UPG175TA NEC | Alldatasheet

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The information in this document is subject to change without notice. GaAs INTEGRATED CIRCUIT µµµµPG175TA L-Band PA DRIVER AMPLIFIER 1998© PRELIMINARY DATA SHEET Document No. P13470EJ1V0DS00 (1st edition) Date Published May 1998 N CP(K) Printed in Japan

DESCRIPTION

µPG175TA is a GaAs MMIC for PA driver amplifier with variable gain function which was developed for PDC (Personal Digital Cellular in Japan) and another L-band application. The device can operate with 3.0 V, having the high gain and low distortion.

FEATURES

  • Low Operation Voltage: VDD1 = VDD2 = 3.0 V
  • f RF : 925 to 960 MHz@ Pout = +9 dBm
  • Low distortion: Padj1 = –60 dBc typ. @ VDD = 3.0 V, Pout = +9 dBm, VAGC = 2.5 V External input and output matching
  • Low operation Current: IDD = 20 mA typ. @ VDD = 3.0 V, Pout = +9 dBm, VAGC = 2.5 V External input and output matching
  • Variable gain control function: ΔG = 35 dB typ. @ VAGC = 0.5 to 2.5 V
  • 6 pin mini-mold package APPLICATION
  • Digital Cellular: PDC800M, etc. ORDERING INFORMATION (PLAN) PART NUMBER PACKAGE PACKING FORM µPG175TA-E3 6 pin Mini-mold Carrier tape width is 8 mm, Quantity is 3 kpcs per reel. Remark For sample order, please contact your local NEC sales office. (Part number for sample order: µPG175TA) Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs HJ-FET.

µµµµPG175TA ABSOLUTE MAXIMUM RATINGS (T A = 25°C) PARAMETERS SYMBOL RATINGS UNIT Supply Voltage V DD1 , VDD2 6.0 V AGC Control Voltage V AGC 6.0 V Input Power P in –8 dBm Total Power Dissipation P tot 200 Note mW Operating Temperature T A –30 to +90 °C Storage Temperature T stg –35 to +150 °C Note Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85°C PIN CONNECTION AND INTERNAL BLOCK DIAGRAM PIN NO. CONNECTION PIN NO. CONNECTION 1V DD1 4V AGC

2 GND 5 GND

3V DD2 & OUT 6 IN Top View G1E1 Bottom View Top View RECOMMENDED OPERATING CONDITIONS (T A = 25°C) PARAMETERS SYMBOL MIN. TYP. MAX. UNIT Supply Voltage V DD1 , VDD2 +2.7 +3.0 +3.3 V AGC Control Voltage V AGC 0.5 2.5 V Input Power P in –21 –17 dBm

µµµµPG175TA

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, TA = 25°C, VDD1 = VDD2 = +3.0 V, ππππ/4DQPSK modulated signal input, External input and output matching) PARAMETERS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Operating Frequency f 925 960 MHz Total Current I DD Pin = –21 dBm, VAGC = 2.5 V 20 30 mA AGC Control Current I AGC VAGC = 0.5 to 2.5 V 200 500 µA Power Gain G p Pin = –21 dBm, VAGC = 2.5 V 27 30 dB Variable Gain Range ΔG Pin = –21 dBm, VAGC = 0.5 to 2.5 V 30 35 dB Adjacent Channel Power Leakage 1 Padj1 Pout = +9 dBm, VAGC = 2.5 V Δf = ±50 kHz, 21 kHz Band Width –60 –55 dBc Adjacent Channel Power Leakage 2 Padj2 Pout = +9 dBm, VAGC = 2.5 V Δf = ±100 kHz, 21 kHz Band Width –70 –65 dBc Input Return Loss RL in External matching 10 dB Output Return Loss RL out External matching 10 dB

µµµµPG175TA EVALUATION CIRCUIT (Preliminary) VDD1 = VDD2 = +3.0 V, f = 950 MHz VDD2 L3 C1 OUT IN VAGC VDD1 G1E 456 Using the NEC Evaluation board C1 2.0 pF C2, C3 1000 pF L1 22 nH L2 27 nH L3 12 nH L4 47 nH L5 10 nH

µµµµPG175TA EVALUATION BOARD (Epoxy Glass, εεεε = 4.6, 0.4 mm thickness) OUT VDD2 VAGC IN VDD1 40 mm 38 mm

6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm)

2.8 +0.2 –0.3 0 to 0.1 1.5 +0.2 –0.1 0.3 +0.1 –0.0 12 3 65 4 0.95 0.95 1.9 2.9 – 0.2 0.13 – 0.1 0.8 1.1 +0.2 –0.1

µµµµPG175TA RECOMMENDED SOLDERING CONDITIONS This Product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Soldering process Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235°C Hour: within 30 s. (more than 210°C) Time: 3 times, Limited days: no. Note IR35-00-3 Hour: within 40 s. (more than 200°C) Time: 3 times, Limited days: no. Note VP15-00-3 Wave Soldering Soldering tub temperature: less than 260°C, Hour: within 10 s. Time: 1 time, Limited days: no. Note WS60-00-1 Pin part heating Pin area temperature: less than 300°C, Hour: within 3 s. Limited days: no. Note Note It is the storage days after opening a dry pack, the storage conditions are 25°C, less than 65%, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µµµµPG175TA [MEMO]

µµµµPG175TA Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5