UPC8101GR RENESAS | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 18
Technical content
To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
- All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas Electronics has used reasonable care in preparing th e information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. Renesas Electronics products ar e classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: Computers; office equipmen t; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti- crime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics pr oducts described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesa s Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesa s Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority- owned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
© 1995,1999 DATA SHEET PART NUMBER PACKAGE SUPPLYING FORM µPC8101GR-E2 20 pin plastic SSOP Embossed tape 12 mm wide. QTY 2.5 kp/Reel. (225 mil) Pin 1 indicates roll-in direction of tape. BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8101GR
DESCRIPTION
µPC8101GR is a silicon monolithic integrated circuit designed as up-to-150 MHz quadrature modulator for digital mobile communications, mainly CT2. This modulator consists of digital 90° phase shifter, dual mixers and various buffer amplifiers which are packaged in 20 pin SSOP. Up/down converter IC (µPC8100GR) is also available as for kit-use with this IC. So, these pair devices contribute to make RF block small, high-performance and low power-consumption. This product is manufactured using NEC’s 20 GHz fT NESAT III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion and migration. Thus, this product has excellent performance, uniformity and reliability.
FEATURES
- Operating frequency: fIF = 50 MHz to 150 MHz, Local input frequency: fLo = 100 MHz to 300 MHz, fI/Q = DC to 500 kHz
- Digital 90° phase shifter is incorporated. (Due to the flip flop phase shifter, fIF = fLo/2 + fI/Q.)
- 20 pin SSOP suitable for high-density surface mounting.
- Supply voltage VCC = 2.7 to 5.5 V
- Equipped with Power Save Function.
APPLICATIONS
- Typical application – Digital cordless phone CT2. (In the case of I/Q method)
- Further application – Digital communication equipments.
ORDERING INFORMATION
Remark To order evaluation samples, please contact your local NEC sales office. (Order number: µPC8101GR)
150 MHz SILICON QUADRATURE MODULATOR IC
FOR DIGITAL MOBILE COMMUNICATIONS Document No. P10818EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan Caution electro-static sensitive devices The mark shows major revised points. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS 20 19 18 17 16 15 14 13 12 11 123456789 1 0 REG. LPF LPF F / F 90° 270° 180° 1. LOCAL IN 2. LOCAL IN 3. GND 4. Q – BIAS 5. Q – BIAS 6. GND 7. Q – INPUT 8. Q – INPUT 9. GND 10. IF OUTPUT 11. V CC 12. POWER SAVE 13. I – INPUT 14. I – INPUT 15. GND 16. I – BIAS 17. I – BIAS 18. GND 19. N.C. 20. GND (Top View) Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 PIN EXPLANATION
1 LOCAL IN – –
2 LOCAL IN – 2.0
3 GND 0 –
4 Q-BIAS – 0.175 5 Q-BIAS – 0.175
6 GND 0 –
7 Q-INPUT V
CC /2 –
8 Q-INPUT V CC /2 –
9 GND 0 –
10 IF OUTPUT – 1.4 11 V CC 2.7 to 5.5 – PIN ASSIGNMENT APPLIED PIN VOLTAGE FUNCTION AND APPLICATION EQUIVALENT CIRCUITNO. VOLTAGE (V) (V) Local input for phase shifter. This input impedance is 50 Ω matched internally. Bypass of local buffer amplifier input. Grounded through capacitor. It must be connected to the system ground with minimum inductance. Ground pat- tern on the board should be formed as wide as possible. (Track length should be kept as short as possible.) These pins are to adjust local leakage level. These pins should be grounded through register 1 kΩ adjustable 30 mV offset. Track length should be kept as short as possible. Input for Q signal. This input impedance is larger than 500 kΩ . As Q signal, V CC / 2 bias DC signal should be input. Input for Q signal. This input impedance is larger than 500 kΩ . As Q signal, VCC / 2 biased 1VP–P signal should be input. Track length should be kept as short as possible. IF output from modulator. This output is emitter follower as 50 Ω impedance. IF output frequency is provided as fIF = fLo/ 2 + fI/Q. Supply voltage pin. VCC 1 2 5 4 Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 12 POWER 0 to 5.5 – SAVE
