UPG2008TB NEC | Alldatasheet

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Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. L, S-BAND SPDT SWITCH GaAs INTEGRATED CIRCUIT µµµµPG2008TB Document No. PG10193EJ01V0DS (1st edition) Date Published November 2002 CP(K) Printed in Japan  NEC Compound Semiconductor Devices 2002

DESCRIPTION

The µPG2008TB is an L, S-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular, cordless telephone and other L, S-band wireless application. The device can operate from 500 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual 6-pin minimold easy to install and contributes to miniaturizing the system.

FEATURES

  • Low insertion loss : LINS = 0.3 dB TYP. @ Vcont = +3.0 V/0 V, f = 1 GHz LINS = 0.4 dB TYP. @ Vcont = +3.0 V/0 V, f = 2 GHz
  • High isolation : ISL = 27 dB TYP. @ Vcont = +3.0 V/0 V, f = 0.5 to 2.0 GHz
  • 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) APPLICATION
  • L, S-band digital cellular or cordless telephone
  • Buletooth TM , W-LAN and WLL applications

ORDERING INFORMATION

Part Number Package Marking Supplying Form µPG2008TB-E3 6-pin super minimold G3D • Embossed tape 8 mm wide

  • Pin 1, 2, 3 face the perforation side of the tape
  • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2008TB

Data Sheet PG10193EJ01V0DS2 µµµµPG2008TB PIN CONNECTIONS Pin No. Pin Name 1O U T 1 2G N D 3O U T 2 4V cont2 5I N1 (Top View) G3D 6 (Bottom View) 6V cont1 ABSOLUTE MAXIMUM RATINGS (T A = +25°°°°C, unless otherwise specified) Parameter Symbol Ratings Unit Control Voltage 1, 2 V cont1, 2 −6.0 to +6.0 Note V Input Power P in +28 dBm Total Power Dissipation P tot 0.15 W Operating Ambient Temperature T A −45 to +85 °C Storage Temperature T stg −55 to +150 °C Note Vcont1-Vcont2 ≤ 6.0 V RECOMMENDED OPERATING RENGE (T A = +25°°°°C) Parameter Symbol MIN. TYP. MAX. Unit Control Voltage (High) V cont(H) +2.5 +3.0 +5.3 V Control Voltage (Low) V cont(L) −0.2 0 +0.2 V

Data Sheet PG10193EJ01V0DS 3 µµµµPG2008TB

ELECTRICAL CHARACTERISTICS

(TA = +25°°°°C, Vcont1 = +3 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = +3 V, ZO = 50 ΩΩΩΩ , Off chip DC blocking capacitors value; 51 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss L INS f = 0.5 to 1.0 GHz − 0.30 0.55 dB f = to 2.0 GHz − 0.40 0.65 dB f = to 2.5 GHz −− 0.90 dB Isolation ISL f = 0.5 to 2.0 GHz 22 27 − dB f = to 2.5 GHz 18 −− dB Input Return Loss RL in f = 0.5 to 2.0 GHz 13 19 − dB f = to 2.5 GHz 11 −− dB Output Return Loss RL out f = 0.5 to 2.0 GHz 13 19 − dB f = to 2.5 GHz 11 −− dB Input Power at 0.1 dB P in(0.1 dB) f = 1.0 GHz, Vcont = +3 V/0 V − 23.0 − dBm Compression Point Note Input Power at 1 dB P in(1 dB) f = 1.0 GHz, Vcont = +3 V/0 V 22.0 26.5 − dBm Compression Point Note Switching Speed t SW − 50 200 ns Control Current I cont Vcont = +3 V/0 V, RF Non − 0.5 10 µA Note Pin(0.1 dB) or Pin(1 dB) is measured the input power level when the insertion loss increase more 0.1 dB or 1 dB than that of linear range. All other characteristics are measured in linear range. Cautions 1. When the µµµµPG2008TB is used it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. 2. The distance between IC’s GND pin and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters.

Data Sheet PG10193EJ01V0DS4 µµµµPG2008TB EVALUATION CIRCUIT Vcont1 = 3.0 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 3.0 V, off chip DC blocking capacitors value C1 = 51 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board. Vcont2 IN Vcont1 OUT2 OUT1 G3D EVALUATION BOARD 6pin SMM SPDT SW Vc1 Vc2 IN OUT 1 OUT 2 Vcont1 OUT1 IN OUT2 Vcont2 G3D TRUTH TABLE Vcont1 Vcont2 IN−OUT1 IN −OUT2 Low High ON OFF High Low OFF ON

Data Sheet PG10193EJ01V0DS 5 µµµµPG2008TB TYPICAL CHARACTERISTICS TEST CONDITION: T A = +25°C, Vcont1/2 = 0 V/3.0 V, Pin = 0 dBm, OUT2 side is 50 Ω termination –20 –40 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S11 log MAGCH1 10 dB/ REF 0 dB 2: –27.13 dB

1.5 GHz

1: –22.234 dB

1.0 GHz

3: –30.052 dB

2.0 GHz

4: –24.396 dB

2.5 GHz

5: –16.767 dB

3.0 GHz

–2.0 –4.0 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S21 log MAGCH1 1 dB/ REF 0 dB 2: –0.771 dB 1: –0.660 dB 3: –0.892 dB 4: –1.047 dB 5: –1.340 dB –20 –40 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S21 log MAGCH1 10 dB/ REF 0 dB –20 –40 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S22 log MAGCH1 10 dB/ REF 0 dB 2: –24.054 dB 1: –21.598 dB 3: –25.127 dB 4: –23.43 dB 5: –17.219 dB Input Return Loss RLin (dB) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY Insertion Loss LINS (dB) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY Isolation ISL (dB) Frequency f (GHz) ISOLATION vs. FREQUENCY Output Return Loss RLout (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY 5 5 2: –25.607 dB 1: –25.638 dB 3: –24.781 dB 4: –22.34 dB 5: –19.074 dB

Data Sheet PG10193EJ01V0DS6 µµµµPG2008TB TEST CONDITION: T A = +25°C, f = 1 GHz, Vcont1/2 = 0 V3.0 V, OUT2 side is termination INPUT POWER vs. OUTPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) 302520 P–1 = +26.4 dBm 1510 Remark The graphs indicate nominal characteristics.

Data Sheet PG10193EJ01V0DS 7 µµµµPG2008TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 0.9±0.1 0.7 0 to 0.1 0.15+0.1 –0.05 0.2+0.1 –0.05 2.0±0.2 1.3 0.650.65 1.25±0.1 2.1±0.1 0.1 MIN.

Data Sheet PG10193EJ01V0DS8 µµµµPG2008TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating).

Data Sheet PG10193EJ01V0DS 9 µµµµPG2008TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. M8E 00. 4 - 0110 The information in this document is current as of November 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard":Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).

NEC Compound Semiconductor Devices Hong Kong Limited Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-01 FAX: +49-211-6503-487 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0209 NEC Compound Semiconductor Devices, Ltd. 5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: salesinfo@csd-nec.com Business issue NEC Compound Semiconductor Devices, Ltd. http://www.csd-nec.com/ Sales Engineering Group, Sales Division E-mail: techinfo@csd-nec.com FAX: +81-44-435-1918 Technical issue µµµµPG2008TB SAFETY INFORMATION ON THIS PRODUCT Caution GaAs Products The product contains gallium arsenide, GaAs. GaAs vapor and powder are hazardous to human health if inhaled or ingested.

  • Do not destroy or burn the product.
  • Do not cut or cleave off any part of the product.
  • Do not crush or chemically dissolve the product.
  • Do not put the product in the mouth. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage.