UPC8002GR-E2

UPC8002 NEC | Alldatasheet

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BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8002 The µPC8002 is a monolithic IC developed for use in digital cordless telephones. Its internal equivalent circuits comprise a double balanced mixer (DBM), IF amplifier circuit, and RSSI (Received Signal Strength Indicator) circuit. The µPC8002 can operate on a wide range of power supply voltages from 2.7 V to 5.5 V, and incorporates a power- off function, making it ideal for achieving low set power consumption. The package is a 20-pin plastic shrink SOP (225 mil) suitable for high-density surface mounting.

FEATURES

• Low-voltage, low-consumption-current operation possible (VCC = 2.7 to 5.5 V, ICC = 3.4 mA at VCC = 3 V)
• Wide mixer input frequency range (fMIX = 250 MHz (TYP.) to 500 MHz (MAX.))
• Wide IF amplifier input frequency range (fIF = 8 MHz (MIN.) to 12 MHz (MAX.), 10.7 MHz (TYP.))
• High limiting sensitivity (SL = –100 dBm (TYP.))
• Wide RSSI dynamic range (DR = 85 dB (TYP.))
• On-chip power-off function
• Use of 20-pin plastic shrink SOP (225 mil) allows high-density surface mounting BLOCK DIAGRAM

ORDERING INFORMATION

µPC8002GR 20-pin plastic shrink SOP (225 mil) µPC8002GR-E1 20-pin plastic shrink SOP (225 mil) Embossed carrier taping (pin 1 is tape unwinding direction) µPC8002GR-E2 20-pin plastic shrink SOP (225 mil) Embossed carrier taping (pin 1 is tape winding direction) BYPASS1 IF2 OUT IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 GND (IF OUT) VCC (IF OUT) 1 1023456789 PD RSSI OUTMIX OUT V CC (IF) VCC (MIX) LO IN GND(IF) GND(MIX) MIX IN2MIX IN1 IF Amp 1 Power ON/OFF RSSI 2nd MIXER RSSI IF Amp 2 Output Stage SECOND MIXER + IF AMPLIFIER FOR DIGITAL CORDLESS TELEPHONES Document No. S10717EJ2V0DS00 (2nd edition) Date Published March 1997 N Printed in Japan The information in this document is subject to change without notice. © 1997 DATA SHEET

µPC8002 Application Circuit Example 1 (Using 2 BPFs) Caution Ensure that the pin voltage does not exceed the power supply voltage. Remark The VCC pass capacitors (1 µF, 1000 pF) should be located close to the respective VCC pins. Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used. PD MIX OUT V CC (IF) VCC (MIX) LO IN GND (IF) GND (MIX) MIX IN1 MIX IN2 RSSI OUT 1 F 1000 pF 1 F 1000 pF VCC 470 pF Lo OSC1st Mixer 470 pF 470 pF ADC BYPASS1 IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 GND (IF OUT) V CC (IF OUT) IF2 OUT 1000 pF BPF CFEC10.7MK1 (MURATA) 1000 pF 0.01 F 0.01 F DEM BPF CFEC10.7MK1 (MURATA) VCC 1 F 1000 pF VCC VCC µ µ µ µ µ

µPC8002 Application Circuit Example 2 (Using 1 BPF) Cautions 1. Ensure that the pin voltage does not exceed the power supply voltage. 2. With this application circuit, confirm that there is not problem with interfering wave characteristics. Remark The VCC pass capacitors (1 µF, 1000 pF) should be located close to the respective VCC pins. Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used. PD MIX OUT V CC (IF) VCC (MIX) LO IN GND (IF) GND (MIX) MIX IN1 MIX IN2 RSSI OUT 1 F 1000 pF 1 F 1000 pF 470 pF Lo OSC1st Mixer 470 pF 470 pF ADC BYPASS1 IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 GND (IF OUT) V CC (IF OUT) IF2 OUT 1000 pF 1000 pF 0.01 F 0.01 F DEM BPF CFEC10.7MK1 (MURATA) 1 F 1000 pF 330 pF VCC VCC VCC VCC µ µ µ µ µ

