UPC8001

UPC8001 NEC | Alldatasheet

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The µPC8001 is a 3-volt IF amplifier IC with an on-chip mixer developed for digital cellular phones. The µPC8001 consists of a high-sensitivity limiter amplifier with an input frequency of 455 kHz, a high-speed and high-precision linear RSSI (received signal strength indicator ), and a second mixer with an input frequency of 80 to 150 MHz. The µPC8001 features a low 3 mA (TYP.) and 2.2 µA (TYP.) current consumption at normal operation and power-OFF, respectively. Its high-speed charge/discharge circuit enables fast power-ON/OFF switching. The µPC8001 boasts an extremely small size packaged in a 14-pin plastic shrink SOP, and low external capacitances of less than 0.01 µF, in addition to an on-chip RSSI output resistor, and is most suitable for high-density mounting.

FEATURES

• Low-voltage operation…3 V ±10%
• Low power consumption…(V CC = 3 V) Mixer IF amp. + RSSI During operation 2.1 mA (TYP.) 0.95 mA (TYP.) At power-OFF 0 µA (TYP.) 2.2 µA (TYP.)
• High limiting sensitivity…–91 dBm (TYP.)
• High-precision RSSI linearity… ±0.5 dB (TYP.) (V IF IN = –86 to –6 dBm)
• High-speed RSSI response time RSSI output rise time 77 µs (TYP.) RSSI output fall time 113 µs (TYP.)
• High-speed power-ON/OFF switching time Rise time at power-ON 174 µs (TYP.) Fall time at power-OFF 3 µs (TYP.)
• External capacitors of less than 0.01 µF
• On-chip RSSI output resistor (34 k Ω )
• Ultra-compact package…14-pin plastic shrink SOP BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8001 The information in this document is subject to change without notice. Document No. IC-3426 (O.D.No. IC-8949) Date Published February 1995 P Printed in Japan The mark H shows revised points. 1994, 1995 IF AMPLIFIER IC WITH ON-CHIP MIXER FOR DIGITAL CELLULAR PHONES

µPC8001

ORDERING INFORMATION

µPC8001GR 14-pin plastic shrink SOP (225 mil) 14-pin plastic shrink SOP (225 mil) µPC8001GR-E1 Embossed carrier taping (Pin 1 located toward tape unwind direction) 14-pin plastic shrink SOP (225 mil) µPC8001GR-E2 Embossed carrier taping (Pin 1 located toward tape wind direction)

µPC8001 BLOCK DIAGRAM Note Input/output impedance of 455 kHz BPF: 1.5 k Ω Antenna

1.5 GHz

129.545 MHz

130 MHz

OSC IN MIX IN2 MIX OUT FIL2MIX IN1 CFL2 CFL3 CIF 2 nd Mixer IF Amp RSSI RSSI OUT IF OUT IF INFIL3 FIL1 CFL1 1000 pFCRS PD GNDVCC2VCC1 RM 1.4 kΩ Note 0.01 µ F 0.01 µ F 5212 46 7 13 9 811 14

µPC8001 1. PIN CONFIGURATION AND PIN FUNCTIONS (1) PIN CONFIGURATION (Top View)

• 14-pin plastic shrink SOP (225 mil) FIL1-FIL3 : Filter GND : Ground IF IN : Intermediate Frequency Input IF OUT : Intermediate Frequency Output MIX IN1, MIX IN2 : Mixer Input MIX OUT : Mixer Output OSC IN : Oscillator Input PD : Power Down RSSI OUT : Received Signal Strength Indicator Output V CC1 , V CC2 : Power Supply IF OUT PD RSSI OUT FIL3 VCC2 IF IN FIL1 MIX IN1 MIX IN2 V CC1 OSC IN GND MIX OUT FIL2 PC8001GRµ

µPC8001 (2) PIN FUNCTIONS Number Pin Name I/O Function

1 IF OUT O IF amplifier output

2P D I Power-ON/OFF control signal input High level: Power-ON; Low level: Power-OFF

