n Support20MHzand40MHzbandwidth Bluetooth5.2dual-mode SupportBLEMeshandLEaudio A2DPv1.3/AVRCPv1.5/HFPv1.6 Wi-FiandBluetoothco-existence Audio Hi-FiStereoAudioDACandADC Far-fieldvoicewakeup 24bitaudioprocessing SupportAcousticEchoCancellation SupportDSD-64/128/256decode Peripheral interfaces MIPITxDSIandMIPIRxCSIinterface USB2.0HSHostorDevice 4xUARTinterface,withflowcontrolandconfigurablebaudrate 50MbpsSPIx2,withserialLCDsupport 1.4MbpsI2Cmasterx3 I2S/TDM PWMx8 10-bitGPADC,3channels Note1:Pleaserefertoorderinginformationfordetailedmemorysize.
FN-LINK TECHNOLOGY LIMITED 7 3. General Specification 3.1 Wi-Fi 2.4GHz Specification Feature Description WLANStandard IEEE802.11b/g/nWi-Ficompliant FrequencyRange 2.400GHz~2.4835GHz(2.4GHzISMBand) NumberofChannels 2.4GHz：Ch1~Ch14 Test Items Typical Value EVM OutputPower 802.11b/11Mbps:17±2dBm EVM -10dB 802.11g/54Mbps:16±2dBm EVM -25dB 802.11n/MCS7 :15±2dBm EVM -28dB SpectrumMask MeetwithIEEEstandard Freq.Tolerance ±20ppm SISOReceiveSensitivity (11b)@8%PER - 1Mbps PER@-95dBm - 11Mbps PER@-86dBm SISOReceiveSensitivity (11g)@10%PER - 6Mbps PER@-88dBm - 54Mbps PER@-73dBm SISOReceiveSensitivity (11n,20MHz)@10%PER - MCS=0 PER@-88dBm - MCS=7 PER@-70dBm SISOReceiveSensitivity (11n,40MHz)@10%PER - MCS=0 PER@-85dBm - MCS=7 PER@-66dBm MaximumInputLevel 802.11b:-8dBm 802.11g/n:-20dBm
3.2 Wi-Fi 5GHz Specification
WLANStandard IEEE802.11a/nWi-Ficompliant FrequencyRange 5.18GHz~5.825GHz NumberofChannels Pleaserefertotable1 Test Items Typical Value EVM 802.11a/54Mbps:15±2dBm EVM -25dB 802.11n/MCS7:14±2dBm EVM -28dB SpectrumMask MeetwithIEEEstandard Freq.Tolerance ±20ppm SISOReceiveSensitivity - 6Mbps PER@-87dBm
FN-LINK TECHNOLOGY LIMITED 8 (11a)@10%PER - 54Mbps PER@-70dBm SISOReceiveSensitivity (11n,20MHz)@10%PER - MCS=0 PER@-86dBm - MCS=7 PER@-68dBm SISOReceiveSensitivity (11n,40MHz)@10%PER - MCS=0 PER@-83dBm - MCS=7 PER@-65dBm MaximumInputLevel 802.11a:-20dBm 802.11n:-20dBm 15GHz(20MHz) Channel table Band range Operating Channel Channel center frequency (MHz) 5180MHz~5240MHz 36 5180 40 5200 44 5220 48 5240 5260MHz~5320MHz 52 5260 56 5280 60 5300 64 5320 5550MHz~5700MHz 100 5500 104 5520 108 5540 112 5560 116 5580 120 5600 124 5620 128 5640 132 5660 136 5680 140 5700 5745MHz~5825MHz 149 5745 153 5765 157 5785 161 5805 165 5825
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3.3 Bluetooth Specification
BluetoothStandard BluetoothV5.2 FrequencyBand 2402MHz~2480MHz NumberofChannels 79channelsforBDR/EDR,40channelsforBLE Modulation GFSK,π/4-DQPSK,8-DPSK RF Specification Min. Typical. Max. OutputPower-BDR/LE 8dBm OutputPower-EDR 6dBm Sensitivity@BER=0.1% forGFSK(1Mbps) -91dBm Sensitivity@BER=0.01% forπ/4-DQPSK(2Mbps) -89dBm Sensitivity@BER=0.01% for8DPSK(3Mbps) -83dBm Sensitivity@PER<30.8% forBLE -90dBm MaximumInputLevel GFSK(1Mbps):-20dBm π/4-DQPSK(2Mbps):-20dBm 8DPSK(3Mbps):-20dBm
FN-LINK TECHNOLOGY LIMITED 10 4. Block Diagram *5. ID setting information TBD.
FN-LINK TECHNOLOGY LIMITED 11 6. Pin Definition
6.1 Pin Outline
<TOPVIEW>
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6.2 Pin Definition details
NO Name Type Description Voltage
1 GND - Groundconnections
2 ANT1Note2 Analog OptionalWi-Fi&BTAntennaport,forexternalantenna
3 GND - Groundconnections
4 VMIC1 Analog
BiasvoltageoutputforexternalMICdevices.Outputrange1.5~3.3V. Suggest1uFdecouplingcapacitorandRCfilter.