µPC8002 Application Circuit Example 3 (Using 1 BPF) Cautions 1. With this application circuit, good interfering wave characteristics are obtained with a single BPF. However, there is a drop in sensitivity. 2. Ensure that the pin voltage does not exceed the power supply voltage. Remark The VCC pass capacitors (1 µF, 1000 pF) should be located close to the respective VCC pins. Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used. PD MIX OUT V CC (IF) VCC (MIX) LO IN GND (IF) GND (MIX) MIX IN1 MIX IN2 RSSI OUT 1 F 1000 pF 1 F 1000 pF VCC 470 pF Lo OSC1st Mixer 470 pF 470 pF ADC BYPASS1 IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 GND (IF OUT) V CC (IF OUT) IF2 OUT 1000 pF BPF CFEC10.7MK1 (MURATA) 1000 pF 0.01 F 0.01 F DEM VCC 1 F 1000 pF VCC VCC 1000 pF 390 Ω µ µ µ µ µ

µPC8002 Cautions 1. With this application circuit, good interfering wave characteristics are obtained with a single BPF (and sensitivity is better than in Application Circuit Example 3). 2. Ensure that the pin voltage does not exceed the power supply voltage. Remark The VCC pass capacitors (1 µF, 1000 pF) should be located close to the respective VCC pins. Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) and a chip coil (MURATA LQHIN or equivalent) should be used. Application Circuit Example 4 (Using 1 BPF) PD MIX OUT V CC (IF) VCC (MIX) LO IN GND (IF) GND (MIX) MIX IN1 MIX IN2 RSSI OUT 1 F 1000 pF 1 F 1000 pF VCC 470 pF Lo OSC1st Mixer 470 pF 470 pF ADC BYPASS1 IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 GND (IF OUT) V CC (IF OUT) IF2 OUT 1000 pF BPF CFEC10.7MK1 (MURATA) 1000 pF 0.01 F 0.01 F DEM VCC 1 F 1000 pF VCC VCC 1000 pF 390 Ω 1000 pF 150 pF 1.5 H µ µ µ µ µ µ

µPC8002 1. PIN CONFIGURATION AND PIN FUNCTIONS (1) Pin Configuration (Top View)

• 20-pin plastic shrink SOP (225 mil) Pin Names BYPASS1-BYPASS4 : Bypass GND (IF) : Ground (Intermediate Frequency Amp.) GND (IF OUT) : Ground (Intermediate Frequency Amp. Output) GND (MIX) : Ground (Mixer) IF1 IN, IF2 IN : Intermediate Frequency Amp. Input IF1 OUT, IF2 OUT : Intermediate Frequency Amp. Output LO IN : Local Input MIX IN1, MIX IN2 : Mixer Input MIX OUT : Mixer Output PD : Power Down RSSI OUT : Received Signal Strength Indicator Output V CC (IF) : Power Supply (Intermediate Frequency Amp.) V CC (IF OUT) : Power Supply (Intermediate Frequency Amp. Output) V CC (MIX) : Power Supply (Mixer) PD MIX OUT V CC (IF) VCC (MIX) LO IN GND (IF) GND (MIX) MIX IN1 MIX IN2 RSSI OUT BYPASS1 IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 GND (IF OUT) V CC (IF OUT) IF2 OUT

µPC8002 (2) Pin Functions No. Pin Name I/O Function

1 PD I Power on/off control signal input

2 MIX OUT O Mixer output

3V CC (IF) – IF amplifier and RSSI power supply pin 4V CC (MIX) – Mixer power supply pin