3 PSSI OUT O RSSI output

4 FIL3 — Connect capacitor for filter. 5V CC2 — IF amplifier and RSSI power pin

6 IF IN I IF amplifier input

7 FIL1 — Connect capacitor for filter. 8 FIL2 — Connect capacitor for filter.

9 MIX OUT O Mixer output

10 GND — Ground pin

11 OSC IN I Oscillator input

12 V CC1 — Mixer power pin

13 MIX IN2 I Connect capacitor for filter.

14 MIX IN1 I Mixer input

µPC8001 2. I/O EQUIVALENT CIRCUIT Mixer input IF amplifier output Oscillator input RSSI output IF amplifier input Power-ON/OFF input Mixer output 300 kΩ 150 kΩ 50 kΩ 500 Ω 34 kΩ V CC2 75 µA 1314 5 kΩ 5 kΩ 5 kΩ 5 kΩ 1.5 kΩ 400 µA

µPC8001 3. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (T A = 25 °C) Parameter Symbol Conditions Rating Unit Supply voltage V CC 7V Total power dissipation P T 300 mW Operating ambient temperature T A –30 to +85 °C Storage temperature T stg –40 to +125 °C Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. Recommended Operating Conditions (T A = 25 °C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply voltage V CC 2.7 3.0 3.3 V Mixer input level V MIX IN See Figure 3-1 . 50 Ω termination –100 –20 dBm Note1 LC matching –113 Note2 –33Note2 dBmNote1 IF amplifier input level V IF IN –86 –6 dBm Note1 Oscillator input level V OSC IN –30 –15 –5 dBm Note1 IF amplifier input frequency f IF IN 400 455 500 kHz Mixer input frequency f MIX IN 80 130 150 MHz Mixer output frequency f MIX OUT 400 455 500 kHz Notes 1. Assuming a conversion value of 50 Ω , 0 dBm = 0.2236 V rms. 2. Depends on board wiring pattern, use as reference value.

µPC8001 LC matching 33 Note 1

ELECTRICAL CHARACTERISTICS

(TA = 25°C, VCC1 = VCC2 = 3 V, fMIX IN = 130 MHz, f OSC IN = 129.545 MHz, f IF IN = 455 kHz, C RS = 1000pF, C OS = CM1 = CM2 = C M0 = CIF = C FL1 = CFL2 = C FL3 = 0.01 µF, 0 dBm = 0.2236 V rms) (1) Mixer Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply current I CC1 No signal 2.1 3.0 mA VMIN IN = –50dBm Conversion gain CG V OSC IN = –15 dBm See Figure 3-1 . Third order intercept IC 3 See Figure 3-2 . –13 –8 dBm VOSC IN =–15dBm –5 0 dBm See Figure 3-3 . Cut-off frequency f C –3 dB point 200 470 MHz Noise figure NF See Figure 3-6 .1 0 Note 1 dB Local isolation IS L 20 26 dB Mixer input impedance Z IM 48-j383 Ω Local input impedance Z IL 80-j425 Ω Output resistance R OM 60 120 180 Ω VON = 3 V 33 600 µs Rise time of PD signal : 10 ns VOF = 0 V 3 200 µs Fall time of PD signal : 10 ns Power-OFF supply current I LM VOF = 0 V 0 10 µA Notes 1. Depends on board wiring pattern, use as reference value. 2. Time until DC voltage of mixer output reaches ±10% of power-ON value. 3. Time until supply current reaches 10% of power-ON value. (2) Power-ON/OFF Parameter Symbol Conditions MIN. TYP. MAX. Unit Power-ON input voltage V ON Power-ON over V ON and under V CC 1.2 2.4 V Power-OFF input voltage V OF Power-OFF over GND and under V OF 0.6 1.2 V Power-ON input current I ON VON = 3 V 48 75 µA 50Ω termination 15 20 23 dB –1dB compression output level V OMIX Power-ON rise time Note2 tONM Power-OFF fall time Note3 tOFM

