UPG2005TB RENESAS | Alldatasheet
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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P15522EJ1V0DS00 (1st edition) Date Published May 2001 NS CP(K) Printed in Japan © 2001 GaAs INTEGRATED CIRCUIT µµµµPG2005TB L-BAND SINGLE CONTROL SPDT SWITCH
DESCRIPTION
The µPG2005TB is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 0.5 to 2.5 GHz, having the low insertion loss and high isolation by 2.8 V single bias control.
FEATURES
- Low insertion loss: LINS = 0.3 dB TYP. @VCONT = 2.8 V / 0 V, VDD = 2.8 V, f = 1 GHz
- High isolation: ISL = 29 dB TYP. @VCONT = 2.8 V / 0 V, VDD = 2.8 V, f = 2 GHz ISL = 25 dB TYP. @VCONT = 2.8 V / 0 V, VDD = 2.8 V, f = 2.5 GHz
- 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm)
APPLICATIONS
- L-band digital cellular or cordless telephone
- Bluetooth, W-LAN and WLL applications
ORDERING INFORMATION
Part Number Package Marking Supplying Form µPG2005TB-E3 6-pin super minimold G2H • Embossed tape 8 mm wide
- Pin 1, 2, 3 face the tape perforation side
- Qty 3kpcs / reel Remark To order evaluation samples, please contact your local NEC sales office. Part number for sample order: µPG2005TB Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs HJ-FET. Discontinued Product
µµµµPG2005TB PIN CONNECTIONS Pin No. Connection Pin No. Connection 1O U T 14V CONT 2G N D5 I N 3O U T 26 V DD (Top View) (Bottom View) G2H Discontinued Product
Data Sheet P15522EJ1V0DS 3 µµµµPG2005TB ABSOLUTE MAXIMUM RATINGS (T A = +25°°°°C) Parameter Symbol Ratings Unit Control Voltage V CONT +6.0 V Supply Voltage V DD +6.0 V Input Power P in 22 dBm Total Power Dissipation P tot 0.15 W Operating Temperature T opt −45 to +85 °C Storage Temperature T stg −55 to +150 °C RECOMMENDED OPERATING CONDITIONS (T A = +25°°°°C) Parameter Symbol MIN. TYP. MAX. Unit Control Voltage (High) V CONT(H) 2.7 2.8 3.0 V Control Voltage (Low) V CONT(L) 00 0 . 2 V Supply Voltage V DD 2.7 2.8 3.0 V Discontinued Product
µµµµPG2005TB
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = +25°°°°C, VCONT = 2.8 V / 0 V, VDD = 2.8 V, ZO = 50 ΩΩΩΩ , Off chip DC blocking capacitors value; 51 pF) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss L INS f = 0.5 to 1.0 GHz − 0.30 0.55 dB f = 2.0 GHz − 0.35 0.60 dB f = 2.5 GHz − 0.40 0.65 dB Isolation ISL f = 0.5 to 2.0 GHz 25 29 − dB f = 2.5 GHz 20 25 − dB Input Return Loss RL in f = 1.0 to 2.5 GHz 16 21 − dB Output Return Loss RL out f = 1.0 to 2.5 GHz 16 21 − dB Input Power at 1 dB Compression Point Note Pin(1dB) f = 2.0 GHz 12 16 − dBm Input Power at 0.1 dB Compression Point Note Pin(0.1dB) f = 2.0 GHz − 12 − dBm Switching Speed t SW − 20 − ns Supply Current I DD VDD = 2.8 V, RF Non − 47 80 µA Control Current I CONT VCONT = 2.8 V, RF Non − 0.5 10 µA Note Pin(1dB) or Pin(0.1dB) are measured the input power level when the insertion loss increase more 1 dB or 0.1 dB than that of linear range. All other characteristics are measured in linear range. Cautions 1. When the µµµµPG2005TB is used it is necessary to use DC blocking capacitors for No. 1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, band width, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. 2. The distance between IC’s GND pin and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters. Discontinued Product
Data Sheet P15522EJ1V0DS 5 µµµµPG2005TB TEST CIRCUIT VCONT = 2.8 V / 0 V, VDD = 2.8 V, off chip DC blocking capacitors value C1 = 51 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board. G2H VCONT IN VDD C 2 C 2 C 1 C 1 C 1 OUT2 OUT1 EVALUATION BOARD 6p SMM SPDT SW VCONT C 2 C 2 C 1 C 1 C 1 OUT2 OUT1 VDD IN TRUTH TABLE OF SWITCHING BY CONDITION OF VOLTAGE VCONT IN−OUT1 IN −OUT2 Low OFF ON High ON OFF Discontinued Product
µµµµPG2005TB TYPICAL CHARACTERISTICS TEST CONDITION: V CONT = 2.8 V, VDD = 2.8 V, Pin = 0 dBm, OUT2 side is 50 Ω termination Input Return Loss RLin (dB) Frequency f (GHz) –20 –40 2 5 3 4 INPUT RETURN LOSS vs. FREQUENCY START 0.500 000 000 GHz STOP 3.500 000 000 GHz S11 log MAGCH1 10 dB/ REF 0 dB 2: –26.257 dB
