UPC7073

UPC7073 NEC | Alldatasheet

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Technical content

Datasheet sections

• 3.1 Discrete unit ratings
• 3.2 Combined specifications with µPD9903

BIPOLAR ANALOG INTEGRATED CIRCUIT The µPC7073 is a BS-SLIC that can be used in analog subscriber circuits such as private branch exchangers (PBXs) and switching equipment for central offices. It features two of the functions required for analog subscriber circuits: subscriber line feed control and subscriber line supervision. Use of the µPC7073 in combination with a digital CODEC (µPD9903) can reduce the number of components required in analog subscriber circuits.

FEATURES

• Single-chip, monolithic LSI (bipolar)
• Constant-resistance feed or semi constant-current feed Note
• 200-Ω feed, 400-Ω feed, or Tip-to-Ring pin feedout status (HIGH and WET)
• On-chip metering signal superposing circuit
• On-hook sending and receiving
• Loop detection Note
• Ground detection and ground-fault/power contact protection Note
• Three on-chip relay drivers (flyback prevention diode must be externally provided)
• Two power supply voltages (–48 V and +5 V)
• Low power consumption: 110 mW (TYP., when on hook) Note Requires µPD9903.

ORDERING INFORMATION

µPC7073GT 48-pin plastic shrink SOP (375 mil) µPC7073 The information in this document is subject to change without notice. © 1996 DATA SHEET µPC7073 ANALOG SUBSCRIBER LINE LSI (BS-SLIC) Document No. S10896EJ2V0DS00 (2nd edition) (Previous No. ID-3576) Date Published June 1996 P Printed in Japan

µPC7073 PIN CONFIGURATION 48-pin plastic shrink SOP (375 mil) DC OUT3 DC OUT2 DC OUT1 DC IN1 DC IN2 BB OUT ASCN AGDT BIAS R X ACOM NC NC NC GND1 NC PD ALM BCUT RC RC 2 RC 3 VBB TEF VCC TTX IN C PSR R B R E NC R S NC T S NC T E TB C DC TX OP IN– OP IN+ R EF GND2 NC RY NC RY NC RY PD7073GTµ ACOM : ANALOG COMMON VOLTAGE R B : RING BASE AGDT : ANALOG GROUND DETECTION SIGNAL OUT RC 1-RC 3 : RELAY CONTROL IN ALM : ALARM IN R E : RING EMITTER ASCN : ANALOG LOOP DETECTION SIGNAL OUT R EF : RING EMITTER PROTECT FEED BB OUT :V BB VOLTAGE INFORMATION OUT RS : RING SENSE BCUT : BATTERY FEED CUT SIGNAL IN R X : SIGNAL RECEPTION IN BIAS : BIAS LEVEL RY 1-RY 3 : RELAY DRIVER OUT CDC : DC FEEDBACK CAPACITOR T B : TIP BASE CPSR : POWER SUPPLY REJECTION CAPACITOR T E : TIP EMITTER DC IN1, DCIN2 : DC FEEDBACK CONTROL IN T EF : TIP EMITTER PROJECT FEED DC OUT1 -DC OUT3 : DC FEEDBACK CONTROL OUT T S : TIP SENSE GND1, GND2 : GROUND TTX IN : TELETAX SIGNAL IN NC : NO CONNECTION T X : TRANSSMISSION OUTPUT OP IN+ : TELETAX SIGNAL CANCEL IN (+) V BB : NEGATIVE POWER SUPPLY (–48 V) OP IN– : TELETAX SINGAL CANCEL IN (–) V CC : POSITIVE POWER SUPPLY (+5 V) PD : POWER DOWN CONTROL IN

µPC7073 BLOCK DIAGRAM RC 1 RC 2 RC 3 DC OUT2 AGDT ASCN DC OUT3 DC OUT1 T X DC IN1 DC IN2 CDC R X BIAS ACOM BB OUT C PSR Σ RY 3RY 2RY 1 Relay drivers GND2VCCGND1 TEF TB TE TS R S Tip Ring R E R B R EFV BB VBB BCUT ALM PD OPIN– OPIN+ TTXIN VBB Logic circuits Bias circuit L.P.F

µPC7073 1. PIN FUNCTIONS Number Pin Name I/O Function 1-3 DC OUT1 -DC OUT3 O DC feedback control output [to the µPD9903’s pin 48-46] 4, 5 DC IN1, DCIN2 I DC feedback control input [to the µPD9903’s pin 45, 44] 6B B OUT OV BB voltage information output [to the µPD9903’s pin 43]

