UPC811

UPC811 NEC | Alldatasheet

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J-FET INPUT LOW-OFFSET OPERATIONAL AMPLIFIER DESCRIPTION FEATURES The pPC811 operational amplifier offers high input © Stable operation with 10 000 pF capacitive load impedance, low offset voltage, high slew rate, and © Low input offset voltage and offset voltage null stable AC operating characteristics. NEC’s unique capability high-speed PNP transistor (ft = 300 MHz) in the output £2.5 mV (MAX.) stage solves the oscillation problem of current sink- +7 V/°C (TYP.) temperature drift ing with a large capacitive load. Zener-zap resistor ® Very low input bias and offset currents trimming in the input stage produces excellent offset © Low noise : en = 19 nV/VHz (TYP.) voltage and temperature drift characteristics. © Output short circuit protection © High input impedance ... J-FET Input Stage © Internal frequency compensation © High slew rate: 15 V/us (TYP.) CONNECTION DIAGRAM EQUIVALENT CIRCUIT {Top View) v | ‘ am | pPC811C, 81162 | OFFSET Qs | oe GI [8] NC os | (2) | h vt oO (6) | c | In {6] OUTPUT In | | @) 0 (HIGH SPEED) | T PNP | F [5] OFFSET Os LL py2t | vig 5} Nuit Qe Qe a) (5) Os a OFFSET ‘ OFFSET NULL NULL (4) — v TRIMMED

ORDERING INFORMATION

PART NUMBER | PACKAGE QUALITY GRADE uPC811C | 8 PIN PLASTIC DIP (300 mil) Please refer to “Quality grade on NEC Semiconductor Devices” (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-1980A _ {0.D. No. IC-6802A) Date Published March 1993 M © NEC Corporation 1987 Printed in Japan

ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) Power Dissipation Pr ee [espa San ie owon Sew [ats | Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -5.0 mV/°C when ambient temperature is higher than 55 °C. Note 5. Thermal derating factor is -4.4 mV/°C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Fouacuen P|] OFFSET VOLTAGE NULL CIRCUIT ° 5 VRi o |

ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V* = +15 V) CHARACTERISTIC SYMBOL [ min. | tye. | max. | unit | CONDITION [now sie caren [we | | wo | me fea +14.0 Output Voltage Swing Voo | #12 | 18 v Riz 10 kQ 13.5 Ouspas Votiaae Seine pe foe fo] |e | eens +14 Common Model Input Voltage Range | Vim | £11 2 v [sete | |e [id Input Equivalent Noise Voltage Density je | | » | | nV/NHz | Rs = 100 Q, f= 1 kHz Input Offeet Vottage [ve f |) 8 | mv | mSs00 t=-2000 70-0 Average VIO Temperature Drift | 4VioAT ee uvec | Ts =-20 to +70°C Note 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the ambient temperature.

TYPICAL PERFORMANCE CHARACTERISTICS (To = 25 °C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 600 120 = soit | | | | | yt yt © 10h Ris 2ko Bo SEE pt | KI] TT SA) a as S x \\ tg RECS Pet INT & solic [TT SAT TT S$ 6 N EARS CCN Fay) a OS 3 a IN Pee SCN : 2 it | T TTT TT ir | S 9 IN CERRO N Lit Py Py ttt | 0 IN 0 20 40 60 80 100 1 10 100 1k 10k 100k 1M 10M Ta - Ambient Temperature ~ °C f ~ Frequency ~ Hz LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING od 40 3 vrst5y Re= . S |Re=10ka o 10kQ 4 30 A e) A a 3 & Vt = #10V & 3 3 20 7 z z SL) ee g Lo [~ \\ i 1 , > IN > 100 ik 10k 100k 1M 10M 0 210 £20 f - Frequency — Hz V* - Supply Voltage - V OUTPUT SOURCE CURRENT LIMIT OUTPUT SINK CURRENT LIMIT +15 ~15 a - “ROS f i Ns. 3 —— S +10 05 N Ze T= 70°C + 3 T= 70°C! | 3 J | 6 1 fe} 25°C a +5 5 8 -5 06. Psa] & 20°C 8 | 1 1 ; Th 3 Lis 0 10 20 30 0 10 20 30 lo source — Source Current - mA lo sinx — Sink Current - mA

INPUT BIAS CURRENT INPUT EQUIVALENT NOISE VOLTAGE DENSITY 100 50 | V¥=ai5V x 40}- — T z 2s | 5 g | 3 || Za ab ep ) TT Oo 22> | @ 1.0 7 23 | FE 8 | | @ 8 20 a 1 7 1s 4 sS 10 t | | oonl__| ol _ -20.0 a a r) 10 700 Tk TOK 100k Ts Ambient Temperature - °C f ~ Frequency - Hz SUPPLY CURRENT | | 3.0 ei, | | | | 1 28 ——— £ 20 215 Ey ? 10 os 0 +5 +10 +15 +20 V*~ Supply Voltage - V VOLTAGE FOLLOWER PULSE RESPONSE VOLTAGE FOLLOWER PULSE RESPONSE (Vi =+15V, Av=1) (WV =+15V, Av=1) (R= 2kQ, Co = 100 pF) (Ru = 2k, Ce = 10.000 pF) sv : M) +10 + —— +10 - + on {+} 0 1 i 0 i ~10 ie ee i -10 +—t t fee aia i r=] - Try | 498 1 “TT yaue | 0 2 4 6 ls) 0 20 40 «60 Uys)

8 PIN PLASTIC DIP (300 mil)

[rs | A K P == > VOI Ly S/N For i Cc B M 0~15° D Pac-100-2008,¢ NOTES ITem MILLIMETERS i} - INCHES | 1) Each lead centerline is located within 0.25 er 2) Item “K" to center of leads when formed ' nn parallel D 0.505" 0.02078 888 | F 1.4 MIN 0.055 MIN. 6 3.2803 0.126200 Z H | 0.51 MIN 0.020 MIN 1 4.31 MAX. 0.170 MAX. J 5.08 MAX. 0.200 MAX. Jou | 64 0.252 M 0.25 78:68 0.010 8:83 N 0.25 0.01 P 0.9 MIN 0.035 MIN. 1 Pf OS MIN, | 0.035 MIN.

8 PIN PLASTIC SOP (225 mil)

Ci ft] tl Ty SS On WHee Ea CM oO Oo 1 4 A H I J | Ga fo | | ALPE ET TY 7 pe a\\e —\\} we a a] Zee 8 ; “ — {al NJ o[é[u w) S8GM-50-225B-2 NOTE ITEM] MILLIMETERS INCHES Each lead centerline is located within 0.12 i maximum material condition. [8 | 0.78 MAX. 0.031 MAX 1.8 MAX 0.071MAX. 1.49 0.059 H 6520.3 0.256£0.012 | 44 0.173 0.60.2 0.02479:898

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). [ uPC811G2 ] Soldering . age Recommended method Soldering conditions condition symbol Infrared ray reflow Peak package's surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), 1R30-00-1 Number of reflow process: 1, Exposure limit*: None VPS | Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), VP15-00-1 Number of reflow process: 1, Exposure limit*: None Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below WS15-00-1 Number of flow process: 1, Exposure limit*: None Partial heating method | Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for “Partial heating method.” TYPES OF THROUGH HOLE DEVICE [uPC811C] Soldering Solderi diti Recommended method ‘oldering conditions condition symbol Wave soldering Solder temperature: 260 °C or below, | Flow time: 10 seconds or below

[MEMO]

[MEMO] No part of this document may be copied or reproduced in any from or by any means without the prior written consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6