UPD121WXXA RENESAS | Alldatasheet

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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. 2007 MOS INTEGRATED CIRCUIT μ PD121WxxA Series HIGH CURRENT 1.5 A GENERAL-PURPOSE CMOS REGULATOR DATA SHEET Document No. G18852EJ1V0DS00 (1st edition) Date Published July 2007 NS Printed in Japan

DESCRIPTION

The μ PD121WxxA series is general-purpose CMOS regulators which have 1.5 A output current capacity. These products are suitable for power supply of large-scale ASICs etc. By ON/OFF function, the power consumption can be kept low level at the time of off-state. This series of regulator has 3 fixed output voltage type 1.8 V, 2.5 V, 3.3 V, and adjustable output voltage type (1.8 to 3.3 V).

FEATURES

  • Output Current: 1.5 A
  • Output Voltage Tolerance: VO ± 2.0% (TJ = 25°C)
  • Dropout Voltage: VDIF = 1.0 V MAX. (IO = 1.5 A)
  • Quiescent Current: 150 μ A TYP. (IO = 0 A)
  • Standby Current: 1 μ A
  • Available for laminated ceramic capacitor: (Electric capacity 10 μ F or higher)
  • On-chip over-current protection circuit
  • On-chip thermal shut down circuit

APPLICATIONS

These regulators are suitable for large-scale ASICs which are used in digital appliances etc. PIN CONFIGURATION (Marking Side) 5-PIN TO-252 (5-PIN MP-3ZK) 12345 Note No.3 pin is cut and can not be connected to substrate. No.6 is Fin and common to GND pin. 1. INPUT 2. ON/OFF 3. GND Note 4. NC / ADJ 5. OUTPUT 6. GND (Fin)

Data Sheet G18852EJ1V0DS 2 μ PD121WxxA Series BLOCK DIAGRAM μ PD121W18A, μ PD121W25A, μ PD121W33A VIN GND ON/OFF VOUT Reference voltage Constant Current Buffer Error amp. Triming Thermal shut down ON/OFF Over-current protection μ PD121W00A VIN GND ON/OFF VOUT ADJ Reference voltage Constant Current Buffer Error amp. Triming Thermal shut down ON/OFF Over-current protection

Data Sheet G18852EJ1V0DS 3 μ PD121WxxA Series

ORDERING INFORMATION

Part Number Package Output Voltage Type Marking μ PD121W18AT1F 5-PIN TO-252 (5-PIN MP-3ZK) 1.8 V Fixed 121W18 μ PD121W25AT1F 5-PIN TO-252 (5-PIN MP-3ZK) 2.5 V Fixed 121W25 μ PD121W33AT1F 5-PIN TO-252 (5-PIN MP-3ZK) 3.3 V Fixed 121W33 μ PD121W00AT1F 5-PIN TO-252 (5-PIN MP-3ZK) 1.8 to 3.3 V Adjustable 121W00 Remark Since it is the tape-packaged product, “-E1” or “-E2” is added to the end of its product name. Part Number Package Package Type μ PD121W18AT1F-E1-AT Note 5-PIN TO-252 (5-PIN MP-3ZK) • 16 mm wide embossed taping