µPC8001 (3) IF Amplifier/RSSI Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply current I CC2 No signal 0.95 1.3 mA IF amplifier output amplitude V O VIF IN = –20 dBm 1.2 1.5 1.8 V p-p Limiting sensitivity LS –3dB point, see Figure 4-5 . –91 –86 dBm IF amplifier input impedance Z IN 1.2 1.5 1.8 k Ω IF amplifier phase variation Δφ VIF IN =–86 to –6 dBm 11 deg See Figure 4-6 Note1 . RSSI linearity L RS VIF IN = –86 to –6 dBm ±0.5 ±2d B Recursive calculation with VIF IN = –60 to –6 dBm RSSI slope SL RS Recursive calculation 22.3 24.4 30.1 mV/dB with VIF IN = –60 to –6 dBm RSSI intercept IC RS Recursive calculation –135 –118 –104 dBm with VIF IN = –60 to –6 dBm See Figure 3-4 . RSSI output voltage1 V R1 VIF IN = –86 dBm 0.50 0.79 0.98 V RSSI output voltage 2 V R2 VIF IN = –46 dBm 1.60 1.79 1.90 V RSSI output voltage 3 V R3 VIF IN = –6 dBm 2.70 2.75 2.82 V RSSI output temperature stability ST VIF IN = –86 to –6 dBm, 1 dB TA = –30 to +85 °C RSSI rise time t rRS VIF IN = –6 dBm 77 300 µs See Figure 3-5 . RSSI fall time t fRS VIF IN = –6 dBm 113 300 µs See Figure 3-5 . RSSI output ripple V RRS VIF IN = –6 dBm 3 12 mV p-p Power-OFF supply current I LI VOF = 0 V 2.2 10 µA Power-ON rise time Note2 tONI VON = 3 V, V IF IN = –86 dBm 174 600 µs PD signal rise time: 10 ns Power-OFF fall time Note3 tOFI VOF = 0 V 3 200 µs PD signal fall time: 10 ns IF amplifier output slew rate SR O VIF IN = –20 dBm Rise Note4 3.4 Fall Note5 3.8 RSSI output resistance R OR 27 34 41 k Ω Notes 1. Use the network analyzer at RBW = 3 Hz. 2. Time until RSSI output reaches ±10% of power-ON value. 3. Time until supply current reaches 10% of power-ON value. 4. Rise: 10% to 90% 5. Fall: 90% to 10% V/µs H H H H H H H

µPC8001 Figure 3-1. Mixer Input (a) 50 Ω Termination (b) LC Matching Note The values L and C are affected by the parasitic capacitance and inductance of the board. Therefore, adjust L and C so that the impedance at the MIX IN pin from the signal source equals 50 Ω . Remark The signal source impedance is 50 Ω . Figure 3-2. Third Order Intercept Remark Signal source impedance is 50 Ω . MIX IN1 107 nH VMIX IN 5 pF 0.01µ F0.01µ F VMIX IN 50Ω

14 MIX IN1

0.01µ F 0.01µ F 1.5 kΩ 50 Ω 16.7 Ω f1 f2 f1 = 130.1 MHz, f2 = 130.2 MHz 16.7 Ω 16.7 Ω 0.01µ F VOSC IN = –15 dBm 18 dB/OCT 6 dB/OCT f = 130 MHz f1 = 130.1 MHz f2 = 130.2 MHz VMIX OUT [dBm] VMIX IN [dBm] Third order intercept 50 Ω fOSC IN = 129.545 MHzMeasure 455 kHz component level with spectrum analyzer