5 LO IN I Local input

6 GND (IF) – IF amplifier and RSSI ground pin

7 GND (MIX) – Mixer ground pin

8 MIX IN1 I Mixer input

9 MIX IN2 I Filter capacitor connection

10 RSSI OUT O RSSI output

11 IF2 OUT O IF amplifier 2 output

12 V CC (IF OUT) – IF amplifier output stage power supply pin

13 GND (IF OUT) – IF amplifier output stage ground pin

14 BYPASS3 – Filter capacitor connection (IF2 side)

15 IF2 IN I IF amplifier 2 input

16 BYPASS4 – Filter capacitor connection (IF2 side)

17 IF1 OUT O IF amplifier 1 output

18 BYPASS2 – Filter capacitor connection (IF1 side)

19 IF1 IN I IF amplifier 1 input

20 BYPASS1 – Filter capacitor connection (IF1 side)

µPC8002 2. INPUT/OUTPUT EQUIVALENT CIRCUIT DIAGRAMS Mixer Input Local Input IF Amplifier 1 Input IF Amplifier 2 Input Power On/Off Input Mixer Output IF Amplifier 1 Output IF Amplifier 2 Output RSSI Output 1 kΩ 1 kΩ 276 Ω 700 A 207 Ω 250 A 290 A 32 kΩ 2 kΩ VCC 1 kΩ 1 kΩ 330 Ω 14.9 kΩ 330 Ω 14.9 kΩ 330 Ω 11.8 kΩ 330 Ω 11.8 kΩ 50 kΩ 150 kΩ µ µ µ

µPC8002 3. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25 °C) Parameter Symbol Test Condition Rating Unit Power supply voltage V CC 7V Total power dissipation P T TA = 85 °C 120 mW Storage temperature T stg –40 to +125 °C Pin voltage V PIN VCC +0.2 V Caution Product quality may suffer if the absolute rating is exceeded for any parameter, even momentarily. In other words, an absolute maximum rating is a value at which the possibility of physical damage to the product cannot be ruled out. Care must therefore be taken to ensure that the these ratings are not exceeded during use of the product. Recommended Operating Ratings (TA = 25 °C) 0 dBm = 223.6 mVrms (at 50 Ω ) Parameter Symbol Test Condition MIN. TYP. MAX. Unit Power supply voltage V CC 2.7 3.0 5.5 V Operating ambient temperature T A –30 +25 +85 °C Mixer input level V MIX 50 Ω resistance termination –98 –18 dBm LC matching (reference value) –107 –27 Local input level V LOC 50 Ω resistance termination –5 +5 dBm LC matching (reference value) –20 –10 IF amplifier input level V IF –99 –14 dBm Mixer input frequency f MIX 250 500 MHz Mixer output frequency f OM 8 10.7 12 MHz IF amplifier input frequency f IF 8 10.7 12 MHz RSSI output load capacitance C OI 10Note pF IF2 output load capacitance C OR 10Note pF Note Includes all capacitances (board, pattern, etc.) applied to the pin.

µPC8002 Electrical Specifications (TA = 25 °C, VCC = 3 V) (1) Mixer Section (fMIX = 250 MHz, fLOC = 239.3 MHz, VLOC = –5 dBm) 0 dBm = 223.6 mVrms (at 50 Ω ) (Where not specified in the Test Condition, input has 50 Ω termination) Parameter Symbol Test Condition MIN. TYP. MAX. Unit Power supply current I CCM No signal 1.7 2.2 mA Conversion gain G C 50 Ω resistance termination 4 8 11.0 dB LC matching (reference value) 17.0 –1 dB compression output level VOM –14 –10 –7 dBm Third order intercept point IP 3 Stipulated by output Note 1 –3 dBm Noise factor NF 16 dB LC matching (reference value) 7 dB Local separation I SL Mixer non-input Note 2 40 54 dB Mixer input impedance Z INM 31-j156 Ω Local input impedance Z INL 31-j169 Ω Output resistance R OM 230 330 430 Ω Power-on rise time t ONM VPO = 3 VNote 3 81 5 µs Power-off fall time t OFM VPO = 0 VNote 4 13 µs Power-off power supply current ILM VPO = 0 V 0 5 µA Notes 1. f1 = 250.3 MHz, f2 = 250.6 MHz 2. Leakage from local input to mixer output 3. Time until the difference between the local input pin power-on and power-off voltages reaches 90 % Power-on input voltage (VPO ) rise time: 10 ns 4. Time until the power supply current reaches 10 % of the power-on value Power-on input voltage (VPO ) fall time: 10 ns

