UPG2006TB-E3

UPG2006TB NEC | Alldatasheet

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Technical content

FEATURES

NEC's 1.8 V L, S-BAND SPDT SWITCH

DESCRIPTION

NEC's UPG2006TB is a L, S-band SPDT (Single Pole Double Throw) switch for digital cellular or cordless telephone applications. The device can operate from 500 MHz to 2.5 GHz, with low insertion loss and high isolation with 1.8 V control voltage.

APPLICATIONS

• L, S-band digital cellular or cordless telephones
• BluetoothTM , W-LAN and WLL
• Short Range Wireless California Eastern Laboratories

ORDERING INFORMATION

Remark To order evaluation samples, contact your nearby sales offi ce. Part number for sample order: UPG2006TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.

• LOW INSERTION LOSS: L INS = 0.3 dB TYP. @ Vcont = 1.8 V/0 V, f = 1 GHz L INS = 0.45 dB TYP. @ Vcont = 1.8 V/0 V, f = 2.5 GHz
• HIGH ISOLATION: I SL = 29 dB TYP. @ Vcont = 1.8 V/0 V, f = 2 GHz I SL = 25 dB TYP. @ Vcont = 1.8 V/0 V, f = 2.5 GHz
• 6-PIN SUPER MINIMOLD PACKAGE: (2.0 X 1.25 X 0.9MM) Part Number Package Marking Supplying Form UPG2006TB-E3 6-pin super minimold G2J • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specifi ed) RECOMMENDED OPERATING RANGE (TA = 25°C) PIN CONNECTIONS Pin No. Pin Name

1 OUT1

2 GND

3 OUT2

Parameter Symbol MIN. TYP. MAX. Unit Control Voltage (High) V cont(H) +1.6 +1.8 +5.3 V Control Voltage (Low) V cont(L) −0.2 0 +0.2 V (Top View) G2J 6 (Bottom View) Parameter Symbol Ratings Unit Control Voltage 1, 2 V cont1, 2 −6.0 to +6.0 Note V Input Power (Vcont = 1.8 V) P in +23 dBm Total Power Dissipation P tot 0.15 W Operating Ambient Temperature T A −45 to +85 °C Storage Temperature T stg −55 to +150 °C Note |Vcont1-Vcont2| ≤ 6.0 V

ELECTRICAL CHARACTERISTICS

(TA = +25°C, Vcont1 = 1.8 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = 1.8 V, ZO = 50 Ω, Off chip DC blocking capacitors value; 51 pF, unless otherwise specifi ed) UPG2006TB Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss L INS f = 0.1 to 1.0 GHz Note1 − 0.30 0.55 dB f = to 2.0 GHz − 0.40 0.60 dB f = to 2.5 GHz − 0.45 0.65 dB Isolation ISL f = 0.1 to 2.0 GHz Note1 25 29 − dB f = to 2.5 GHz 20 25 − dB Input Return Loss RL in f = 0.1 to 1.0 GHz Note1 13 −− dB f = to 2.5 GHz 16 21 − dB Output Return Loss RL out f = 0.1 to 1.0 GHz Note1 13 −− dB f = to 2.5 GHz 16 21 − dB Input Power at 1 dB P in(1 dB) f = 2.0 GHz, Vcont = 1.8 V/0 V 17 20 − dBm Compression Point Note2 f = 2.0 GHz, Vcont = 2.8 V/0 V 22 25 − dBm Input Power at 0.1 dB P in(0.1 dB) f = 2.0 GHz, Vcont = 1.8 V/0 V − 18 − dBm Compression Point Note2 f = 2.0 GHz, Vcont = 2.8 V/0 V − 23 − dBm Switching Speed t SW − 50 200 ns Control Current I cont Vcont = 1.8 V/0 V, RF Non − 0.5 10 μA Notes 1. Off chip DC blocking capacitors at frequency range of 0.1 to 0.5 GHz 1,000 pF 2. P in(1 dB) or Pin(0.1 dB) is the input power level when the insertion loss increase 1 dB or 0.1 more than that of linear range. All other characteristics are measured in linear range. capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with the actual board of the system. The range of recommended DC blocking capacitor value is less than 100 pF. 2. The distance between the GND pin and ground pattern of the substrate should be as short as possible to reduce parasitic parameters.

