UPG2015TB NEC | Alldatasheet

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Technical content

FEATURES

NEC's 1W SINGLE CONTROL L, S-BAND SPDT SWITCH UPG2015TB California Eastern Laboratories

APPLICATIONS

• L, S-band digital cellular or cordless handsets • PCS, W-LAN, WLL and BluetoothTM • Short Range Wireless NEC's UPG2015TB is a single control GaAs MMIC L, S-band SPDT (Single Pole Do uble Throw) switch for mobile phone and L, S-band applications. This device can operate frequency from 0.5 to 2.5 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin su per minimold package, suitable for high-density surface mounting.

DESCRIPTION

• SUPPLY VOLTAGE: V DD = 2.7 to 3.0 V (2.8 V TYP.) • SINGLE SWITCH CONTROL VOLTAGE: V cont (H) = 2.7 to 3.0 V (2.8 V TYP.) V cont (L) = −0.2 to +0.2 V (0 V TYP.) • LOW INSERTION LOSS: • HIGH ISOLATION: ISL2 = 24 dB TYP. @ f =2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V • POWER HANDLING: • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) Part Number Package Marking Supplying Form UPG2015TB-E3 6-pin super minimold G3J • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel

ORDERING INFORMATION

Remark To order evaluation samples, contact your nearby sales offi ce. Part number for sample order: UPG2015TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specifi ed) RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise specifi ed) Pin No. Pin Name

1 OUTPUT1

2 GND

3 OUTPUT2

5 INPUT

Vcont INPUT −OUTPUT1 INPUT −OUTPUT2 Low OFF ON High ON OFF PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Parameter Symbol Ratings Unit Supply Voltage V DD +6.0 V Switch Control Voltage V cont +6.0 V Input Power P in +33 dBm Operating Ambient Temperature T A −45 to +85 °C Storage Temperature T stg −55 to +150 °C Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V DD 2.7 2.8 3.0 V Switch Control Voltage (H) V cont (H) 2.7 2.8 3.0 V Switch Control Voltage (L) V cont (L) −0.2 0 0.2 V (Top View) G3J (Bottom View) (Top View)

ELECTRICAL CHARACTERISTICS

(TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specifi ed) STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specifi ed) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit 1 dB Gain Compression Input Power Note Pin (1 dB) f = 2.0 GHz − +30.0 − dBm Note P in (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range. Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 L INS1 f = 0.5 to 1.0 GHz − 0.25 0.45 dB Insertion Loss 2 L INS2 f = 1.0 to 2.0 GHz − 0.30 0.50 dB Insertion Loss 3 L INS3 f = 2.5 GHz − 0.35 0.55 dB Isolation 1 ISL 1 f = 0.5 to 2.0 GHz 23 27 − dB Isolation 2 ISL 2 f = 2.5 GHz 20 24 − dB Input Return Loss RL in f = 0.5 to 2.5 GHz 15 20 − dB Output Return Loss RL out f = 0.5 to 2.5 GHz 15 20 − dB 0.1 dB Gain Compression Input Power Note Pin (0.1 dB) f = 2.0 GHz +25.5 +27.0 − dBm f = 2.5 GHz +25.5 +27.0 − dBm Supply Current I DD − 50 100 µA Switch Control Current I cont − 42 0 µA Switch Control Speed t SW − 0.3 2.0 µs Note P in (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG2015TB

EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. OUTPUT1 OUTPUT2 56 pF56 pF 456 321 VDD VcontINPUT 56 pF 1 000 pF1 000 pF

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD USING THE NEC EVALUATION BOARD Symbol Values C1, C2, C3 56 pF C4, C5 1 000 pF 6pin SMM SPDT SW Vc1 Vc2 IN OUT 1 OUT 2 VDD OUTPUT1 INPUT OUTPUT2 Vcont G3J

Remark The graphs indicate nominal characteristics. TYPICAL CHARACTERISTICS (TA = 25ºC, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specifi ed) 0.5 –1.0 –0.5 –2.0 –1.5 –2.5 –3.0 Insersion Loss LINS (dB) Frequency f (GHz) INPUT–OUTPUT1 INSERSION LOSS vs. FREQUENCY –10 –30 –20 –40 –50 Isolation ISL (dB) Frequency f (GHz) INPUT–OUTPUT1 ISOLATION vs. FREQUENCY –10 –30 –20 –40 –50 Input Return Loss RLin (dB) Frequency f (GHz) INPUT–OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY –10 –30 –20 –40 –50 Isolation ISL (dB) Frequency f (GHz) INPUT–OUTPUT2 ISOLATION vs. FREQUENCY –10 –30 –20 –40 –50 Input Return Loss RLin (dB) Frequency f (GHz) INPUT–OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 0.5 –1.0 –0.5 –2.0 –1.5 –2.5 –3.0 Insersion Loss LINS (dB) Frequency f (GHz) INPUT–OUTPUT2 INSERSION LOSS vs. FREQUENCY

Remark The graphs indicate nominal characteristics. 10 12 14 16 18 20 22 24 26 28 30 32 34 Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER f = 1.0 GHz 28 10 12 14 16 18 20 22 24 26 28 30 32 Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER f = 2.5 GHz –10 –30 –20 –40 –50 Output Return Loss RLout (dB) Frequency f (GHz) INPUT–OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY –10 –30 –20 –40 –50 Output Return Loss RLout (dB) Frequency f (GHz) INPUT–OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY

6-PIN SUPER MINIMOLD (UNIT: mm) 0.9±0.1 0.7 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 2.0±0.2 1.3 0.650.65 1.25±0.1 2.1±0.1 0.1 MIN.

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales offi ce. Soldering Method Soldering Conditions Condition Symbol Infrared Refl ow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of refl ow processes : 3 times Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of refl ow processes : 3 times Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of fl ow processes : 1 time Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. A Business Partner of NEC Compound Semiconductor Devices, Ltd. 02/18/2004