UPC741

UPC741 NEC | Alldatasheet

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GENERAL PURPOSE OPERATIONAL AMPLIFIER DESCRIPTION FEATURES The uPC741 is a general purpose operational ampli- © Internal frequency compensation fier having internal frequency compensating circuits. © Short circuit protection Itis intended for a wide range of analog applications. © Offset voltage null capability High common mode voltage range and no latch up tendencies make this amplifier ideal for use as a voltage follower. CONNECTION DIAGRAM EQUIVALENT CIRCUIT (Top View) byt HPC741C / uPC741G2 Gok oy te Os OFFSET [7 | OY lene i Toh NULL Org) Ro | We 5 ie (0.0% h vt | * (os OUT || | Qs Ska oie | a ws 6] our DEI 16] [hl G O20 | ob Qs, YD | Ri| Re OFFSET Lr | OFFSET Re NULL NULL say Re 5 kQ 4 | TQ" 50k OFFSET 502 ev NULL |

ORDERING INFORMATION

PART NUMBER PACKAGE QUALITY GRADE HPC741C 8 PIN PLASTIC DIP (300 mil) uPC741G2 8 PIN PLASTIC SOP (225 mil) Please refer to “Quality grade on NEC Semiconductor Devices” (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-1972A (O.D. No. 1C-6304C) Date Published March 1993 M Printed in Japan

ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) [Sd Power Dissipation Pr [int ae [voto tata rternutanee Pat Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -5.0 mV / °C when ambient temperature is higher than 55 °C. Note 5. Thermal derating factor is -4.4 mV / °C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS [__“amerenone [seer [mee] 2 es ee [ee [oumcwnen Ee) ee OFFSET VOLTAGE NULL CIRCUIT ° 2 ° 5 v

ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V* = +15 V) Input Offset Votage [ve [| so [sso [mv [resi | Input offset Curront ete 7 [wo [| 0 | e200 [mm [OT Input Bias Current Note a a Large Signal Votage Goin [a | 2000 | 20000] | | hszim vento Ors Vowane Adiusabio ange ||| ais [mw | vietona | serovcuen | me pf ts | as | ma [ween | rower Gonsumoion |e || ws | | ow | oeoa Common ModeRejeaion avo | own | 70 | so [| | 4 | ass toxa Supply Votage election ratio | _svn_| | a0 | 150_| ww | Res toka Output Voltage Swing Vom v uinw shor Creuitcuren | tower | 5 | 20 | [ma [aro | Note 7. Input bias currents flow into IC. Because each currents are base current of NPN-transistor on input stage.

TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 °C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 600 120 a Sees co 110}, | | | vi=215 | & [rac2t [Tt Py et | € gf N | TT 2 goof Tt KI | S sof [NP] TT | g paicT NIE 2 op | K | | | Sol | ttt tps 7 S ptt | TN] Tf es LLP TT Pry ery § a, | | T KT 2 yoof | | | tT Pp yr So jf —| | fT NT e EEL Err é ot | [| [T 4 Lt] | | Py op lt [ J tT TN 0 20 40 60 80 100 1 10 100 1k 10k 100k 1M To ~ Ambient Temperature — °C f - Frequency - Hz LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING ooo 3 op _| [| vrs 2. ROPER RE Py 7 f | | | | 7 a @ 2 2 EHH EI 2 2 L so | | 2 Se g | | ff] 9 20 Be eet Heese ced es es A | 8 Eeyore Ss 12 s a 7 | 3 | | UL En) ae a | Sg SOP io) o Ae 1 || XO 1 fcr tt | is . a es: eeneeere 1k 10k 100k 1M 100 1k 10k 100k f - Frequency - Hz Ru - Load Resistance - Q OUTPUT VOLTAGE SWING POWER CONSUMPTION ~ ELT TT T Tq aezke | ee Ere Oe Zio ttt tir tt tT > -E_Pr Pry fF LEE Er a s LLP ET Eryn | i Se gs ~-l tT Ty trey a LITT TTT Try S of | i 1 Pert 8 os |} tT ttt yey g° ET tT rere » ELE TP yt i ee a é -ELP Ee pete ee a rE ee iS | e ~] tet} ttt Ltt yt yr et Ll-rtT Tt tT V* — Supply Voltage - V V* - Supply Voltage - V 4 .

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8PIN PLASTIC DIP (300 mil) 8 5 A K P =| > VOY | rs F-H mie cB M O~15" D ANG) P8c-100.2008.¢ NOTES item | MILLIMETERS. INCHES. 1) Each lead centerline is located within 0.25 L- eee : 2) Item “K” to center of leads when formed as aes parallel DT 0.50 _ 0,020°8:908 F 1.4 MIN. 0.055 MIN 3.2808 0.126 £0.02 1 4.31 MAX. 0.170 MAX J 5.08 MAX. 0.200 MAX. c 0.25 78:88 0.010 78:88 0.25 0.01 6 :

8 PIN PLASTIC SOP (225 mil)

[1 C1 CO 7 a ao Ga ee) fC ~ 8 he oT") EY ala] o[éiu @| S8GM-50-225B-2 NOTE ITEM| MILLIMETERS INCHES Each lead centerline is located within 0.12 D 0.4076:08 0.0165:853 F 1.8 MAX. 0.071MAX. G 1.49 0.059 6.40.3 0.256#0,012 0.152939 0.006°9 968 0.620.2 0.02479.898 N 0.15 0.006

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). [ uPC741G2 ] Soldering . ae Recommended Soldering conditions Infrared ray reflow Peak package’s surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), 1R30-00-1 Number of reflow process: 1, Exposure limit*: None VPS Peak package's surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), VP15-00~1 Number of reflow process: 1, Exposure limit*: None Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below, WS15--00-1 Number of flow process: 1, Exposure limit*: None Partial heating method | Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for “Partial heating method.” TYPES OF THROUGH HOLE DEVICE [ uPC741C ] Soldering . oo Recommended Soldering conditions condition symbol Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below

[MEMO]

[MEMO] No part of this document may be copied or reproduced in any from or by any means without the prior written | consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. | The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6