  • Pin 1 on draw-out side
  • 2,500 pcs/reel μ PD121W18AT1F-E2-AT Note 5-PIN TO-252 (5-PIN MP-3ZK) • 16 mm wide embossed taping
  • Pin 1 at take-up side
  • 2,500 pcs/reel μ PD121W25AT1F-E1-AT Note 5-PIN TO-252 (5-PIN MP-3ZK) • 16 mm wide embossed taping
  • Pin 1 on draw-out side
  • 2,500 pcs/reel μ PD121W25AT1F-E2-AT Note 5-PIN TO-252 (5-PIN MP-3ZK) • 16 mm wide embossed taping
  • Pin 1 at take-up side
  • 2,500 pcs/reel μ PD121W33AT1F-E1-AT Note 5-PIN TO-252 (5-PIN MP-3ZK) • 16 mm wide embossed taping
  • Pin 1 on draw-out side
  • 2,500 pcs/reel μ PD121W33AT1F-E2-AT Note 5-PIN TO-252 (5-PIN MP-3ZK) • 16 mm wide embossed taping
  • Pin 1 at take-up side
  • 2,500 pcs/reel μ PD121W00AT1F-E1-AT Note 5-PIN TO-252 (5-PIN MP-3ZK) • 16 mm wide embossed taping
  • Pin 1 on draw-out side
  • 2,500 pcs/reel μ PD121W00AT1F-E2-AT Note 5-PIN TO-252 (5-PIN MP-3ZK) • 16 mm wide embossed taping
  • Pin 1 at take-up side
  • 2,500 pcs/reel Note Pb-free (This product does not contain Pb in the external electrode and other parts.)

Data Sheet G18852EJ1V0DS 4 μ PD121WxxA Series ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Rating Unit Input Voltage VIN −0.3 to +6.0 V ON/OFF Pin Voltage VON/OFF −0.3 to VIN V Internal Power Dissipation (TC = 25°C) Note PT 10 W Operating Ambient Temperature TA −40 to +85 °C Operating Junction Temperature TJ −40 to +150 °C Storage Temperature Tstg −55 to +150 °C Thermal Resistance (junction to ambient) R th(J-A) 125 °C/W Thermal Resistance (junction to case) R th(J-C) 12.5 °C/W Note Internally limited. When the operati ng junction temperature rises above 150° C, the internal circuit shuts down the output voltage. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum rating s are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. TYPICAL CONNECTION μ PD121W18A, μ PD121W25A, μ PD121W33A GND GND PD121W18A, 25A, 33Aμ OUTPUT OUTPUTINPUT ON/OFF INPUT CIN COUT μ PD121W00A PD121W00A GND GND INPUT OUTPUT ADJ OUTPUTINPUT CIN COUT ON/OFF μ

Data Sheet G18852EJ1V0DS 5 μ PD121WxxA Series CIN : 0.1 μ F or higher. Be sure to connect CIN to prevent parasitic oscillation. Set this value according to the length of the line between the regulator and the INPUT pin. Use of a film capacitor or other capacitor with first-rate voltage and temperature characteristics is recommend ed. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 μ F or higher for the voltage and temperature range to be used. COUT : 10 μ F or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN and COUT as close as possible to the IC pins (within 1 to 2 cm). Also, in case of using a laminated ceramic capacitor, please note following items.

  • It is necessary to ensure that COUT is 10 μ F or higher for the voltage and temperature range to be used.
  • In case of using laminated ceramic capacitor, it is easy to become state of parasitic oscillation. Because ESR of laminated ceramic capacitor is very low. Theref ore, the capacitor and load condition (output current) which fulfill the condition of the stable operation area of ESR shown below are recommended.
  • Stable Operation Area as below is regulated under co ndition of which this product is not on a substrate. Therefore impedance on substrate is not considered. D1 : If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. D2 : If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode. R1, R2: The total amount of R1 and R2 is sure to below 500 kΩ (375 kΩ TYP .). R2 = 100 kΩ is recommended. VOUT = (1 + R1/R2) VADJ Note Note When VOUT = 3.0 V: R1 = 275 kΩ, R2 = 100 kΩ Caution Make sure that no external voltage is applied to the OUTPUT pin. μ PD121WxxA Series COUT ESR Stable Operation Area 0.1 0.01 0 150 300 450 600 750 900 1050 1200 1350 1500 ESR (Ω) IO (mA) Unstable Operation Area Unstable Operation Area Stable Operation Area