13 I-INPUT V CC /2 –
14 I-INPUT V CC /2 –
15 GND 0 –
16 I-BIAS – 0.175 17 I-BIAS – 0.175
18 GND 0 –
19 N.C – –
20 GND 0 –
- Pin voltage at VCC = 2.7 V PIN ASSIGNMENT APPLIED PIN VOLTAGE FUNCTION AND APPLICATION EQUIVALENT CIRCUITNO. VOLTAGE (V) (V) 16 17 Power save control pin. This pin can control ON/OFF operation with bias as follows; Bias: V Operation VPS ≥1.8 ON 0 to 1.0 OFF Input for I signal. This input imped- ance is larger than 500 kΩ . As I signal, V CC /2 biased 1 VP–P MAX. signal should be input. Input for I signal. This input imped- ance is larger than 500 kΩ . As I signal, V CC /2 bias DC signal should be input. Track length should be kept as short as possible. These pins are to adjust local leakage level. These pins should be grounded through register 1 kΩ adjustable 30 mV offset. Track length should be kept as short as possible. Non connection Track length should be kept as short as possible. Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 ABSOLUTE MAXIMUM RATINGS Supply Voltage V CC TA = +25 °C 6.0 V Power Dissipation P D Mounted on 50 × 50 × 1.6 mm double copper 530 mW clad epoxy glass board at TA = +70 °C Operating Temperature T opt –20 to +70 °C Storage Temperature T stg –65 to +150 °C RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply Voltage V CC 2.7 3.0 5.5 V Operating Temperature T opt –20 +25 +70 °C ELECTRICAL CHARACTERISTICS (T A = +25 °C, UNLESS OTHERWISE SPECIFIED V P/S ≥ 1.8 V) PARAMETER SYMBOL VCC = 2.7 V V CC = 5.5 V UNIT TEST CONDITION Circuit current power-save mode ICC (P/S) 330 480 1050 1500 µAV P/S ≤ 1.0 V IF output level P IFout –15 –11 –7.0 –12.5 –7.7 –4.5 dBm 50 Ω load, f = fLo/2 + fI/Q*1 Local leakage (carrier) ISO(Lo) 26.0 35.0 30.6 dBc f = f Lo/2*1 Local leak level at IFout pin Lo if –49 –37 –39.4 –28 dBm I/Qinput : DC = V CC /2 Image rejection (side band leak) ImR 28.5 37.5 28.5 38.2 dBc f = f Lo/2 – fI/Q*1 I/Q input impedance Z I/Q 500 1 000 500 700 k Ω I/Qbias = 2.75 V rise time TP/S(RISE) 1.0 5.0 1.0 5.0 µsV P/S(OFF) → VP/S(ON) fall time TP/S(FALL) 1.0 3.0 1.0 3.0 µsV P/S(ON) → VP/S(OFF) Power-save control voltage V P/S(ON) 1.8 5.5 1.8 5.5 V Normal operation VP/S(OFF) 1.0 1.0 V Power-save mode Local input level P Loin –17 –7 –17 –7 dBm STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 °C, UNLESS OTHERWISE SPECIFIED V P/S ≥ 1.8 V) PARAMETER SYMBOL VCC = 2.7 V V CC = 5.5 V UNIT TEST CONDITION IM3I/Q –37.3 –56.5 dBc f = f Lo/2 – 3fI/Q*1 Local input VSWR VSWR Loin 1.1 1.1 X : 1 IF output VSWR VSWR IFout 1.2 1.2 X : 1 3rd order distortion of I/Q Power-save response time *1 :fLoin = 300.1 MHz PLoin = –10 dBm fI/Q = 36 kHz 1 VP-P DC = VCC /2 Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 TEST CIRCUIT SIGNAL f (MHz) PIN Lo 300.1 MHz –10 dBm I signal 36 kHz 1 V P-P Q signal 36 kHz 1 V P-P I/Q phase difference = 90° In the case of local leak level measurement, I/Q signal is applied as only DC. SYMBOL Applied voltage (V) VCC = VP/S 2.7 to 5.5 V VI = VIb = VO = VOb 0.5 × VCC 20 19 18 17 16 15 14 13 12 11 123456789 1 0 GND (N.C.) GND I – BIAS I – BIAS GND I I P/S V CC LoIN LoIN GND Q – BIAS Q – BIAS GND Q Q GND IF OUT 1 000 pF 30 pF 50 Ω 1 kΩ 1 kΩ 1 000 pF 33 nF 1 kΩ 1 kΩ 33 nF 10 nF 2 000 pF5 Fµ PC8101GRµ I signal Q signal 50 Ω 50 Ω Signal Generator Spectrum Analyzer Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 ˚C) –25 –45 –65 –85 –105 VCC = 2.7 VPout PI/Q PIm PLO I/Q 3d ImR LoL PIm PI/Q PLO Pout–10 –20 –30 –40 –50 –60 –70 –80 10 50 100 500 Input LO frequency f LO (MHz) Output Level (dBm) Output spectrum at IF out pin VCC = 2.7 V fLO vs. Pout, PLO ,PIm, PI/Q PIm PI/Q PLO Pout –10 –20 –30 –40 –50 –60 – 70 –80 10 50 100 500 Input LO frequency f LO (MHz) Output Level (dBm) VCC = 5.5 V fLO vs. Pout, PLO ,PIm, PI/Q TA = +80 ˚C TA = +25 ˚C TA = –30 ˚C Recommended operating range Supply Voltage VCC (V) Circuit Current ICC (mA) VP/S = VCC , No signals VI/Q = VCC /2 VCC vs. ICC Pout PIm PI/Q3rd PLOin is measued on I/Q bias Without signals P/S = VCC I/Q = VCC /2 Lo: fLO = 300.1MHz Pin = –10 dBm I/Q: FI/Q = 450 kHz 1Vp-p –10 –20 –30 –40 –50 –60 –70 –80 2.7 3 3.5 4 4.5 5 5.5 Suppl y Voltage VCC (V) Output Level (dBm) Pout, PIm and PI/Q3rd vs. Supply Voltage PLO Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 –10 –20 –30 –40 –50 –60 –70 –80 – 3 0 – 2 0 – 1 00 1 02 03 04 05 06 07 08 0 Ambrent Temperature TA (˚C) PLO Output Level (dBm) fLO = 300.1 MHz, PLO = – 10dBm Pout PLO PIm PL/Q3d VCC = 2.7 V TA vs. Pout, PLO , PIm, PI/Q 250 200 100 µ µ µ µ I = Ib = Q = Qb = GND VP/S vs. Circuit Current 1 1.21.41.6 2 3 4 5 6 Pin appliod Voltage P/S (V) Circuit Curent ICC (mA) VCC = 5.5 V VCC = 2.7 V Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD COMPONENT MOUNTED SIDE IC MOUNTED SIDE VCC 10 000 pF DC 1 kΩ 1 kΩ 0 Ω 0 Ω 1 000 pF 0 Ω 10 nF PS VCC Ib I IF Q DC Q b 33 nF 33 nF 1 kΩ 1 kΩ 0 Ω Lo fLo = 300 MHz Pin (Lo) = –10 dBm 50 Ω 1 000 pF 2 000 pF200 pF 20 pF 0 Ω 30 pF 457 13 14 16 17 0 Ω C IN1 LO IN C IN2 NEC µPC8101 I IN RF OUT Q IN Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 TYPICAL APPLICATION CT2 BLOCK DIAGRAM RX SW PG131GRµ TX PC8100GRµ PLL PLL DEMO F/F 90° PC8101GRµ I Q I Q The application circuits and their parameters are for references only and are not intended for use in actual design-in's. Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 PACKAGE DIMENSIONS
20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)
1.8 MAX. +7˚ –3˚ 0.65 0.10 M 0.15 0.5 ± 0.2 11 0 6.7 ± 0.3 1.5 ± 0.1 0.1 ± 0.1 0.22 +0.10 –0.05 0.575 MAX. 0.15 +0.10 –0.05 6.4 ± 0.2 NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 Soldering process Infrared ray reflow VPS Wave soldering Partial heating method NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the track length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.q. 1 000 pF) to the V CC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering method and conditions than the recommended conditions are to be consulted with our sales representatives. µPC8101GR Soldering conditions Peak package’s surface temperature: 235 °C or below, Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 2, Exposure limit*: None Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 2, Exposure limit*: None Solder temperature: 260 °C or below, Flow time: 10 seconds or below Number of flow process: 1, Exposure limit*: None Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None Symbol IR35–00-2 VP15–00-2 WS60–00-1 *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Apply only a single process at once, except for “Partial heating method”. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 [MEMO] Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 [MEMO] Discontinued Product
µPC8101GR Data Sheet P10818EJ3V0DS00 [MEMO] Discontinued Product
µPC8101GR NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
- The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
- No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
- NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
- Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
- While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
- NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Discontinued Product