µPC8002 (2) IF Amplifier Section (fIF = 10.7 MHz) 0 dBm = 223.6 mVrms (at 50 Ω ) Parameter Symbol Test Condition MIN. TYP. MAX. Unit Power supply current I CCI No signal 1.7 2.3 mA Limiting sensitivity S L –3 dB point –100 –97 dBm IF amplifier phase fluctuation S P VIF = –70 to –14 dBm Note 1 10 deg IF amplifier output amplitude V O IF2 OUT, VIF = –14 dBm 0.2 0.3 0.4 V p-p IF amplifier output amplitude rise timetR IF2 OUT, VIF = –14 dBm 8 20 ns IF amplifier output amplitude fall time tF IF2 OUT, VIF = –14 dBm 15 25 ns IF amplifier input resistance R in IF1 IN, IF2 IN 230 330 430 Ω IF amplifier input capacitance C in IF1 IN, IF2 IN 3.5 6.0 pF IF amplifier output resistance R O IF1 OUT 230 330 430 Ω RSSI linearity L R VIF = –94 to –14 dBm ±2d B RSSI slope S R 18 20 22 mV/dB RSSI intercept I R –164.7 –148 –134.4 dBm RSSI output voltage 1 V R1 VIF = –14 dBm 2.58 2.68 2.78 V RSSI output voltage 2 V R2 VIF = –54 dBm 1.76 1.88 2.0 V RSSI output voltage 3 V R3 VIF = –94 dBm 0.88 1.08 1.28 V RSSI output voltage 4 V R4 No signal 0.96 1.23 V RSSI output temperature stability S T VIF = –94 to –14 dBm Note 2 ±2d B RSSI output dynamic range D R Note 3 80 90 dB RSSI rise time t rf1 VIF = –14 dBm Note 4 1.0 4 µs RSSI fall time t rf2 VIF = –14 dBm Note 4 1.6 4 µs RSSI output ripple R R VIF = –14 dBm 20 mV p-p RSSI output resistance R OR 25.6 32 38.4 k Ω Power-on rise time t ONI VPO = 3 V, no signalNote 5 51 0 µs Power-off fall time t OFI VPO = 0 VNote 6 13 µs Power-off power supply current I LI VPO = 0 V 6 10 µA Notes 1. Network analyzer RBW = 3 Hz 2. TA = –30 °C to +85 °C 3. Input level range for which drift from the regression expression with VIF = –94 to –14 dBm is ≤ 2 dB 4. Time until the RSSI output reaches the final value ±10 % 5. Time until the RSSI output is within ±10 % of the power-on value Power-on input voltage (VPO ) rise time: 10 ns 6. Time until the power supply current reaches 10 % of the power-on value Power-on input voltage (VPO ) fall time: 10 ns (3) Power-On/Off Section Parameter Symbol Test Condition MIN. TYP. MAX. Unit Power-on input voltage V ON Power-on at VON or above, VCC or below 1.5 2.4 V Power-off input voltage V OF Power-off at VOF or below, GND or above 0.6 1.2 V Power-on input current I ON VPO = 3 V 40 60 µA

µPC8002 4. CHARACTERISTIC DIAGRAMS (1) Power supply current vs power supply voltage (IF amplifier section) (2) Power supply current vs power supply voltage (Mixer section) 01234567 Power supply current [mA] [V] Power supply voltage 01234567 Power supply current [mA] [V] Power supply voltage

µPC8002 (3) IF amplifier output level vs IF amplifier input level (4) IF amplifier output phase vs IF amplifier input level _ 20 _ 10 _ 30_ 120 _ 20_ 100 _ 80 _ 60 _ 40 0 IF amplifier output level [dBm] [dBm] IF amplifier input level _ 3dB Limiting sensitivity 140 100_ 70 _ 20_ 60 _ 50 _ 40 _ 30 _ 10 Input/output phase difference [deg] [dBm] IF amplifier input level 120 130 110 Phase fluctuation Test input level range _ 14