Data Sheet G18852EJ1V0DS 6 μ PD121WxxA Series RECOMMENDED OPERATING CONDITIONS Parameter Symbol Type Number MIN. TYP. MAX. Unit μ PD121W18A 2.8 5.5 V μ PD121W25A 3.5 5.5 V μ PD121W33A 4.3 5.5 V Input Voltage VIN μ PD121W00A V O + 1 5.5 V Output Voltage VO μ PD121W00A 1.8 3.3 V ON/OFF Pin Voltage VON/OFF All 0 V IN V Output Current IO All 0 1.5 A Operating Ambient Temperature T A All − 40 + 85 °C Operating Junction Temperature T J All − 40 + 125 °C Caution1. Turn on VIN and VON/OFF at the same time, or turn on VIN first and then VON/OFF. Turn off VIN and VON/OFF at the same time, or turn off VON/OFF first and then VIN. 2. If absolute maximum rating is not exceeded, you can used this product above the recommended operating range. However, since a margin with absolute maximum rating decreases, please use this product after sufficient evaluation.

ELECTRICAL CHARACTERISTICS

μ PD121W18A (TJ = 25°C, VIN = VON/OFF = 2.8 V, IO = 1.0 A, CIN = 0.1 μ F, COUT = 10 μ F, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit VO1 − 1.764 1.8 1.836 V Output Voltage Line Regulation REGIN 2.8 V ≤ VIN ≤ 5.5 V − 1 18 mV Load Regulation REGL 0 A ≤ IO ≤ 1.5 A − 1 18 mV IBIAS1 I O = 0 A − 150 300 μ A Quiescent Current IBIAS2 I O = 1.5 A − (2500) (5000) μ A ΔIBIAS1 2.8 V ≤ VIN ≤ 5.5 V − (100) (300) μ A Quiescent Current Change ΔIBIAS2 0 A ≤ IO ≤ 1.5 A − (2350) (5000) μ A Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 160 − μ Vr.m.s. Ripple Rejection R • R f = 1 kHz, 2.8 V ≤ VIN ≤ 3.8 V − 65 − dB Dropout Voltage VDIF I O = 1.5 A − 0.6 1.0 V Short Circuit Current IOshort − − 1.0 − A Peak Output Current IOpeak − 1.5 − − A Temperature Coefficient of Output Voltage ΔVO/ΔT I O = 5 mA, 0°C ≤ TJ ≤ 125°C − 0.01 − mV/°C ON-state Voltage VON I O = 0 A 1.5 − VIN V OFF-state Voltage VOFF IO = 0 A − − 0.5 V ON-state ON/OFF Pin Current I ON I O = 0 A − − 2 μ A Standby Current IBIAS(OFF) V ON/OFF = 0 V − − 1 μ A Remark Values in parentheses are product design values, and are thus provided as reference values.

Data Sheet G18852EJ1V0DS 7 μ PD121WxxA Series μ PD121W25A (TJ = 25°C, VIN = VON/OFF = 3.5 V, IO = 1.0 A, CIN = 0.1 μ F, COUT = 10 μ F, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit VO1 − 2.45 2.5 2.55 V Output Voltage Line Regulation REGIN 3.5 V ≤ VIN ≤ 5.5 V − 1 25 mV Load Regulation REGL 0 A ≤ IO ≤ 1.5 A − 1 25 mV IBIAS1 I O = 0 A − 150 300 μ A Quiescent Current IBIAS2 I O = 1.5 A − (2500) (5000) μ A ΔIBIAS1 3.5 V ≤ VIN ≤ 5.5 V − (100) (300) μ A Quiescent Current Change ΔIBIAS2 0 A ≤ IO ≤ 1.5 A − (2350) (5000) μ A Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 230 − μ Vr.m.s. Ripple Rejection R • R f = 1 kHz, 3.5 V ≤ VIN ≤ 4.5 V − 60 − dB Dropout Voltage VDIF I O = 1.5 A − 0.7 1.0 V Short Circuit Current IOshort − − 1.0 − A Peak Output Current IOpeak − 1.5 − − A Temperature Coefficient of Output Voltage ΔVO/ΔT I O = 5 mA, 0°C ≤ TJ ≤ 125°C − −0.07 − mV/°C ON-state Voltage VON I O = 0 A 1.5 − VIN V OFF-state Voltage VOFF IO = 0 A − − 0.5 V ON-state ON/OFF Pin Current I ON I O = 0 A − − 2 μ A Standby Current IBIAS(OFF) V ON/OFF = 0 V − − 1 μ A Remark Values in parentheses are product design values, and are thus provided as reference values.

