UPG138GV NEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

1996© Document No. P13058EJ2V0DS00 (2nd edition) (Previous No. P11508EJ1V0DS00) Date Published December 1997 N CP(K) Printed in Japan DATA SHEET

DESCRIPTION

The PPG138GV is L-Band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital mobile communication system. It housed in an very small 8-pin SSOP that is smaller than usual 8-pin SOP and easy to install and contributes to miniaturizing the system.

FEATURES

  • Maximum transmission power : +35 dBm min. (@ VCONT = ð5 V/0 V: PPG138GV ) +34 dBm typ. (@ VCONT = ð3 V/0 V: PPG138GV)
  • Low insertion loss : 0.55 dB typ. (@ 1 GHz) 0.65 dB typ. (@ 2 GHz) APPLICATION
  • Digital Cellular : GSM, PDC, PCN etc.
  • PHS Base Station, PCS etc.

ORDERING INFORMATION

PART NUMBER PACKAGE PACKING FORM PPG138GV-E1 8-pin plastic SSOP (175 mil) Carrier tape width 12 mm Qty 2 kp/Reel. ABSOLUTE MAXIMUM RATINGS (T A = 25 °C) PARAMETERS SYMBOL RATINGS UNIT Control Voltage 1, 2 V CONT1, 2 ð6.0 to +0.6 V Input Power (VCONT = ð5 V) P in +36 dBm Input Power (VCONT = ð3 V) P in +34 dBm Total Power Dissipation P tot 0.7 W Operating Temperature T opt ð50 to +80 °C Storage Temperature T stg ð65 to +150 °C

PIN CONNECTION DIAGRAM (Top View) 1. VCONT2 2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 8. V CONT1 G138 SPDT SWITCH IC SERIES PRODUCTS PART NUMBER PIN (1 dB) (dBm) LINS (dB) ISL (dB) VCONT (V) PACKAGE APPLICATIONS PPG130G +34 0.5 @ 1 G 32 @ 1 G ð5/0 PDC, IS-54, PHS PPG131G +30 0.6 @ 2 G 23 @ 2 G ð4/0 PHS, DIVERSITY PPG132G +30 0.6 @ 2 G 22 @ 2 G +3/0 PHS, DIVERSITY PPG133G +25 0.6 @ 2 G 20 @ 2 G ð3/0 DIVERSITY, VCO PPG137GV +34 0.55 @ 1 G 25 @ 2 G +3/0 PDC, GSM, IS-136 PPG138GV +34 +38 0.55 @ 1 G 30 @ 1 G ð3/0 ð5/0 PDC, GSM, IS-136 Remark As for detail information of series products, please refer to each data sheet. 8 pins SSOP (175 mil)

[PPPPPG138GV] RECOMMENDED OPERATION CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Control Voltage (ON) V CONT ð0.2 0 +0.2 V Control Voltage (OFF) V CONT ð5.3 ð3.0 ð2.7 V Input Power (VCONT = ð5 V) P in +35 dBm Input Power (VCONT = ð3 V) P in +33 dBm

ELECTRICAL CHARACTERISTICS

(UNLESS OTHERWISE SPECIFIED T A = 25 qqqqC, VCONT = ðððð3 V/0 V, f = 100 MHz to 1 GHz) CHARACTERISTICS SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT Insertion Loss 1 L INS1 0.55 0.75 dB Insertion Loss 2 L INS2 f = 2.0 GHz 0.65 0.90 dB Insertion Loss 3 L INS3 f = 2.5 GHz 0.8 Note 1 dB Isolation 1 I SL1 25 30 dB Isolation 2 I SL2 f = 2.0 GHz 18 20 dB Input Return Loss RL in f = 100 M to 2 GHz 11 dB Output Return Loss RL out 11 dB Input Power at 1 dB P in (1 dB) f = 500 M to 2 GHz +32 +34 dBm Compression Point Note 2 f = 500 M to 2 GHz, VCONT = ð5 V/0 V +34 +38 dBm Switching Speed t SW 10 ns Control Current I CONT VCONT = ð5 V/0 V 5 PA Notes 1. Characteristic for reference at 2.0 to 2.5 GHz. 2. Pin (1 dB) is measured the input power level when the insertion loss increase more 1 dB than that of linear range. All other characteristics are measured in linear range. NOTE ON CORRECT USE

  • Insertion loss and isolation of the IN-OUT2 is better than that of IN-OUT1, because No. 7 pin (OUT1) is placed to same side of No. 5 pin (IN).
  • The distance between IC’s GND pins and ground pattarn of substrate should be as shorter as possible to avoid parasitic parameters.

[PPPPPG138GV] TEST BOARD R R NEC G130/131 0.4 mm thickness teflon glass R = 50 Ω Using the same board that of PG130/131G IN 0.9 mm width OUT1 V CONT1 VCONT2 OUT2 µ TEST CIRCUIT 50 Ω 50 Ω VCONT2 = 0 V/–3 V OUT2 1000 pF ZO = 50 Ω 1000 pF VCONT1 = –3 V/0 V OUT1 IN ZO = 50 Ω ZO = 50 Ω

[PPPPPG138GV] TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE VCONT1

0 V ð3 V

ð3 V OUT1 OUT2IN OUT1 OUT2IN PACKGE DIMENSIONS 8-PIN PLASTIC SHRINK SOP (175 mil) (Unit mm)

3.0 MAX

0.15 0.87 ± 0.2 4.94 ± 0.2 3.2 ± 0.1 0.15+0.10–0.05 0.5 ± 0.2 3˚+7˚ –3˚ 0.575 MAX0.1 ± 0.1

1.8 MAX

1.5 ± 0.1 0.10 M0.3+0.10 –0.05 0.65 Detail of lead end

It is possible to use the PPG138GV with only a single +3 V supply by employing a technique known as “floating”. When the IC is floated using a +3 V supply, the voltage levels used to control the switch are elevated above ground by +3 V. When the PPG138GV is floated it is necessary to use DC blocking (C2, C3, C5) and grounding (C1, C4) capacitors. This enables the IC to isolated so that +3 V can be applied to RF line. The value for DC blocking capacitors should be chosen to accommodate the frequency of operation. Grounding capacitors are required to float the IC above ground. The value for grounding capacitor should be chosen to accommodate the frequency of operation. It is not recommended to float the PPG138GV for wide band application. (Floating the PPG138GV with +3 V/0 V supply at 2 GHz-band, BW d 50 MHz) GND OUT2 VCONT2

58 VCONT1

  1. VCONT2 2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 8. V CONT1 C1, C4 = 10 pF below C2, C3, C5 = 100 pF : Grounding capacitor : DC blocking capacitor The distance between grounding capacitor and IC’s GND pins, grounding capacitor and ground of the substrate should be as shorter as possible to avoid the parasitic parameters. IC’s GND pin, No. 3, No. 4 and No. 6 are connected inside of the IC.

RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. [PPPPPG138GV] Soldering process Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235 qC Hour: within 30 s. (more than 210 qC) Time: 3 times, Limited days: no. Note IR35-00-3 Hour: within 40 s. (more than 200 qC) Time: 3 times, Limited days: no. Note VP15-00-3 Wave soldering Soldering tub temperature: less than 260 qC, Hour: within 10 s. Time: 1 time, Limited days: no. Note WS60-00-1 Pin part heating Pin area temperature: less than 300 qC, Hour: within 10 s. Limited days: no. Note Note It is storage days after opening a dry pack, the storage conditions are 25 qC, less than 65 %, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method).

The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5