µPC8002 (5) RSSI characteristics (a) (6) RSSI characteristics (b) 1.5 0_ 120 _ 80 _ 40_ 60_ 100 0 RSSI output voltage [V] [dBm] IF amplifier input level 0.5 2.5 _ 20 Regression line Regression line RSSI error [dB] [dBm] IF amplifier input level _ 20 _ 3 _ 4 _ 1 _ 2

µPC8002 (7) Mixer output level vs mixer input level 50 Ω resistance termination Mixer output level [dBm] [dBm] Mixer input level _ 10 _ 20 _ 30 _ 40 _ 50 _ 60 _ 70 _ 80

µPC8002 5. LEVEL DIAGRAMS (1) For Application Circuit 1 Notes 1. 50 Ω resistance termination 2. LC matching (reference value) (2) For Application Circuit 2 MIXER PC8002GR + 8 dBNote 1 + 17 dBNote 2 BPF _ 4 dB IF Amp1 + 42 dB BPF _ 4 dB IF Amp2 + 66 dB IF OUT

0.3 Vp-p

_ 18 dBmNote 1 _ 27 dBmNote 2 _ 6.5 dBm _ 90 dBm _ 94 dBm _ 56 dBm80 dB _ 52 dBm _ 98 dBmNote 1 _ 107 dBmNote 2 _ 10 dBm _ 14 dBm 80 dB _ 12 dBm _ 16 dBm µ MIXER PC8002GR + 8 dBNote 1 + 17 dBNote 2 330 pF IF Amp1 + 42 dB BPF _ 4 dB IF Amp2 + 66 dB IF OUT _ 18 dBmNote 1 _ 27 dBmNote 2 _ 6.5 dBm _ 90 dBm _ 52 dBm 80 dB _ 48 dBm _ 98 dBmNote 1 _ 107 dBmNote 2 _ 10 dBm _ 12 dBm _ 16 dBm 80 dB µ

µPC8002 6. TEST METHODS (1) Mixer input section (a) With 50 Ω resistance termination (b) With 50 Ω LC matching Note Since the values of L and C are affected by the board’s parasitic capacitance and inductance, L and C should be adjusted so that the impedance looking at the MIX IN pin side from the signal source is 50 Ω . (2) Third order intercept 82 pF MIX OUT 470 p MIX IN1 LO IN VMIX 50 Ω 16.7 Ω 16.7 Ω16.7 Ω f1 = 250.3 MHz f2 = 250.6 MHz 470 p 50 Ω fOSC = 239.3 MHz MIX IN1 470 pF 50 Ω VMIX MIX IN1 470 pF VMIX C Note LNote

µPC8002 7. TEST CIRCUIT EXAMPLES In test circuit example 2 onward, only the portion that differs from test circuit example 1 is shown. Test Circuit Example 1. Caution The 10 pF capacitor value for IF2 OUT and RSSI OUT includes all the capacitances (board, pattern, etc.) applied to the pin. Ensure that the recommended load condition (10 pF) is not exceeded for IF2 OUT and RSSI OUT. Remark Chip laminated ceramic capacitors (MURATA GRM36 or equivalent) should be used. PD MIX OUT V CC (IF) VCC (MIX) LO IN GND (IF) GND (MIX) MIX IN1 MIX IN2 RSSI OUT VCC 82 pF 1 F 1000 pF 1 F 1000 pF 470 pF 50 Ω 470 pF 50 Ω 470 pF 10 pF 1000 pFBYPASS1 IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 GND (IF OUT) VCC (IF OUT) IF2 OUT 330 pF 50 Ω 1000 pF 0.01 F 0.01 F 1 F 1000 pF 10 kΩ BPF CFEC10.7MK1 (MURATA) 10 pF VCC VCC VCC 1000 pF µ µ µ µ µ

µPC8002 VCC (IF) A VCC 1000 pF VCC (IF OUT) 1000 pF1 F VCC (MIX) A 1000 pF1 F VCC µ µ Test Circuit Example 2. (Power supply current, power-off power supply current) Caution The 10 pF capacitor value for IF2 OUT and RSSI OUT includes all the capacitances (board, pattern, etc.) applied to the pin. Ensure that the recommended load condition (10 pF) is not exceeded for IF2 OUT and RSSI OUT. Test Circuit Example 3. (Limiting sensitivity, IF amplifier output amplitude, IF amplifier output amplitude rise time, IF amplifier output amplitude fall time, RSSI linearity, RSSI slope, RSSI intercept, RSSI output voltage, RSSI temperature stability, RSSI output ripple) IF1 IN RSSI OUT 330 pF 50 Ω 10 pF Digital voltmeter Oscilloscope IF2 OUT 10 pF 10 kΩ Spectrum analyzer Oscilloscope SG (Signal generator)

10.7 MHz

µPC8002 Test Circuit Example 4. (IF amplifier phase fluctuation) Caution The 10 pF capacitor value for RSSI OUT includes all the capacitances (board, pattern, etc) applied to the pin. Caution The 10 pF capacitor value for IF2 OUT includes all the capacitance (board, pattern, etc.) applied to the pin. Ensure that the recommended load condition (10 pF) is not exceeded. Test Circuit Example 5. (RSSI rise time, RSSI fall time) ... Time until RSSI output is within ±10 % of the final value) 330 pF IF1 IN IF1 OUT RSSI OUT 10 pF For IF2 input Storage oscilloscope 2 IF2 IN For IF1 input 50 Ω SG

10.7 MHz, _14 dBm

50 Ω SG

1 SEC 50 SEC

µ IF1 IN 50 Ω 330 pF Network analyzer IF2 OUT 10 pF 10 kΩ Attenuator 1000 pF

µPC8002 Test Circuit Example 6. (Power-on rise time) Mixer section : Time until the difference between the local input pin power-on and power-off voltage reaches 90 % IF section : Time until RSSI output is within ±10 % of the power-on value. PD RSSI OUT 10 pF Storage oscilloscope 2 LO IN Storage oscilloscope 1 Input signal from SG µ Remark Power-on input voltage (VPO ) rise time: 10 ns Caution The 10 pF capacitor value for RSSI OUT includes all the capacitances (board, pattern, etc.) applied to the pin. Ensure that the recommended load condition (10 pF) is not exceeded. Test Circuit Example 7. (Power-off fall time) PD Storage oscilloscope Input signal from SG VCC (IF OUT) VCC (IF) Current probe VCC (MIX) 3 V 0 V VCC VCC µ

µPC8002 470 pF LO IN 50 Ω SG

239.3 MHz

See 6. TEST METHODS (2) 470 pF LO IN 50 Ω SG

250 MHz

See 6. TEST METHODS (1) Test Circuit Example 8. (Conversion gain, –1 dB compression level) Test Circuit Example 10. (Local separation) Test Circuit Example 9. (Third order intercept output level) 470 pF LO IN 50 Ω SG

µPC8002 470 pF LO IN 50 Ω MIX OUT 82 pF Noise Source 470 pF MIX IN1 See 6. TEST METHODS (1) NF meter 52 8 Test Circuit Example 11. (Power-on input voltage, power-off input voltage, power-on input current) Test Circuit Example 12. (Noise factor) PD A V VCC

µPC8002 8. EVALUATION BOARD MOUNTING EXAMPLE PC8002 Plated wire C7 R1 IF2 OUT KC-8002GR 1VCC 50 mm 70 mm µ Remark indicates a through-hole.