Data Sheet G18852EJ1V0DS 8 μ PD121WxxA Series μ PD121W33A (TJ = 25°C, VIN = VON/OFF = 5.0 V, IO = 1.0 A, CIN = 0.1 μ F, COUT = 10 μ F, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit VO1 − 3.234 3.3 3.366 V Output Voltage Line Regulation REGIN 4.3 V ≤ VIN ≤ 5.5 V − 1 33 mV Load Regulation REGL 0 A ≤ IO ≤ 1.5 A − 1 33 mV IBIAS1 I O = 0 A − 150 300 μ A Quiescent Current IBIAS2 I O = 1.5 A − (2500) (5000) μ A ΔIBIAS1 4.3 V ≤ VIN ≤ 5.5 V − (100) (300) μ A Quiescent Current Change ΔIBIAS2 0 A ≤ IO ≤ 1.5 A − (2350) (5000) μ A Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 340 − μ Vr.m.s. Ripple Rejection R • R f = 1 kHz, 4.3 V ≤ VIN ≤ 5.3 V − 60 − dB Dropout Voltage VDIF I O = 1.5 A − 0.6 1.0 V Short Circuit Current IOshort − − 1.0 − A Peak Output Current IOpeak − 1.5 − − A Temperature Coefficient of Output Voltage ΔVO/ΔT I O = 5 mA, 0°C ≤ TJ ≤ 125°C − −0.1 − mV/°C ON-state Voltage VON I O = 0 A 1.5 − VIN V OFF-state Voltage VOFF IO = 0 A − − 0.5 V ON-state ON/OFF Pin Current I ON I O = 0 A − − 2 μ A Standby Current IBIAS(OFF) V ON/OFF = 0 V − − 1 μ A Remark Values in parentheses are product design values, and are thus provided as reference values.

Data Sheet G18852EJ1V0DS 9 μ PD121WxxA Series μ PD121W00A (TJ = 25°C, VIN = VON/OFF = 5.0 V, IO = 1.0 A, VO = 3.0 V, CIN = 0.1 μ F, COUT = 10 μ F, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit VADJ1 − −2% Note 0.8 +2% Note V Reference Voltage VADJ2 2.8 V ≤ VIN ≤ 5.5 V, 0 A ≤ IO ≤ 1.5 A (−3%) Note − (+3%) Note V Line Regulation REGIN V O + 1 V ≤ VIN ≤ 5.5 V − 1 1% Note mV Load Regulation REGL 0 A ≤ IO ≤ 1.5 A − 1 1% Note mV IBIAS1 I O = 0 A − 150 300 μ A Quiescent Current IBIAS2 I O = 1.5 A − (2500) (5000) μ A ΔIBIAS1 V O + 1 V ≤ VIN ≤ 5.5 V − (100) (300) μ A Quiescent Current Change ΔIBIAS2 0 A ≤ IO ≤ 1.5 A − (2350) (5000) μ A Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 220 − μ Vr.m.s. Ripple Rejection R • R f = 1 kHz, V O + 1 V ≤ VIN ≤ VO + 2 V − 70 − dB Dropout Voltage VDIF I O = 1.5 A − 0.6 1.0 V Short Circuit Current IOshort − − 1.0 − A Peak Output Current IOpeak − 1.5 − − A Temperature Coefficient of Output Voltage ΔVO/ΔT I O = 5 mA, 0°C ≤ TJ ≤ 125°C − −0.12 − mV/°C ON-state Voltage VON I O = 0 A 1.5 − VIN V OFF-state Voltage VOFF IO = 0 A − − 0.5 V ON-state ON/OFF Pin Current I ON I O = 0 A − − 2 μ A Standby Current IBIAS(OFF) V ON/OFF = 0 V − − 1 μ A Note This is the percentage to the output voltage (VO: the unit is V). Remark Values in parentheses are product design values, and are thus provided as reference values.

