UPGA301AE3 MICROSEMI | Alldatasheet
Document overview
- Manufacturer or author: Paul Pickle
- PDF pages: 4
Technical content
Copyright © 2005 7-17-05, Rev D WWW.Microsemi .COM UPGA301Ae3 Nanosecond SCR SWITCH S C O T T S D A L E D I V I S I O N D E S C R I P T I O N The UPGA301Ae3 is Designed for high current narrow-pulse switching applications where size and current handling capability are critical. These devices may be triggered on using low power logic drivers from (+0.8 V at 200 μA). Epoxy packaged, oxide passivated planar SCR chips with metallurgic bonds on both sides to achieve high reliability. Internal wire bond connection allows high current surge capability for narrow pulse applications. IMPORTANT: For the most current data, consult MICROSEMI’swebsite:http://www.microsemi.com ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) Rating Symbol Value Unit Repetative peak Off-State Voltage VDRM 100 V Peak On-State Current for 50 ns (max) ITSM 100 A Peak Gate Current IGM 250 mA Reverse Gate Voltage VGR V Storage Temperature Range T s -50 to 150 ºC Operating Temperature Range T J 0 to 125 ºC THERMAL CHARACTERISTICS (UNLESS OTHERWISE SPECIFIED) (1)When mounted on 0.06’ thick FR4 board with 2 oz copper FR4 board with recommended footprint Thermal Resistance Junction-to-Case (Anode Bottom) RθJC 4.0 ºC/Watt Junction-to-Ambient (1) RθJA ºC/Watt Small foot print .190 X .270 inches 1:1 Actual size See mounting pad details on pg 3 K E Y F E A T U R E S Very low thermal resistance package Efficient heat path with integral locking bottom metal tab Full metallic bottom eliminates flux entrapment RoHS Compliant with e3 suffix High speed switching capability Compatible with high-speed insertion Low profile height of 1 mm APPLICATIONS/BENEFITS Reference Microsemi MicroNote 601 and 602 Nanosecond SCR switch for reliable high current pulse generators, modulators and photo-flash quenching Logic drive capability (0.8V, 200μA) Ideal for Laser Range finder and Camera Applications Ideal for Automotive Collision Avoidance Applications MECHANICAL & PACKAGING
- CASE: Void-free transfer molded thermosetting epoxy compound meeting UL94V-0
- FINISH: Annealed matte-Tin plating over copper and readily solderable per MIL-STD-750 method 2026 (consult factory for Tin-Lead plating)
- POLARITY: See figure (left)
- MARKING: 301A•
- WEIGHT: 0.072 gram (approx.)
- Package dimensions on last page
- Tape & Reel option: 16 mm tape per Standard EIA-481-B, 5000 on 13” reel UUPPG GAA330011AA 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 1
Copyright © 2005 7-17-05, Rev D WWW.Microsemi .COM UPGA301Ae3 Nanosecond SCR SWITCH S C O T T S D A L E D I V I S I O N E L E C T R I C A L P A R A M E T E R S @ 2 5 ° C ( u n l e s s o t h e r w i s e s p e c i f i e d ) Parameter Symbol Conditions Min. Typ. Max. Units \ On characteristics (up to 100 A w/ 100 ns pulse @ Duty Cycle = 0.0001% or less) Forward Blocking Current IDRM VDRM = 100 V, RGK = 1 kΩ 1.0 μA On - State Voltage VT IT = 1 A, Ig =10 mA 1.1 1.5 V Gate Trigger Voltage VGT VD = 5 V, RGS = 100 Ω 0.5 0.75 V Gate Trigger Current IGT VD = 5 V, RGS = 10 kΩ 200 μA Reverse Gate Current IGR VGR = 5 V 0.01 0.1 mA Holding Current IH VD = 5 V, RGK = 1 kΩ 1.0 3.0 5.0 mA Reverse Current (Note 1) IRRM VRRM = 30 V, RGK = 1 kΩ mA \ Switching characteristics (Tc = 25 °C) td Ig = 20 mA, IT = 1 A ns Delay Time VD = 60 V, IT =1 A, Ig =10 mA dc < 1% Rise Time Note 1: Pulse Test intended to guarantee reverse anode voltage capability for pulse commutation. The device should not be operated in the reverse blocking mode on a continuous basic tr ns IT = 1.0 A , IR = 1.0 A max, RGK = 1 kΩ Circuit Commutated Turn—off Time tq 0.3 0.5 μs tpg(on) Ig = 10 mA, IT = 1 A Gate Trigger—on Pulse Width ns Critical Rate of Rise dv/dt V Off –State Voltage D = 30 V, RGK = 1 kΩ V/μs EELLEECCTTRRIICCAALLSS 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 2
Copyright © 2005 7-17-05, Rev D WWW.Microsemi .COM UPGA301Ae3 Nanosecond SCR SWITCH S C O T T S D A L E D I V I S I O N Case: Molded Epoxy Meets UL94V-O at 1/8 inch Weight: 72 milligrams Lead and Mounting Temperature: 260°C max for 10 seconds NOTE: All dimensions are in inches. PPAACCK KAAG GEE DDAATTAA 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 3
Copyright © 2005 7-17-05, Rev D WWW.Microsemi .COM UPGA301Ae3 Nanosecond SCR SWITCH S C O T T S D A L E D I V I S I O N NOTES: NNO OTTEESS 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 4