UPG2054K-E3

UPG2054K NEC | Alldatasheet

Document overview

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Technical content

FEATURES

• High isolation : ISL = 40 dB TYP. @ f = 0.95 to 2.15 GHz, V CONT = +5.0 V/0 V  Control voltage : V CONT (H) = +3.0 to +5.5 V (+5.0 V TYP.) : V CONT (L) = −0.5 to +0.5 V (0 V TYP.)  20-pin 4 × 4 mm square micro lead package (20-pin plastic QFN (0.5 mm pitch))

APPLICATIONS

 Direct Broadcast Satellite (DBS)  Switch Box  4 × 2 switch matrix to L, S band applications

ORDERING INFORMATION

Part Number Order Number Package Marking Supplying Form µPG2054K-E3 µPG2054K-E3-A 20-pin plastic QFN (0.5 mm pitch) (Pb-Free) Note G2054 • Embossed tape 12 mm wide

• Pin 1 to 5 face the perforation side of the tape
• Qty 3 kpcs/reel Note With regards to terminal solder (the solder contai ns lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2054K DATA SHEET Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. GaAs MMIC DBS 4 x 2 IF SWITCH MATRIX GaAs INTEGRATED CIRCUIT µPG2054K Document No. PG10550EJ01V0DS (1st edition) Date Published December 2004 CP(K) Printed in Japan  NEC Compound Semiconductor Devices, Ltd. 2004

ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Ratings Unit Supply Voltage V DD −1.0 to +6.0 V Control Voltage V CONT1 to 4 −1.0 to +6.0 V Total Power Dissipation P tot 2 Note W Input Power P in +10 dBm Operating Ambient Temperature T A −40 to +85 °C Storage Temperature T stg −65 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING CONDITIONS (TA = +25°C) Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage Note Control Voltage (H) Note V CONT (H) +3.0 +5.0 +5.5 V Control Voltage (L) V CONT (L) −0.5 0 +0.5 V Note VCONT (H) − VCONT (L) ≥ 3.0 V, VDD − VCONT (H) ≤ 0.3 V

ELECTRICAL CHARACTERISTICS

(TA = +25°C, VDD = +5.0 V, VCONT = +5.0 V/0 V, Pin = 0 dBm, ZO = 50 Ω, each port, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss L INS f = 0.95 to 2.15 GHz − 6.0 8.0 dB Insertion Loss Flatness ∆LINS  LINS (0.95 GHz) − LINS (2.15 GHz)  − 0.5 1.5 dB Isolation D/U-ratio Note 1 ISL f = 0.95 to 2.15 GHz 35 40 − dB Output Return Loss RL out f = 0.95 to 2.15 GHz 10 15 − dB Control Current Note 2 I CONT V CONT = +5.0 V/0 V, non-RF − − 0.5 mA Supply Current I DD V CONT = +5.0 V/0 V, non-RF − − 2.0 mA Notes 1. Isolation D/U-ratio = (Signal leakage (off-state)) − (Insertion loss (on-state)) 2. Per 1 control pin Data Sheet PG10550EJ01V0DS 2 µPG2054K

Pin No. Pin Name Pin No. Pin Name

1 V CONT1 11 GND

2 V CONT2 12 IN-C

3 GND 13 GND

4 IN-A 14 V CONT4

5 GND 15 V CONT3

6 IN-B 16 OUT2

7 GND 17 GND

8 GND 18 V DD

9 GND 19 GND

(GND)(GND) (GND) (GND) (Top View) (Bottom View) GND 54321 1112131415 (GND)(GND) (GND) (GND) Pin 1 Identifier