Data Sheet G18852EJ1V0DS 10 μ PD121WxxA Series TYPICAL CHARACTERISTICS PD vs. TA Δ VO vs.TJ PD - Power Dissipation - W 50 85 100 150 1.0 With infinite heatsink Without heatsink TA - Operating Ambient Temperature - °C Δ VO - Output Voltage Temperature Change - mV 10.0 5.0 -5.0 -10.0 -15.0 -40 -15 10 35 60 85 110 125 IO = 5 mA PD121W18Aμ PD121W25Aμ PD121W33Aμ PD121W00Aμ 5.0 V Note VO = 3.0 V VIN = VON/OFF = 2.8 V 5.0 V 3.5 V Note TJ - Operating Junction Temperature - °C VO vs. VIN, IBIAS vs. VIN ( μ PD121W18A) VO vs. VIN, IBIAS vs. VIN (μ PD121W25A) VO - Output Voltage - V 2.5 2.0 1.5 1.0 0.5 5000 4000 3000 2000 1000 IBIAS IO = 0.9 A 0.5 A 0 A VO 0.9 A 0.5 A 0 A TJ = 25°C VIN - Input Voltage - V IBIAS - Quiescent Current - μ A VO - Output Voltage - V 3.0 2.5 2.0 1.5 1.0 0.5 5000 4000 3000 2000 1000 TJ = 25°C IBIAS IO = 0.9 A 0.5 A 0 A VO 0.9 A 0.5 A 0 A VIN - Input Voltage - V IBIAS - Quiescent Current - μ A VO vs. VIN, IBIAS vs. VIN (μ PD121W33A) VO vs. VIN, IBIAS vs. VIN (μ PD121W00A) VO - Output Voltage - V 4.0 3.0 2.0 1.0 5000 4000 3000 2000 1000 IBIAS IO = 0.9 A 0.5 A 0 A 0.9 A 0.5 A 0 A VO TJ = 25°C VIN - Input Voltage - V IBIAS - Quiescent Current - μ A VO - Output Voltage - V 4.0 3.0 2.0 1.0 5000 4000 3000 2000 1000 IBIAS IO = 0.9 A 0.5 A 0 A VO0.9 A 0.5 A 0 A TJ = 25°C VO = 3.0 V VIN - Input Voltage - V IBIAS - Quiescent Current - μ A

Data Sheet G18852EJ1V0DS 11 μ PD121WxxA Series IOpeak vs. VDIF VDIF vs. IO IOpeak - Peak Output Current - A 3.0 2.5 2.0 1.5 1.0 0.5 PD121W18Aμ PD121W25Aμ PD121W33Aμ PD121W00Aμ TJ = 25°C Note VO = 3.0 V Note VDIF - Dropout Voltage - V VDIF - Dropout Voltage - V TJ = 25°C1.2 1.0 0.8 0.6 0.4 0.2 PD121W18Aμ PD121W25Aμ PD121W33Aμ IO - Output Current - A R • R vs. f ( μ PD121W18A) R • R vs. f (μ PD121W25A) R • R - Ripple Rejection - dB TJ = 25°C VIN = 2.8 to 3.8 V VON/OFF = 1.5 V CIN = 0.1 μ F COUT = 10 μ F IO = 5 mA 0.5 A 1.0 A f - Frequency - Hz R • R - Ripple Rejection - dB TJ = 25°C VIN = 3.5 to 4.5 V VON/OFF = 1.5 V CIN = 0.1 μ F COUT = 10 μ F 1.0 A IO = 5 mA 0.5 A f - Frequency - Hz R • R vs. f (μ PD121W33A) R • R vs. f (μ PD121W00A) R • R - Ripple Rejection - dB TJ = 25°C VIN = 4.3 to 5.3 V VON/OFF = 1.5 V CIN = 0.1 μ F COUT = 10 μ F IO = 5 mA 0.5 A 1.0 A f - Frequency - Hz R • R - Ripple Rejection - dB TJ = 25°C VO = 3.0 V VIN = 4.0 to 5.0 V VON/OFF = 1.5 V CIN = 0.1 μ F COUT = 10 μ F IO = 5 mA 0.5 A 1.0 A f - Frequency - Hz 10 100 1 k 10 k 100 k 10 100 1 k 10 k 100 k 10 100 1 k 10 k 100 k 10 100 1 k 10 k 100 k