5 MIC1_P Analog
MIC1Pport,maximuminputvoltage1.8V(PtoGND),pinrequires blockingcapacitor.
6 MIC1_N Analog
MIC1Nport,maximuminputvoltage1.8V(PtoGND),pinrequires blockingcapacitor.
7 GND - Groundconnections
8 MIC2_N Analog MIC2Nport,pleaserefertothedescriptionofMIC1
9 MIC2_P Analog MIC2Pport,pleaserefertothedescriptionofMIC1
10 GND - Groundconnections
11 MIC3_P Analog MIC3Pport,pleaserefertothedescriptionofMIC1
12 MIC3_N Analog MIC3Nport,pleaserefertothedescriptionofMIC1
13 GND - Groundconnections
14 DM Analog USB2.0D-,supporthighspeedandfullspeed 15 DP Analog USB2.0D+,supporthighspeedandfullspeed
16 GND - Groundconnections
17 SCLK I/O ExternalFlashserialclock 1.8V 18 HOLD I/O ExternalFlashHold 1.8V 19 SI I/O ExternalFlashserialinput 1.8V 20 SO I/O ExternalFlashserialoutput 1.8V 21 CE I/O ExternalFlashChipEnable 1.8V 22 WP I/O ExternalFlashWriteProtect 1.8V
23 GND - Groundconnections
24 VBAT Analog
VBAT power supply input, range 3.1~5.5V, typically 3.8V. This pin requiresexternalfiltercapacitor.
25 GND - Groundconnections
26 LED1 O
LEDpin,PMUperipheralIO.Suggestcathodedrivemode.Maximum sinkcurrent5mA.InternallyPUbydefault, 27 LED2 O LEDpin,pleaserefertothedescriptionofLED1.
28 KEY_SENSE I/O
Keypadsensepin,10-bitADCinputwithinterruptfunction.Max.
29 GPIO_14 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIONote3
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30 GPIO_15 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
31 GPIO_32 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
32 GPIO_33 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
33 GPIO_03 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
34 GPIO_07 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
35 GPIO_27 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
36 GPIO_26 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
37 GPIO_21 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
38 GPIO_05 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
39 GPIO_36 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
40 GPIO_37 I/O
GPIO,pleaserefertoGPIOMUXMappingfordetails, low-levelcathodedriveisnotrecommended, VDDIO
41 GPIO_34 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
42 GPIO_23 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
43 GPIO_24 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
44 GPIO_30 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
45 GPIO_12 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
46 GPIO_13 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
47 GPIO_31 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
48 GND - Groundconnections
49 CSI_DN1 I/O CMOSsensorinterface,Channel1_DATA_Negative
50 CSI_DP1 I/O CMOSsensorinterface,Channel1_DATA_Positive
51 CSI_DN0 I/O CMOSsensorinterface,Channel0_DATA_Negative
52 CSI_DP0 I/O CMOSsensorinterface,Channel0_DATA_Positive
53 CSI_CLKN I/O CMOSsensorinterface,Channel_Clock_Negative
54 CSI_CLKP I/O CMOSsensorinterface,Channel_Clock_Positive
55 GND - Groundconnections
56 DSI_CLKP I/O Displaysensorinterface,Channel_Clock_Positive
57 DSI_CLKN I/O Displaysensorinterface,Channel_Clock_Negative
58 DSI_DN0 I/O Displaysensorinterface,Channel0_DATA_Negative
59 DSI_DP0 I/O Displaysensorinterface,Channel0_DATA_Positive
60 DSI_DN1 I/O Displaysensorinterface,Channel1_DATA_Negative
61 DSI_DP1 I/O Displaysensorinterface,Channel1_DATA_Positive
62 GND - Groundconnections
63 GPIO_00 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
64 GPIO_01 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
65 GPIO_11 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
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66 GPIO_02 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
67 GPIO_06 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
68 RESET I
Hardwareresetinput,activehigh.Keepit>2/3*VBATformorethan 250mstoachieveareset. VBAT
69 POWKEY I
Hardwarepoweroninput,activehigh.Keepit>2/3*VBATformore than1ms(softwareconfigurable). VBAT 70 ADC0 Analog ADCchannel0input,10-bit,doesnotsupportinterruptfunction.Max. 71 ADC2 Analog ADCchannel2input,10-bit,doesnotsupportinterruptfunction.Max. 72 ADC1 Analog ADCchannel1input,10-bit,doesnotsupportinterruptfunction.Max.
73 GPIO_10 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
74 GPIO_35 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
75 NC Please keep it floating
76 GPIO_25 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
77 GPIO_22 I/O GPIO,pleaserefertoGPIOMUXMappingfordetails VDDIO
78 NC Please keep it floating
79 UART_RX I UART0input,forFWdownloadanddebug VDDIO
80 UART_TX O UART0output,forFWdownloadanddebug VDDIO
81 LOUT_RP Analog
Channelrightdifferentialdriveoutputpport.Itisrecommendedto reservefiltercircuitandESDprotector.
82 LOUT_RN Analog
Channelrightdifferentialdriveoutputnport.Itisrecommendedto reservefiltercircuitandESDprotector.
