UPG2031TQ-E1

UPG2031TQ NEC | Alldatasheet

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Technical content

Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. L-BAND SP3T SWITCH GaAs INTEGRATED CIRCUIT µPG2031TQ Document No. PG10436EJ01V0DS (1st edition) Date Published September 2003 CP(K) Printed in Japan  NEC Compound Semiconductor Devices 2003

DESCRIPTION

The µPG2031TQ is an L-band SP3T GaAs FET switch whic h was developed for CDMA/PCS/GPS triple mode digital cellular telephone application. The device can operate from 500 MHz to 2. 0 GHz, having the low insertion loss and high linality.

FEATURES

• Low insertion loss : L INS = 0.45 dB TYP. @ Vcont = 2.8 V/0 V, f = 1.0 GHz : L INS = 0.55 dB TYP. @ Vcont = 2.8 V/0 V, f = 2.0 GHz  High isolation : ISL = 21 dB TYP. @ V cont = 2.8 V/0 V, f = 2.0 GHz  High-density surface mounting : 10- pin plastic TSON package (2.30 × 2.55 × 0.60 mm) APPLICATION  CDMA/PCS/GPS triple mode digital cellular telephone etc.

ORDERING INFORMATION

Part Number Package Marking Supplying Form µPG2031TQ-E1 10-pin plastic TSON 2031 • Embossed tape 8 mm wide

• Pin 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2031TQ

Data Sheet PG10436EJ01V0DS 2 µPG2031TQ PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name

1 RF1

2 GND

3 RF2

4 V cont2

5 RF3

6 V cont3

7 GND

8 ANT

9 GND

(Top View) 6789 1 0 54321 (Bottom View) GND

10 V cont1

ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Ratings Unit Switch Control Voltage V cont −6.0 to +6.0 V Input Power P in +36 dBm Operating Ambient Temperature T A −45 to +85 °C Storage Temperature T stg −55 to +150 °C RECOMMENDED OPERATING RANGE (TA = +25°C) Parameter Symbol MIN. TYP. MAX. Unit Switch Control Voltage (High) V cont (H) 2.7 2.8 3.0 V Switch Control Voltage (Low) V cont (L) −0.2 0 0.2 V

Data Sheet PG10436EJ01V0DS 3 µPG2031TQ ELECTRICAL CHARACTERISTICS (T A = +25 °C, Vcont = 2.8 V/0 V, Z O = 50 Ω, off chip DC blocking capacitors value: 56 pF, unless otherwise specified) Parameter Symbol ON-Pass Test Conditions MIN. TYP. MAX. Unit Insertion Loss L INS ANT-RF1/2/3 f = 0.5 to 1.0 GHz − 0.45 0.65 dB f = 1.0 to 2.0 GHz − 0.55 0.80 dB Isolation ISL ANT-RF1/2/3 f = 0.5 to 1.0 GHz 22 26 − dB (OFF) f = 1.0 to 2.0 GHz 17 21 − dB Input Return Loss RL in ANT-RF1/2/3 f = 0.5 to 2.0 GHz 15 20 − dB Output Return Loss RL out ANT-RF1/2/3 f = 0.5 to 2.0 GHz 15 20 − dB 0.1 dB Gain Compression Input Power Pin (0.1 dB) ANT-RF1/2/3 f = 1.0 GHz 31.0 33.0 − dBm 2nd Harmonics 2f0 ANT-RF1/2/3 f = 1.0 GHz, Pin = 27 dBm 65 75 − dBc 3rd Harmonics 3f0 ANT-RF1/2/3 f = 1.0 GHz, Pin = 27 dBm 65 75 − dBc Switch Control Speed t sw − 150 − ns Switch Control Current I cont RF Non − 1 50 µA

Data Sheet PG10436EJ01V0DS 4 µPG2031TQ EVALUATION CIRCUIT Vcont1 ANT Vcont3 LESD Note RF1 RF2 RF3 C1C2 Vcont2 2031 Note Recommend attached L ESD to antenna port for ESD protection. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. USING THE NEC EVALUATION BOARD Symbol Values C1 56 pF C2 1 000 pF TRUTH TABLE Vcont1 GND ANT GND V cont3 RF1 GND RF2 Vcont2 RF3 Vcont1 V cont2 V cont3 ANT-RF1 ANT-RF2 ANT-RF3 High Low Low ON OFF OFF Low High Low OFF ON OFF Low Low High OFF OFF ON

Data Sheet PG10436EJ01V0DS 5 µPG2031TQ PACKAGE DIMENSIONS 10-PIN PLASTIC TSON (UNIT: mm) (Bottom View) (0.15) (1.70) (0.30) (0.95) (0.05) (1.95) (0.30) 0.40±0.052.25±0.1 2.55±0.15 0.18±0.05 2.20±0.1 2.30±0.15 (0.125) (0.60 MAX.) Remark ( ) : Reference value

Data Sheet PG10436EJ01V0DS 6 µPG2031TQ RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating).

Data Sheet PG10436EJ01V0DS 7 µPG2031TQ M8E 00. 4 - 0110 The information in this document is current as of September, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product be fore using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).

NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-01 FAX: +49-211-6503-487 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0307 NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@csd-nec.com (sales and general) techinfo@csd-nec.com (technical) 5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 For further information, please contact µPG2031TQ Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points.  Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal.  Do not burn, destroy, cut, crush, or chemically dissolve the product.  Do not lick the product or in any way allow it to enter the mouth.