UPG2030TK NEC | Alldatasheet

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Technical content

UPG2030TKNEC's 1 W ULTRA SMALL SPDT SWITCH California Eastern Laboratories

  • SWITCH CONTROL VOLTAGE: V cont (H) = 2.7 to 3.0 V (2.8 V TYP.) V cont (L) = −0.2 to +0.2 V (0 V TYP.)
  • LOW INSERTION LOSS: 0.25 dB TYP. @ 0.5 to 1.0 GHz 0.30 dB TYP. @ 1.0 to 2.0 GHz 0.35 dB TYP. @ 2.0 to 2.5 GHz
  • HIGH ISOLATION: 27 dB TYP. @ 0.5 to 2.0 GHz 24 dB TYP. @ 2.0 to 2.5 GHz
  • POWER HANDLING: P in (1 dB) = +30.0 dBm TYP. @ 2.0 GHz, Vcont = 2.8 V/0 V (Reference value)
  • HIGH-DENSITY SURFACE MOUNTING: 6-pin minimold package (1.5 × 1.1 × 0.55 mm)
  • PB-FREE

FEATURES

ORDERING INFORMATION

Remark To order evaluation samples, contact your nearby sales offi ce. Part number for sample order: UPG2030TK-A NEC's UPG2030TK is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and L, S-band applications. This device has low insertion loss and high isolation, and can operate from 0.5 to 3 GHz at 2.7 to 3.0 V. This device is housed in a 6-pin low profi le, Pb-Free minimold package and this package is also suitable for high-density surface mounting.

DESCRIPTION

  • CELLULAR AND CORDLESS HANDSETS
  • PCS, BLUETOOTH™, WLAN, AND WLL
  • SHORT RANGE WIRELESS

APPLICATIONS

PART NUMBER PACKAGE MARKING SUPPLYING FORM UPG2030TK-E2-A 6-pin lead-less minimold (1511) G3R • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel

PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM TRUTH TABLE ABSOLUTE MAXIMUM RATINGS (TA =+25ºC, unless otherwise specifi ed) PIN NO. PIN NAME

1 OUTPUT1

2 GND

3 OUTPUT2

5 INPUT

VCONT1 VCONT2 INPUT−OUTPUT1 INPUT −OUTPUT2 Low High ON OFF High Low OFF ON PARAMETER SYMBOL RATINGS UNIT Switch Control Voltage V cont 6.0 V Input Power P in +33 dBm Operating Ambient Temperature T A −45 to +85 °C Storage Temperature T stg −55 to +150 °C PARAMETER SYMBOL MIN. TYP. MAX. UNIT Switch Control Voltage (H) V cont (H) 2.7 2.8 3.0 V Switch Control Voltage (L) V cont (L) −0.2 0 0.2 V RECOMMENDED OPERATING RANGE (TA =+25ºC, unless otherwise specifi ed) (Top View) G3R (Bottom View) (Top View)

ELECTRICAL CHARACTERISTICS

(TA = +25°C, Vcont = 2.8V/0 V , DC blocking capacotors = 56 pF, unless otherwise specifi ed) Notes P in (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Insertion Loss 1 L INS1 f = 0.5 to 1.0 GHz − 0.25 0.45 dB Insertion Loss 2 L INS2 f = 1.0 to 2.0 GHz − 0.30 0.50 dB Insertion Loss 3 L INS3 f = 2.0 to 2.5 GHz − 0.35 0.55 dB Isolation 1 ISL 1 f = 0.5 to 2.0 GHz 23 27 − dB Isolation 2 ISL 2 f = 2.0 to 2.5 GHz 20 24 − dB Input Return Loss RL in f = 0.5 to 2.5 GHz 15 20 − dB Output Return Loss RL out f = 0.5 to 2.5 GHz 15 20 − dB 0.1 dB Gain Compression Input Power Note Pin (0.1 dB) f = 2.0 GHz +25.5 +27.0 − dBm f = 2.5 GHz +25.5 +27.0 − dBm Switch Control Current I cont No signal − 42 0 μA Switch Control Speed t SW − 50 500 ns STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specifi ed) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT 1 dB Gain Compression Input Power Note Pin (1 dB) f = 2.0 GHz − +30.0 − dBm Notes P in (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with the actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF for frequencies above 0.5 GHz, and 1,000 pF for frequencies below 0.5 GHz.

EVALUATION CIRCUIT (Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Vcont1 Vcont2 OUTPUT1 OUTPUT2 INPUT 56 pF 56 pF56 pF 1000 pF1000 pF 456 321

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD G3R USING THE NEC EVALUATION BOARD SYMBOL VALUES C1, C2, C3 56 pF C4, C5 1000 pF

TYPICAL CHARACTERISTICS (TA = +25°C, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specifi ed) 0.5 0.4 0.2 0.3 0.1 -0.1 -0.2 -0.3 -0.4 -0.5 Insersion Loss LINS (dB) Frequency f (GHz) INPUT-OUTPUT1 INSERSION LOSS vs. FREQUENCY 0.5 0.4 0.2 0.3 0.1 -0.1 -0.2 -0.3 -0.4 -0.5 Insersion Loss LINS (dB) Frequency f (GHz) INPUT-OUTPUT2 INSERSION LOSS vs. FREQUENCY -10 -30 -20 -40 -50 Isolation ISL (dB) Frequency f (GHz) INPUT-OUTPUT1 ISOLATION vs. FREQUENCY -10 -30 -20 -40 -50 Input Return Loss RLin (dB) Frequency f (GHz) INPUT-OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY -10 -30 -20 -40 -50 Isolation ISL (dB) Frequency f (GHz) INPUT-OUTPUT2 ISOLATION vs. FREQUENCY -10 -30 -20 -40 -50 Input Return Loss RLin (dB) Frequency f (GHz) INPUT-OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY Remark The graphs indicate nominal characteristics.

TYPICAL CHARACTERISTICS (TA = +25°C, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specifi ed) UPG2030TK -10 -30 -20 -40 -50 Output Return Loss RLout (dB) Frequency f (GHz) INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY -10 -30 -20 -40 -50 Output Return Loss RLout (dB) Frequency f (GHz) INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 10 15 20 25 30 35 40 Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER f = 1.0 GHz 10 15 20 25 30 35 40 Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER f = 2.5 GHz Remark The graphs indicate nominal characteristics.

6-PIN LEAD-LESS MINIMOLD (1511) (UNIT:mm) Remark ( ) : Reference value 0.48±0.050.48±0.05

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales offi ce. Soldering Method Soldering Conditions Condition Symbol Infrared Refl ow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of refl ow processes : 3 times Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of refl ow processes : 3 times Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of fl ow processes : 1 time Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). A Business Partner of NEC Compound Semiconductor Devices, Ltd. 08/30/2004