(Vcont1 = 1.8 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 1.8 V, off chip DC blocking capacitors value C1 = 51 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board) 4Vcont2 IN Vcont1 OUT2 OUT1 G2J EVALUATION BOARD 6p SMM SPDT SW Vcont2 G2J OUT2 OUT1 Vcont1 IN TRUTH TABLE Vcont1 Vcont2 IN−OUT1 IN −OUT2 Low High ON OFF High Low OFF ON

(Vcont1/2 = 0 V/1.8 V, Pin = 0 dBm, OUT2 side is 50 Ω termination) Caution These characteristics values include the losses of the NEC evaluation board. -40 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S11 log MAGCH1 10 dB/ REF 0 dB 2: -30.675 dB

1.5 GHz

1:-26.287 dB

1.0 GHz

3: -34.567 dB

2.0 GHz

4: -27.974 dB

2.5 GHz

5: -21.341 dB

3.0 GHz

-2.0 -4.0 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S21 log MAGCH1 1 dB/ REF 0 dB 2: -0.646 dB 1: -0.538 dB 3: -0.768 dB 4: -0.899 dB 5: -1.136 dB -20 -40 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S21 log MAGCH1 10 dB/ REF 0 dB 2: -28.781 dB 1: -27.744 dB 3: -29.32 dB 4: -26.277 dB 5: -22.797 dB ñ20 ñ40 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S22 log MAGCH1 10 dB/ REF 0 dB 2: -30.703 dB 1: -25.904 dB 3: -31.201 dB 4: -28.75 dB 5: -20.829 dB Input Return Loss RLin (dB) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY Insertion Loss LINS (dB) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY Isolation ISL (dB) Frequency f (GHz) ISOLATION vs. FREQUENCY Output Return Loss RLout (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Evaluation Board Loss (dB) Frequency f (GHz) EVALUATION BOARD LOSS vs. FREQUENCY -1.0 -2.0 START 0.500 000 000 GHz STOP 3.500 000 000 GHz S21 log MAGCH1 0.5 dB/ REF 0 dB 2: -0.321 dB 1: -0.236 dB 3: -0.420 dB 4: -0.511 dB 5: -0.593 dB

3.0 GHz1

Remark The graphs indicate nominal characteristics.

(Vcont1/2 = 0 V/1.8 V, Pin = 0 dBm, OUT2 side is 50 Ω termination) Caution These characteristics values include the losses of the NEC evaluation board. Remark The graphs indicate nominal characteristics. -50 -60 -40 -30 -20 -10 -50 -60 -40 -30 -20 -10 -50 -60 -40 -30 -20 -10 -0.5 -0.6 -0.4 -0.3 -0.2 -0.1 TA = -45ºC TA = +25ºC TA = +85ºC TA = -45ºC TA = +25ºC TA = +85ºC TA = -45ºC TA = +25ºC TA = +85ºC TA = -45ºC TA = +25ºC TA = +85ºC INPUT RETURN LOSS vs. FREQUENCY Input Return Loss RLin (dB) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY Insertion Loss LINS (dB) Frequency f (GHz) ISOLATION vs. FREQUENCY Isolation ISL (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLout (dB) Frequency f (GHz)

TEMPERATURE CHARACTERISTICS OF INPUT/OUTPUT Input Power Pin (dBm) Output Power Pout (dBm) TA = -45ºC TA = +25ºC TA = +85ºC -50 -60 05 1 0 15 20 25 30 -40 -30 -20 -10 TYPICAL CHARACTERISTICS (f = 2 GHz, Vcont1/2 = 0 V/1.8 V, OUT2 side is 50 Ω termination) UPG2006TB Remark The graphs indicate nominal characteristics. TYPICAL CHARACTERISTICS (f = 2 GHz, TA = +25ºC, OUT2 side is 50 Ω termination) Remark The graphs indicate nominal characteristics. Vcont = 1.6 V Vcont = 5.3 V Vcont = 1.8 V Vcont = 2.8 V 05 1 0 15 20 25 35 30 RELATION BETWEEN CONTROL VOLTAGE OF INPUT/OUTPUT Input Power Pin (dBm) Output Power Pout (dBm)

(f = 2 GHz, TA = +25ºC, Vcont1/2 = 0 V/1.8 V, OUT2 side is 50 Ω termination) RELATION BETWEEN CONTROL VOLTAGE OF 2nd HARMONICS Input Power Pin (dBm) 2nd Harmonics (dBc) Vcont = 1.8 V Vcont = 2.8 V 100 120 05 1 0 15 20 25 30 RELATION BETWEEN CONTROL VOLTAGE OF 3rd HARMONICS Input Power Pin (dBm) 3rd Harmonics (dBc) Vcont = 1.8 V Vcont = 2.8 V 100 120 05 1 0 15 20 25 30 Remark The graphs indicate nominal characteristics. UPG2006TB

6-PIN SUPER MINIMOLD (UNIT: mm) UPG2006TB 0.9±0.1 0.7 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 2.0±0.2 1.3 0.650.65 1.25±0.1 2.1±0.1 0.1 MIN.

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales offi ce. Soldering Method Soldering Conditions Condition Symbol Infrared Refl ow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of refl ow processes : 3 times Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of refl ow processes : 3 times Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of fl ow processes : 1 time Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin fl ux (% mass) : 0.2%(Wt.) or below HS350 Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. A Business Partner of NEC Compound Semiconductor Devices, Ltd. 03/08/2004 Caution Do not use different soldering methods together (except for partial heating).