10 IN-D 20 OUT1

Data Sheet PG10550EJ01V0DS 3 µPG2054K

ON CHANNEL CONTROL PINS State OUT1 OUT2 V CONT1 V CONT2 V CONT3 V CONT4

1 IN-A IN-A Low Low Low Low

2 IN-B Low Low Low High

3 IN-C Low Low High Low

4 IN-D Low Low High High

5 IN-B IN-A Low High Low Low

6 IN-B Low High Low High

7 IN-C Low High High Low

8 IN-D Low High High High

9 IN-C IN-A High Low Low Low

10 IN-B High Low Low High

11 IN-C High Low High Low

12 IN-D High Low High High

13 IN-D IN-A High High Low Low

14 IN-B High High Low High

15 IN-C High High High Low

16 IN-D High High High High

Remark High : +5 Vdc, Low : 0 Vdc. FUNCTIONAL DIAGRAM 4 : 16 DECODER VCONT1 VCONT2 GND IN-A GND IN-B GND GND GND IN-D VCONT3 VCONT4 GND IN-C GND OUT1 VDD GND GND OUT2 (GND)(GND) (GND)(GND) Data Sheet PG10550EJ01V0DS 4 µPG2054K

EVALUATION CIRCUIT (VDD = +5.0 V, VCONT = +5.0 V/0 V, ZO = 50 Ω) VCONT3 1 000 pF GND VCONT4 1 000 pF IN-C OUT2 DC Blocking Capacitor C = 1 000 pF GND GND OUT1 IN-D IN-B GND GND VCONT2 1 000 pF IN-A GND VCONT1 1 000 pFDC Blocking Capacitor C = 1 000 pF 1 000 pF 1 000 pF 1 000 pF 1 000 pF Back Side : GND (GND)(GND) (GND)(GND) Pin 1 Identifier GND GND VDD RF Bypass Capacitor C = 1 000 pF GND The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet PG10550EJ01V0DS 5 µPG2054K

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Notes 1. Size : 45 × 45 mm 2. Material : RO4003 (Rogers), t = 0.51 mm, εr = 3.38 3. : Through holes Data Sheet PG10550EJ01V0DS 6 µPG2054K IN-B IN-D IN-A IN-C VCONT4 VCONT3 OUT2 VDD OUT1 VCONT2 VCONT1 DC Block Capacitor × 6 pcs

(TA = +25°C, VDD = +5.0 V, VCONT = +5.0 V/0 V, Pin = 0 dBm, ZO = 50 Ω, unless otherwise specified) –10 Insertion Loss LINS (dB) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY –20 –15 –10 –30 –25 –40 –35 –45 –50 Input Return Loss RLin (dB) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY On channel mode : AA, BB, CC,DD Other mode –10 –30 –20 –40 –50 –60 –70 –80 –90 –100 SIGNAL LEAKAGE (dB) Frequency f (GHz) SIGNAL LEAKAGE vs. FREQUENCY Input selected Input deselected –20 –15 –10 –30 –25 –40 –35 –45 –50 Output Return Loss RLout (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Input selected (MODE : AA, BB, CC, DD) Remark The graphs indicate nominal characteristics. Data Sheet PG10550EJ01V0DS 7 µPG2054K

–3.0 –4.0 –5.0 –6.0 –7.0 –8.0 AA Insertion Loss LINS (dB) ON CHANNEL MODE INSERTION LOSS vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 0.95 GHz –3.0 –4.0 –5.0 –6.0 –7.0 –8.0 AA Insertion Loss LINS (dB) ON CHANNEL MODE INSERTION LOSS vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 1.5 GHz –3.0 –4.0 –5.0 –6.0 –7.0 –8.0 AA Insertion Loss LINS (dB) ON CHANNEL MODE INSERTION LOSS vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 2.15 GHz –30 –35 –45 –50 –55 –60 AA Isolation D/U-Ratio ISL (dB) ON CHANNEL MODE ISOLATION D/U-RATIO vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 0.95 GHz –40 –30 –35 –45 –50 –55 –60 AA Isolation D/U-Ratio ISL (dB) ON CHANNEL MODE ISOLATION D/U-RATIO vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 1.5 GHz –40 –30 –35 –45 –50 –55 –60 AA Isolation D/U-Ratio ISL (dB) ON CHANNEL MODE ISOLATION D/U-RATIO vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 2.15 GHz –40 Remark The graphs indicate nominal characteristics. Data Sheet PG10550EJ01V0DS 8 µPG2054K

–15 –25 –30 –40 AA Output Return Loss (Worth case) RLout (dB) ON CHANNEL MODE OUTPUT RETURN LOSS (WORSE CASE) vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 0.95 GHz –10 –20 –35 –15 –25 –30 –40 AA Output Return Loss (Worth case) RLout (dB) ON CHANNEL MODE OUTPUT RETURN LOSS (WORSE CASE) vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 1.5 GHz –10 –20 –35 –15 –25 –30 –40 AA Output Return Loss (Worth case) RLout (dB) ON CHANNEL MODE OUTPUT RETURN LOSS (WORSE CASE) vs. ON CHANNEL MODE AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD f = 2.15 GHz –10 –20 –35 –3.0 –5.0 –7.0 –9.0 Insertion Loss LINS (dB) Operating Ambient Temperature TA (°C) INSERTION LOSS vs. OPERATING AMBIENT TEMPERATURE –40°C +25°C +85°C f = 0.95 GHz –4.0 –6.0 –8.0 –3.0 –5.0 –7.0 –9.0 Insertion Loss LINS (dB) Operating Ambient Temperature TA (°C) INSERTION LOSS vs. OPERATING AMBIENT TEMPERATURE –40°C +25°C +85°C f = 1.5 GHz –4.0 –6.0 –8.0 –3.0 –5.0 –7.0 –9.0 Insertion Loss LINS (dB) Operating Ambient Temperature TA (°C) INSERTION LOSS vs. OPERATING AMBIENT TEMPERATURE –40°C +25°C +85°C f = 2.15 GHz –4.0 –6.0 –8.0 Remark The graphs indicate nominal characteristics. Data Sheet PG10550EJ01V0DS 9 µPG2054K

–30 –40 –50 –60 Isolation D/U-Ratio ISL (dB) Operating Ambient Temperature TA (°C) ISOLATION D/U-RATIO vs. OPERATING AMBIENT TEMPERATURE –40°C +25°C +85°C f = 0.95 GHz –35 –45 –55 –30 –40 –50 –60 Isolation D/U-Ratio ISL (dB) Operating Ambient Temperature TA (°C) ISOLATION D/U-RATIO vs. OPERATING AMBIENT TEMPERATURE –40°C +25°C +85°C f = 1.5 GHz –35 –45 –55 –30 –40 –50 –60 Isolation D/U-Ratio ISL (dB) Operating Ambient Temperature TA (°C) ISOLATION D/U-RATIO vs. OPERATING AMBIENT TEMPERATURE –40°C +25°C +85°C f = 2.15 GHz –35 –45 –55 Remark The graphs indicate nominal characteristics. Data Sheet PG10550EJ01V0DS 10 µPG2054K

20-PIN 4 × 4 mm SQUARE MICRO LEAD PACKAGE (20-PIN QFN (0.5 mm pitch)) (UNIT: mm) (Bottom View) 4.15±0.15 3.80±0.1 4.15±0.15 3.80±0.1 Pin 1 0.6 MAX. 0.6 MAX. 0.50 1.9 1.9 0.20 Pin 1 0.45 0.9±0.1 Pin 1 Identifier Pin 1 Identifier (Top View) (Side View) 0.45+0.2 –0.1 0.23+0.07 –0.05 0.01+0.04 –0.01 Data Sheet PG10550EJ01V0DS 11 µPG2054K

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Partial Heating Peak temperatur e (terminal temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating). Data Sheet PG10550EJ01V0DS 12 µPG2054K

When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. M8E 00. 4 - 0110 The information in this document is current as of December, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). Data Sheet PG10550EJ01V0DS 13 µPG2054K

Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points.  Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal.  Do not burn, destroy, cut, crush, or chemically dissolve the product.  Do not lick the product or in any way allow it to enter the mouth. NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 For further information, please contact µPG2054K