Data Sheet G18852EJ1V0DS 12 μ PD121WxxA Series VO vs. IO ( μ PD121W18A) V O vs. IO ( μ PD121W25A) VO - Output Voltage - V 4.0 3.5 3.0 2.0 2.5 1.0 0.5 1.5 TJ = 25°C VIN = VON/OFF = 2.8 V IO - Output Current - A VO - Output Voltage - V 4.0 3.5 3.0 2.0 2.5 1.0 0.5 1.5 TJ = 25°C VIN = VON/OFF = 3.5 V IO - Output Current - A VO vs. IO ( μ PD121W33A) VO - Output Voltage - V 4.0 3.5 3.0 2.0 2.5 1.0 0.5 1.5 TJ = 25°C VIN = VON/OFF = 5.0 V IO - Output Current - A

Data Sheet G18852EJ1V0DS 13 μ PD121WxxA Series PACKAGE DRAWING (Unit: mm) 5-PIN TO-252 (MP-3ZK) E A D 12 34 5 H e E1 L1 ITEM DIMENSIONS D E H A b e 6.10 4.4TYP(4.0MIN) 4.4TYP(4.3MIN) ±0.20 6.50 ±0.20 9.8TYP(10.3MAX) 0 to 0.25 2.30± 0.10 0.60± 0.10 0.50± 0.10 0.50± 0.10 1.52± 0.12 5.0 (UNIT:mm) 0.508 1.14 1.0 0.80 L c 2006 b GAUGE PLANE SEATING PLANE NOTE 1. No Plating area Lc P5T1F-114-1

Data Sheet G18852EJ1V0DS 14 μ PD121WxxA Series RECOMMENDED MOUNTING CONDITIONS The μ PD121WxxA Series should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than th ose recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) μ PD121W18AT1F-AT Note, μ PD121W25AT1F-AT Note, μ PD121W33AT1F-AT Note, μ PD121W00AT1F-AT Note: 5-PIN TO-252 (5-PIN MP-3ZK) Process Conditions Symbol Infrared reflow Package peak temperature: 260°C, Time: 60 seconds MAX. (at 220°C or higher), Count: Three times, Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. IR60-00-3 Partial Heating Method Pin temperature: 350 °C or below, Heat time: 3 seconds or less (per each side of the device). P350 Note Pb-free (This product does not contain Pb in the external electrode and other parts.) Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. REFERENCE DOCUMENTS USER’S MANUAL USAGE OF THREE TERMINAL REGULATORS Document No.G12702E INFORMATION VOLTAGE REGULATOR OF SMD Document No.G11872E SEMICONDUCTOR DEVICE MOUNT MANUAL http:// www.necel.com/pkg/en/mount/index.html

Data Sheet G18852EJ1V0DS 15 μ PD121WxxA Series VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V IL (MAX) and V IH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between V IL (MAX) and VIH (MIN). HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. NOTES FOR CMOS DEVICES

μ PD121WxxA Series The information in this document is current as of July, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific":