UPG139GV

UPG139GV NEC | Alldatasheet

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Technical content

The information in this document is subject to change without notice. GaAs INTEGRATED CIRCUIT µµµµPG139GV 1998© Document No. P13144EJ2V0DS00 (2nd edition) Date Published July 1998 N CP(K) Printed in Japan L-BAND DPDT MMIC SWITCH DATA SHEET The mark shows major revised points.

DESCRIPTION

The µPG139GV is L-Band Double Pole, Double Throw (DPDT) switch developed for digital cellular or cordless telephone and PCS applications. This device feature low insertion loss, high handling power with low voltage operation. It is housed in a very small 8-pin plastic SSOP package available on tape-and-reel and easy to install and contributes to miniaturizing the systems.

FEATURES

{ High-Power Switching : Pin(1 dB) = +34 dBm typ. @ANT1, 2-TX, VDD = 3.0 V, VCONT = 3.6 V, f = 100 M to 2 GHz Pin(0.5 dB) = +36 dBm typ. @ANT1, 2-TX, VDD = 5.0 V, VCONT = 5.0 V, f = 100 M to 2 GHz { Low Insertion Loss : Lins1 = 0.70 dB typ. @ANT1, 2-TX, VDD = 3.0 V, VCONT = 3.6 V, f = 1 GHz Lins4 = 0.85 dB typ. @ANT1, 2-RX, VDD = 3.0 V, VCONT = 3.6 V, f = 1 GHz { Small 8-pin SSOP (175 mil) Package APPLICATION { Digital Cellular: PDC, GSM, IS-95, IS-136 etc. { PCS, PHS Base station etc.

ORDERING INFORMATION

Part Number Package Packing Form µPG139GV-E1 8-pin SSOP (175 mil) Carrier tape width is 12 mm, Quantity is 2 kpcs per reel. Remark For sample order, please contact your local NEC sales office. (Part number for sample order: µPG139GV) Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs MESFET.

µµµµPG139GV ABSOLUTE MAXIMUM RATINGS (T A = 25°C) Parameters Symbol Conditions Ratings Unit Supply Voltage V DD VCONT (H) V Control Voltage 1, 2 V CONT1, 2 –6.0 to +6.0 Note1 V Input Power (ANT1, 2-TX) P in VCONT = +5 V/0 V +36 dBm Input Power (ANT1, 2-RX) P in VCONT = +5 V/0 V +34 dBm Input Power (ANT1, 2-TX) P in VCONT = +3 V/0 V +34 dBm Input Power (ANT1, 2-RX) P in VCONT = +3 V/0 V +32 dBm Total Power Dissipation P tot 0.7 Note 2 W Operating Temperature T A –50 to +80 °C Storage Temperature T stg –65 to +150 °C Notes 1. 2.7 V ≤ | VCONT1 – VCONT2 | ≤ 6.0 2. Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85 °C PIN CONNECTION (Top View) Pin No. Connection Pin No. Connection 1T X5R X 2V DD 6V CONT1 3V CONT2 7G N D 4A N T 28A N T 1 SWITCH IC SERIES PRODUCTS Part Number Pin (1 dB) (dBm) LINS (dB) ISL (dB) V CONT (V) Package Application µPG130G +34 0.5@1G 32@1G –5/0 8-pin SSOP PDC, IS-136, PHS µPG131G +30 0.6@2G 23@2G –4/0 (175 mil) PHS, PCS, WLAN µPG132G +30 0.6@2G 22@2G +3/0 PHS, PCS, WLAN µPG133G +25 0.6@2G 20@2G –3/0 DIVERSITY, VCO µPG137GV +34 0.55@1G 25@2G +3/0 PDC, GSM, IS-136 µPG138GV +34 +37 0.55@1G 30@1G –3/0 –5/0 PDC, GSM, IS-136 µPG139GV (ANT1, 2-TX) µPG139GV (ANT1, 2-RX) Remark As for detail information of series products, please refer to each data sheet. G139

µµµµPG139GV RECOMMENDED OPERATING CONDITIONS (T A = 25°C) Parameters Symbol MIN. TYP. MAX. Unit Control Voltage (High) V CONT(H) +2.7 +3.6 +5.3 V Control Voltage (Low) V CONT(L) –0.2 0 +0.2 V Supply Voltage V DD VCONT(H) – 0.7 V CONT(H) – 0.6 V CONT(H) – 0.5 V Input Power (ANT1, 2-TX, VCONT = +5 V) P in +36 dBm Input Power (ANT1, 2-RX, VCONT = +5 V) Pin +33 dBm Input Power (ANT1, 2-TX, VCONT = +3 V) P in +33 dBm Input Power (ANT1, 2-RX, VCONT = +3 V) Pin +31 dBm