1.5 GHz
1: –22.045 dB
1 GHz
3: –34.528 dB
2 GHz
4: –35.129 dB
2.5 GHz
5: –28.267 dB
3 GHz
Insertion Loss LINS (dB) Frequency f (GHz) –1.0 –2.0 3 4 INSERTION LOSS vs. FREQUENCY START 0.500 000 000 GHz STOP 3.500 000 000 GHz S21 log MAGCH1 0.5 dB/ REF 0 dB 2: –0.634 dB 1: –0.531 dB 3: –0.741 dB 4: –0.856 dB 5: –1.019 dB Isolation ISL (dB) Frequency f (GHz) –20 –40 2 3 4 ISOLATION vs. FREQUENCY START 0.500 000 000 GHz STOP 3.500 000 000 GHz S21 log MAGCH1 10 dB/ REF 0 dB 2: –29.734 dB 1: –29.146 dB 3: –28.739 dB 4: –25.71 dB 5: –22.188 dB Output Return Loss RLout (dB) Frequency f (GHz) –20 –40 2 3 4 OUTPUT RETURN LOSS vs. FREQUENCY START 0.500 000 000 GHz STOP 3.500 000 000 GHz S22 log MAGCH1 10 dB/ REF 0 dB 2: –27.873 dB 1: –24.158 dB 3: –28.019 dB 4: –26.186 dB 5: –23.049 dB Evaluation Board Loss (dB) Frequency f (GHz) –1.0 –2.0 53 4 EVALUATION BOARD LOSS vs. FREQUENCY START 0.500 000 000 GHz STOP 3.500 000 000 GHz S21 log MAGCH1 0.5 dB/ REF 0 dB 2: –0.294 dB 1: –0.205 dB 3: –0.371 dB 4: –0.442 dB 5: –0.517 dB
Data Sheet P15522EJ1V0DS 7 µµµµPG2005TB TYPICAL CHARACTERISTICS (Temperature dependency of each frequency characteristics) TEST CONDITION: V CONT = 2.8 V, VDD = 2.8 V, Pin = 0 dBm, OUT2 side is 50 Ω termination TA = –50˚C TA = +25˚C TA = +85˚C INPUT RETURN LOSS vs. FREQUENCY Input Return Loss RLin (dB) Frequency f (GHz) –50 –40 –30 –20 –10 TA = –50˚C TA = +25˚C TA = +85˚C INSERTION LOSS vs. FREQUENCY Insertion Loss LINS (dB) Frequency f (GHz) –0.5 –0.4 –0.3 –0.2 –0.1 TA = –50˚C TA = +25˚C TA = +85˚C ISOLATION vs. FREQUENCY Isolation ISL (dB) Frequency f (GHz) –50 –40 –30 –20 –10 TA = –50˚C TA = +25˚C TA = +85˚C OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLout (dB) Frequency f (GHz) –50 –40 –30 –20 –10 Caution This data is included value evaluation board loss. Discontinued Product
µµµµPG2005TB TYPICAL CHARACTERISTICS TEST CONDITION: f = 2 GHz, VCONT = 2.8 V, VDD = 2.8 V, OUT2 side is 50 Ω termination TA = –50˚C TA = +25˚C TA = +85˚C 6 7 8 9 10 11 12 13 14 15 16 17 TEMPERATURE CHARACTERISTICS OF INPUT/OUTPUT Input Power Pin (dBm) Output Power Pout (dBm) TYPICAL CHARACTERISTICS TEST CONDITION: f = 2 GHz, TA = +25°C, VDD = 2.6, 2.8, 3.0 V, OUT2 side is 50 Ω termination VCONT = 3.0 V VCONT = 2.8 V VCONT = 2.6 V 6 7 8 9 10 11 12 13 14 15 16 17 RELATION BETWEEN CONTROL VOLTAGE OF INPUT/OUTPUT Input Power Pin (dBm) Output Power Pout (dBm) Remark The graphs indicate nominal characteristics. Discontinued Product
Data Sheet P15522EJ1V0DS 9 µµµµPG2005TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 0.9±0.1 0.7 0 to 0.1 0.15+0.1 –0.05 2.0±0.2 1.3 0.650.65 0.2+0.1 –0.05 2.1±0.1 1.25±0.1 0.1 MIN. Discontinued Product
Data Sheet P15522EJ1V0DS10 µµµµPG2005TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Count: 3, Exposure limit: None Note IR35-00-3 Time: 40 seconds or less (at 200°C) Count: 3, Exposure limit: None Note VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Count: 1, Exposure limit: None Note WS60-00-1 Partial Heating Pin temperature: 300°C or below Time: 3 seconds or less (per side of device) Exposure limit: None Note Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E) . Discontinued Product
Data Sheet P15522EJ1V0DS 11 µµµµPG2005TB [MEMO] Discontinued Product
µµµµPG2005TB SAFETY INFORMATION ON THIS PRODUCT Caution GaAs Products The product contains gallium arsenide, GaAs. GaAs vapor and powder are hazardous to human health if inhaled or ingested.
- Do not destroy or burn the product.
- Do not cut or cleave off any part of the product.
- Do not crush or chemically dissolve the product.
- Do not put the product in the mouth. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage. M8E 00. 4 The information in this document is current as of May, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard":Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). Discontinued Product