UPC812

UPC812 NEC | Alldatasheet

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DUAL J-FET INPUT LOW-OFFSET OPERATIONAL AMPLIFIER DESCRIPTION FEATURES Dual operational amplifier uPC812 offers high input ® Stable operation with 10 000 pF capacitive load impedance, low offset voltage, high slew rate, and © Low input offset voltage stable AC operating characteristics. NEC’s unique +3 mV (MAX.) high-speed PNP transistor (ft = 300 MHz) in the output +7 .V/°C (TYP.) temperature drift stage solves the oscillation problem of current sinking © Very low input bias and offset currents with a large capacitive load. Zener-zap resistor trim- © Low noise : en = 19 nV/VHz (TYP.) ming in the input stage produces excellent offset © Output short circuit protection voltage and temperature drift characteristics. © High input impedance ... J-FET Input Stage © Internal frequency compensation ® High slew rate: 15 V/s (TYP.) CONNECTION DIAGRAM EQUIVALENT CIRCUIT (1/2 Circuit) {Top View) | (7 pPC812C,812G2 | ] | Tis, } | OUT: TA [s]v’ | | ont ‘) hn our: | | A Qi Q | OUT | [erp wt 16] tz " rt HIGH SPEED’ r l Os, Qs Qe o © Li Os Zz TRIMMED

ORDERING INFORMATION

PART NUMBER PACKAGE QUALITY GRADE uPC812C 8 PIN PLASTIC DIP (300 mil) uPC812G2 8 PIN PLASTIC SOP (225 mil) Please refer to “Quality grade on NEC Semiconductor Devices” (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-1981A (0.D. No. IC-66328) Date Published March 1993 M © NEC Corporation 1987 Printed in Japan

ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) a ee ee Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -5.0 mV/°C when ambient temperature is higher than 55 °C. Note 5. Thermal derating factor is -4.4 mV/°C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS [—eanacmene [aoc [ww [ve [oa [ea] [Seon TP se Pd FS [cence aesinsvtevea |e | | oe

ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V* = +15 V) CHARACTERISTIC symeoi| min. | tye. | max. | unit | CONDITION Supply Curent [oe ffs | ee | ma | te-0A, Bot Ampiitors +14.0 Output Voltage Swing Vor 412 133 v Rez 10 kQ | 413.5 Output Voltage Swing Vom +10 128 v Ri22kQ +14 Common Mode Input Voltage Range | View + 2 v [some ae | ie [eS [univ cxinFaaseny ftw |e |e | pit Ever Noe Votoge Dons] || 18 || wn | en toma Input Offset Voltage ve | | | 28 | mv_| Rss 500, T1=-201t0 470°C Average VIO Temperate Orit ave/at] | 27 | [avec | Te=-20w 70°C Note 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the ambient temperature.

TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 °C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 600 120 ie e |i] | [less 2 oof LEE 8 gS Ra 2ko ioe | Pt ¢ N es 5 oy IN Meese CONT PP be NY en eS g BRAN CCN a 8 oy N “ERE, = TT EN a 3 IN 0 20 40 60 80 100 1 10 100 1k 10k 100k 1M 10M Te - Ambient Temperature - °C f — Frequency - Hz LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING 30 ro 40 es Vi=s15V R= es Ru = 10kQ 1 10 kQ. u : os 7 GB 20 & 2 7 Ea VF=#10V 2 3 3% ( 810-71 g 4 ° Vi =25V 6 10 7 > > 100 1k 10k 100 k 1M 10M i) +10 +20 f Frequency - Hz V* = Supply Voltage - V OUTPUT SOURCE CURRENT LIMIT OUTPUT SINK CURRENT LIMIT +15 ~15 RS a fl 1 ‘ rm Lobo LDR s la s ze nme Y VN 37 Tae] a & |

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« : 2 ! fe) 10 20 30 i} 10 20 30 lo source - Source Current - mA lo six - Sink Current - mA

INPUT BIAS CURRENT INPUT EQUIVALENT NOISE VOLTAGE DENSITY 100 a 80, | Vi = £15V i V*=215V Rs = 100Q 1 10 ge ; | | i % 5 $! 8 ro La HA 3 ge 2 | sO 20 a Se =o <4 net ool] _ oo 200 20. 40~«6O 80 10 700 Tk TOK 100k Ta Ambient Temperature ~ °C £- Frequency - Hz SUPPLY CURRENT ae ee = | | 7 50 S z 3.0 2 20 se ee i} +5 +10 +15 +20 V*~ Supply Voltage - V VOLTAGE FOLLOWER PULSE RESPONSE VOLTAGE FOLLOWER PULSE RESPONSE (RL= 2 kQ, Ci = 100 pF} (Re = 2 kQ, CL = 10.000 pF) sv M po pope +10 Ta +10 ; - TET rrr] ft | i oo pti it 10 pH i ~10 aan 0 2 4 6 (ys) ) 20 40 60 (us)

8 PIN PLASTIC DIP (300 mil)

[to 4 | A K P =| > VOI f\\___/N F-H th Cc B M O~15° D Pac-100.2008.¢ NOTES ITEM MILLIMETERS | ‘INCHES | 1) Each lead centerline is located within 0.25 — 4 maximum material condition. 8 1.27 MAX. 0.050 MAX 2) Item “K” to center of leads when formed jp} fe parallel o | 0.50*9'9 | 0.02078 003 F 1.4 MIN i 0.055 MIN. 4 S| 3.2208 0.126200 | 9st mn. 0.020 MIN. i] | 4.31 MAX. | 0.170 MAX. J 5.08 MAX. | 0.200 MAX. pou 6.4 0.252 M 0.25 78:88 0.01078 803 1 . N 0.25 0.01 ce | 0.9 MIN. 0.035 MIN

8 PIN PLASTIC SOP (225 mil)

Lj] Pi [i SS in Qeee & LI CO OO 1 4 A H © — J | LET ET /, a\\e Abt tt byt “ —— i 5 ote a d fo[m @) S8GM-50-225B-2 NOTE ITEM] MILLIMETERS | INCHES | Each lead centerline is located within 0.12 maximum material condition [3 | 0.78 MAX 0.031 MAX. pb | o.orsee E 0120.1 0.00420.004 1.8 MAX. 0.071MAX 6.5203 0.256+0.012 0.15 0.006

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (1EI-1207). [ uPC812G2 ] Soldering . oe Recommended method | Soldering conditions condition symbol i Infrared ray reflow | Peak package's surface temperature: 230 °C or below, | Reflow time: 30 seconds or below (210 °C or higher), | 1R30-00-1 Number of reflow process: 1, Exposure limit*: None | VPS Peak package's surface temperature: 215 °C or below, | | Reflow time: 40 seconds or below (200 °C or higher), | VP15-00-1 Number of reflow process: 1, Exposure limit*: None | Wave soldering | Solder temperature: 260 °C or below, | Flow time: 10 seconds or below, | WS15-00-1 | Number of flow process: 1, Exposure limit*: None Partial heating method | Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for “Partial heating method.” TYPES OF THROUGH HOLE DEVICE [uPC812C] Soldering . aoe | Recommended method | Soldering conditions condition symbol Wave soldering Solder temperature: 260 °C or below, | Flow time: 10 seconds or below

[MEMO]

[MEMO] No part of this document may be copied or reproduced in any from or by any means without the prior written consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6