µPC8001 Figure 3-6. Noise Figure Measurement The noise figure is calculated as follows: NF = ENR – 10 log (Y – 1) NF (dB): Noise figure ENR (dB): ENR of noise source Y: Y = 10 N1 (dBm): Spectrum analyzer indication value at SW OFF. N2 (dBm): Spectrum analyzer indication value at SW ON. Remark This measurement measures DSB. To measure SSB, add 3 dB to NF above. N2–N1 5 pF 0.01µF 107 nH HP8447F RF Amp Spectrum analyzer 47 dB 50 Ω 0.01µF 0.01µF3 kΩ Noise source HP346B SW28 V

µPC8001 Figure 4-7. RSSI Output Voltage vs. IF Amplifier Input Level (The temperature characteristics curves) H 3.0 2.5 2.0 1.5 1.0 0.5 –120 –110 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 IF amplifier input level V IF IN [dBm] RSSI output voltage VORS [V] TA = –30 °C TA = +25 °C TA = +85 °C The three temperature characteristic curves are virtually identical. Remarks 1.

µPC8001 5. TEST CIRCUIT EXAMPLEH Note The value of the capacitance connected to the IF OUT pin (No. 1) includes the capacitances of PCB wiring patterns and the tester. Remark In three cases of Mixer Input, Third Order Intercept and Noise Figure Measurement, refer to Figures 3-1, 3-2, and 3-6. 0.01 F µ MIX IN1 0.01 F µ MIX IN2 VCC1 0.01 F µ OSC IN GND 0.01 F µ MIX OUT 0.01 F µ FIL2 1000 pF 1 F µ 3 V 50 Ω 50 Ω 1.5 kΩ 1000 pF 1 F µ 3 V 0.01 F µ 0.01 F µ 50 Ω 0.01 F µ 1000 pF 3 V 0.01 F µ 10 pF 50 kΩ Note IF OUT PD RSSI OUT FIL3 V CC2 IF IN FIL1 PC8001GR µ

µPC8001

14 PIN PLASTIC SHRINK SOP (225 mil)

B F G E L K I H J A detail of lead end 5˚±5˚ N M M D C P14GM-65-225B-2 ITEM MILLIMETERS INCHES A B C D E F G H I J K 5.40 MAX. 0.65 (T.P.) 0.30 0.125 ±0.075 1.8 MAX. 1.44 6.2 ±0.3 0.75 MAX. 0.213 MAX. 0.005 ±0.003 0.071MAX. 0.244 ±0.012 0.173 0.030 MAX. NOTE L M 0.10 0.5 ±0.2 0.9 4.4 0.012 0.004 0.020 +0.008 –0.009 Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. 0.035 0.057 0.026 (T.P.) +0.10 –0.05 +0.004 –0.003 0.15 +0.10 –0.05 0.006 +0.004 –0.002 N 0.10 0.004 6. PACKAGE DRAWINGS

µPC8001 7. RECOMMENDED SOLDERING CONDITIONS The following conditions must be met for soldering conditions of the µPC8001. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). Please consolt with our sales offices in case other soldering process is used, or in case the soldering is done under different conditions. Types of Surface Mount Device µPC8001GR: 14-pin plastic shrink SOP (225 mil) Soldedering process Soldering conditions Symbol Infrared ray reflow Peak temperature of package surface: 235 ˚C or below, IR35-107-2 Reflow time: 30 seconds or below (210 ˚C or higher), Number of reflow processes: MAX. 2 [Remark] (1) Please start the second reflow process after the temperature, raised by the first reflow process, returns to normal. (2) Please avoid removing the residual flux with water after the first reflow process. Partial heating Terminal temperature: 300 ˚C or below, ——— method Time: 3 seconds or below (Per one side of the device).

µPC8001 Precautions Against Static Electricity Caution When handling the device, be careful to protect it from static electricity. exposure to a strong static electricity charge may destroy internal transistor junctions. During transportation and storage, place the device in the conductive tray or case originally provided by NEC for shipping, or conductive shock absorbing material, metal case, etc. During assembly, be sure to ground the device. Be careful not to place the device on a plastic board and do not touch the device's pins.

µPC8001 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11