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, TA = 25°C, VCONT = +3.6 V/0 V, VDD = +3.0 V, ZS = ZL = 50 ΩΩΩΩ ) Parameters Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 L INS1 ANT1, 2-TX, f = 100 M to 1 GHz 0.70 0.85 dB Insertion Loss 2 L INS2 ANT1, 2-TX, f = 1.5 GHz 0.90 1.00 dB Insertion Loss 3 L INS3 ANT1, 2-TX, f = 2 GHz 1.20 1.30 dB Insertion Loss 4 L INS4 ANT1, 2-RX, f = 100 M to 1 GHz 0.85 0.95 dB Insertion Loss 5 L INS5 ANT1, 2-RX, f = 1.5 GHz 1.05 1.15 dB Insertion Loss 6 L INS6 ANT1, 2-RX, f = 2 GHz 1.30 1.40 dB Isolation 1 ISL1 ANT1, 2-TX, f = 100 M to 1.5 GHz 13.5 15.5 dB Isolation 2 ISL2 ANT1, 2-TX, f = 2 GHz 10.5 12.5 dB Isolation 3 ISL3 ANT1, 2-RX, f = 100 M to 1.5 GHz 13.5 15.5 dB Isolation 4 ISL4 ANT1, 2-RX, f = 2 GHz 10.5 12.5 dB Input Return Loss RL in f = 100 M to 2 GHz 11 15 dB Output Return Loss RL out f = 100 M to 2 GHz 11 15 dB 1 dB Compression Point Note Pin(1 dB)1 ANT1, 2-TX, f = 100 M to 2 GHz +32 +34 dBm 1 dB Compression Point Note Pin(1 dB)2 ANT1, 2-RX, f = 100 M to 2 GHz +27 +30 dBm Input Power at 0.5 dB Compression Point Note Pin(0.5 dB)3 ANT1, 2-TX, f = 100 M to 2 GHz VCONT = +5 V/0 V VDD = +5.0 V +36 dBm Input Power at 0.5 dB Compression Point Note Pin(0.5 dB)4 ANT1, 2-RX, f = 100 M to 2 GHz VCONT = +5 V/0 V VDD = +5.0 V +33 dBm Control Current I CONT RF OFF 15 50 µA Switching Speed tsw 60 nS Note Pin (1 dB) and Pin (0.5 dB) are measured the input power level when the insertion loss increase more 1 dB or 0.5 dB than that of linear range. All other characteristics are measured in linear range.

µµµµPG139GV EVALUATION CIRCUIT GND 51 PF ANT1 VCONT1 = 0 V/+3.6 VVCONT2 = +3.6 V/0 V VDD = 3.0 V ANT2 TX RX Z0 = 50 Ω Z0 = 50 Ω Z0 = 50 Ω Z0 = 50 Ω 51 PF 51 PF 51 PF SWITCH LOGIC TABLES VCONT1 VCONT2 Switching Portes Low High ANT1-RX ON, ANT2-TX ON ANT1-TX OFF, ANT2-RX OFF High Low ANT1-TX ON, ANT2-RX ON ANT1-RX OFF, ANT2-TX OFF

µµµµPG139GV PACKAGE DIMENSIONS

8 PIN PLASTIC SHRINK SOP (175 mil) (Unit: mm)

3.0 MAX. 1.5 ± 0.1 1.8 MAX. 0.1 ± 0.1 0.575 MAX. 0.65 0.3 +0.10 –0.05 0.10 M 0.15 0.15 +0.10 –0.05 0.5 ± 0.2 3.2 ± 0.1 4.94 ± 0.2 0.87 ± 0.2 Detail of lead end +7° –3°

µµµµPG139GV RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Soldering process Soldering Conditions Symbol Infrared Ray Reflow Peak package’s surface temperature: 235°C or below Reflow time: 30 seconds or less (at 210°C) Number of reflow process: 3, Exposure limit Note : None IR35-00-3 VPS Peak package’s surface temperature: 215°C or below Reflow time: 40 seconds or less (at 200°C) Number of reflow process: 3, Exposure limit Note : None VP15-00-3 Wave Soldering Solder temperature: 260°C or below Flow time: 10 seconds or less Number of flow process: 1, Exposure limit Note : None WS60-00-1 Partial Heating Method Terminal temperature: 300°C Flow time: 3 seconds or less (per one pin), Exposure limit Note : None Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25°C and relative humidity at 65% or less. Caution Do not apply more than a single process at once, except for “partial heating method”.

µµµµPG139GV [MEMO]

µµµµPG139GV Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5