83 LOUT_LN Analog
Channelleftdifferentialdriveoutputnport.Itisrecommendedto reservefiltercircuitandESDprotector.
84 LOUT_LP Analog
Channelleftdifferentialdriveoutputpport.Itisrecommendedto reservefiltercircuitandESDprotector.
85 GND - Groundconnections
Note2:Useon-boardantennabydefault.PleasecontactFn-Linkifyoupreferexternalantenna. Note3:VDDIO=3.3Vbydefault.
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6.3 GPIO MUX Mapping
Maximumsourcecurrent10mAforeachIOand50mAfortotal. OutputstatecanbeconfiguredasstrongPUorPL,inputstatecanbeconfiguredashigh-Z,PU,PLornopull. Allofthemhaveinterruptfunction. GPIO state will be low impedance input when the module is power off, so we do not suggest low level cathode drivemode. FordetailedMUXmapping,pleaserefertobelowtable. 7. Electrical Specifications
7.1 Absolute Maximum RatingsNote4
Symbol Description Min. Typ. Max. Unit TA AmbientTemperature -30 80 ℃ VBAT SupplyVoltage 6 V VIN IOInputVoltage -0.3 VDDIO+0.3 V IIN IOInputCurrent -10 10 mA VLNA LNAInputLevel 0 dBm Note4:Stressesbeyondthoselistedabsolutemaximumratingsmaycausepermanentdamagetothedevice.These arestressratingsonly,andfunctionaloperationsofthedeviceattheseoranyotherconditionsbeyondthose indicatedunderrecommendedoperatingconditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditions forextendedperiodsmayaffectdevicereliability.
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7.2 Operating Conditions
Symbol Description Min. Typ. Max. Unit TA AmbientTemperature -20 25 80 ℃ VBAT SupplyVoltage 3.1 3.8 5.5 V VIL CMOSLowLevelInputVoltage 0 0.3*VDDIONote5 V VIH CMOSHighLevelInputVoltage 0.7*VDDIO VDDIO V VOL IOLowlevelOutputVoltage 0.1*VDDIO V VOH IOHighlevelOutputVoltage 0.9*VDDIO V VTH CMOSThresholdVoltage 0.5*VDDIO V Note5:VDDIO=3.3Vbydefault.
7.3 Power consumption
TestCondition State ConsumptionAvg.(mA) ThroughputTx ThroughputRx Throughputstate VBAT=3.8V Standby 92 2.4G11b11M 375 172 2.4G11g54M 298 173 2.4G11nHT20 275 160 2.4G11nHT40 226 165 5.8G11a54M 279 173 5.8G11nHT20 271 170 5.8G11nHT40 222 172 Note6：Above consumption data are tested at Wi-Fi (STA mode) throughput state with BT on. Moreover, a much higher current spike may occur while module initializing, sopleasemakesureIPEAKofVBATsupplyismorethan1.5A.
FN-LINK TECHNOLOGY LIMITED 17 8. Size reference
8.1 Module Picture
W: 20 (+/-0.1)mm H:2.55(±0.2)mm Weight 2.2g
8.2 Marking Description
<TOPVIEW>
8.3 Physical Dimensions
<TOPView>
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8.4 Layout Recommendation
<TOPView>
FN-LINK TECHNOLOGY LIMITED 19 9. The Key Material List Chipset BES2600,BGA-169L,6.6x6.8mm,Pitch0.5mm Bestechnic PCB V200Z-R,28X20X0.8mm,4LHDI,Matteblack Brain-power,KX-PCB,SL-PCB,Sunlord Crystal 3225,24MHz,10ppm TST,HOSONIC,TKD,ECEC,JWT Inductor 2520,2.2uH,±20% Sunlord,Cenke,Ceaiya,Microgate Shielding V200Z-R,Shieldingcover,18.5x18.6x1.7mm,T=0.2mm Suntech,JLT 10. Recommended Reflow Profile ReferredtoIPC/JEDECstandard. PeakTemperature:<260°C NumberofTimes:2times
FN-LINK TECHNOLOGY LIMITED 20 11. RoHS compliance AllhardwarecomponentsarefullycompliantwithEURoHSdirective 12. Package
12.1 Reel
FN-LINK TECHNOLOGY LIMITED 21
12.2 Carrier Tape Detail
12.3 Packaging Detail
Widthofblacktape:44mm thecovertape :37.5mm Colorofplasticdisc:blue
FN-LINK TECHNOLOGY LIMITED 22 NYbagsize:500mm*420mm size ：335X335X55mm Thepackingcasesize:360*210*370mmg 13. Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020,takecare alltherelativesrequirementsforusingthiskindofcomponents. Moreover,thecustomerhastotakecareofthefollowingconditions: a)Calculatedshelflifeinsealedbag:12monthsat<40°Cand<90%relativehumidity(RH) b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph5 c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition d)“IPC/JEDECJ-STD-033Aparagraph5.2”isrespected e)Bakingisrequiredifconditionsb)orc)arenotrespected f)Bakingisrequiredifthehumidityindicatorinsidethebagindicates10%RHormore