µPC8002 Remark indicates a through-hole. IF2 OUT BPF C10 C C 10C11 BPF C 10 R3 C11 LOCAL IN MIX IN RSSI OUT C12 C IF1 IN C VCC MIX OUT

µPC8002 C1 : 1 µF R1 : 10 k Ω C2 : 1000 pF R2 : 50 Ω C3 : 1000 pF R3 : 50 Ω C4 : 1 µF R4 : 50 Ω C5 : 1 µF L1 : 58 nH (reference value) C6 : 1000 pF L2 : 10 nH (reference value) C7 : 10 pF Note C8 : 330 pF C9 : 0.01 µF C10 : 0.01 µF C11 : 470 pF C12 : 470 pF C13 : 10 pFNote Note For the IF2 OUT and RSSI OUT capacitance values, see 9. WIRING PATTERN CAPACITANCE DIAGRAM (REFERENCE) . Remarks 1. Both L in the case of LC matching and R in the case of 50 Ω termination are connected to MIX IN. Remove in the case of LC matching, and and in the case of 50 Ω termination. 2. Change the location of the plated wires according to the evaluation items. 3. Cut the wiring pattern to connect . R4 L1

µPC8002 9. WIRING PATTERN CAPACITANCE DIAGRAM (REFERENCE) The wiring pattern capacitances to ground are shown here. For pin 11, the capacitance is 8.1 pF when the entire pattern (from pin 11 to point B) is used. In this case, the usable probe input capacitance is 1.9 pF (MAX.). From pin 11 up to point A, the capacitance is 1.4 pF, and therefore an 8.6 pF (MAX.) probe can be used. For pin 10, the capacitance is 4 pF when the entire pattern is used. RSSI OUT Pin 10 Pin 11 0.9 pF 0.5 pF A 3.0 pF 0.8 pF IF2 OUT 2.9 pF B

µPC8002 10. PACKAGE DRAWINGS

20 PIN PLASTIC SHRINK SOP (225mil)

A B C D E F G H I J 7.00 MAX. 0.65 (T.P.) 1.45 MAX. 1.15±0.1 6.4±0.2 0.575 MAX. K 0.10 1.0±0.2 4.4±0.1 0.15 M 0.22 0.1±0.1 0.276 MAX. 0.023 MAX. 0.009 0.004±0.004 0.057 MAX. 0.045 0.252±0.008 0.173 0.039 0.006 0.004 0.026 (T.P.) P20GR-65-225C-1 P3 ˚ 3˚ +0.10 –0.05 detail of lead end F P C M M N L 11 0 A GE D B K H I J +0.004 –0.003 +0.005 –0.004 +0.005 –0.004 +0.009 –0.008 +0.10 –0.05 +0.004 –0.002 –0.009 0.10N 0.004 +7˚ –3˚ +7˚ –3˚ NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition.

µPC8002 11. RECOMMENDED SOLDERING CONDITIONS The following conditions ( see table below) must be met when soldering this product. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E) . Please consult with our sales offices in case other soldering process or condition is used. IR35-107-2 VP15-107-2 Note Exposure limit before soldering after dry-pack package is opened. Storage conditions : 25 ˚C and relative humidity at 65 % or less. Caution Do not apply more than one soldering method at any one time, except for " Partial heating method". VPS Peak package's surface temperature: 235 ˚C or below. Reflow time : 30 seconds or below (210 ˚C or higher), Number of reflow processes : MAX.2 Exposure limit Note : 7 days (10 hours pre-baking is required at 125 ˚C afterwards) Peak package's temperature: 215 ˚C or below. Reflow time : 40 seconds or below (200 ˚C or higher), Number of reflow processes : MAX. 2 Exposure limit Note : 7 days (10 hours pre-baking is required at 125 ˚C afterwards) Terminal temperature : 300 ˚C or below, Time : 3 seconds or below (Per side of pin position) TYPE OF SURFACE MOUNT DEVICE Partial heating method Infrared Ray Reflow µPC8002GR Soldering process Soldering conditions Symbol

µPC8002 [MEMO]

µPC8002 The application circuits and their parameters are for references only and are not intended for use in actual design-in's. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5