7 ASCN O Tip-Ring difference current detection signal output [to the µPD9903’s pin 42]

8 AGDT O Tip-Ring sum current detection signal output [to the µPD9903’s pin 41]

9 BIAS I Bias level input. Connect to µPD9903’s AIN pin [to the µPD9903’s pin 40]

10 R X I Receiving input for 4W side [to the µPD9903’s pin 39]

11 ACOM I Signal reference voltage (2.4 V TYP) input for 4W side[to the µPD9903’s pin 37, 38] 12-14, 16, NC – No-connection pins. Leave these pins unconnected. 26, 28, 30, 39, 41, 43

15 GND1 – Ground pin 1, for circuit grounding

17 PD I Power-down control

H: Power-up TTL level L: Power-down [to the µPD9903’s pin 32]

18 ALM I Ground-fault/power line contact protection mode select input

H: Protect mode TTL level L: Normal feed [to the µPD9903’s pin 31]

19 BCUT I Feed-out select input

H: Feed-out TTL level L: Normal feed [to the µPD9903’s pin 30]

20 RC 1 I Relay control for ringer transmission, high active [to the µPD9903’s pin 29]

21 RC 2 I Relay control for line test, high active [to the µPD9903’s pin 28]

22 RC 3 I Relay control for network test, high active [to the µPD9903’s pin 27]

23 V BB – Negative power supply (–48 V)

24 T EF O Feed resistor pin connection for Tip side during ground-fault/power line contact

25 RY 1 O Relay control for ringer transmission, open collector

27 RY 2 O Relay control for line testing, open collector

29 RY 3 O Relay control for network testing, open collector

31 GND2 – Ground pin 2, relay driver

32 R EF O Ring feed resistor pin connection for ground-fault/power line contact detection

33 OP IN+ I TTX (Teletax) signal cancel circuit input pin (+)

34 OP IN– I TTX signal cancel circuit input pin (–)

35 T X O Transmission output for 4W side. Connect with BIAS pin via CAC capacitor.

36 C DC – Connect to DC feedback capacitor

Connect CDC capacitor to this pin

37 T B O Tip-side auxiliary power transistor base connection pin

38 T E O Tip-side feed amplifier output pin. Connect with TS pin via RFT resistor.

40 T S I/O Tip pin for 2W side

42 R S I/O Ring pin for 2W side

µPC7073 Number Pin Name I/O Function 44 R E O Ring-side feed amplifier output pin. Connect with RS pin via RFR resistor.

45 R B O Ring-side auxiliary power transistor base connection pin

46 C PSR – Connect a capacitor for power supply noise eliminator

47 TTX IN I TTX signal input pin

48 V CC – Positive power supply (+5 V)

µPC7073 2. USE CAUTIONS (1) Combined characteristics of µPC7073 and µPD9903

• The µPC7073 is designed to be used in combination with the µPD9903. Therefore, first half of the electrical characteristics described below are ratings for the µPC7073 as a discrete unit while the second half are combined ratings that include the µPD9903.
• Subscriber circuit constants that are determined by factors such as termination impedance are configured to enable setting by external order parameters. Consequently, input of an order that is not suitable for the target impedance may result in failure to obtain the required characteristics. (2) Absolute maximum ratings Application of voltage or current in excess of the absolute maximum ratings may result in damage. Be especially cautious about surges, etc. (3) Load of by-pass capacitor Because the µPC7073 and µPD9903 use several internal high-frequency operational amplifiers, high power supply impedance can cause instability (such as oscillation) in these internal operational amplifiers. To suppress such instability and eliminate power supply noise, connect by-pass capacitors (C ACOM = approx. 0.1 µF) having superior high frequency characteristics as close as possible to the µ PC7073’s power supply pins (VBB and VCC ) and the µPD9903’s power supply pins (AVDD and DVDD ). (4) Addition of ACOM pin connection capacitor The voltage of the ACOM pin between the µ PC7073 and µ PD9903 is the signal source reference voltage for the µPC7073. Superposition of noise on this pin may have adverse effects on transmission character- istics. Therefore, make the wires between the ACOM pin and the two LSIs as short as possible, and connect capacitors (CACOM = approx. 0.1 µ F) having superior high frequency characteristics as close as possible to the pins. (5) Overcurrent prevention measures Due to its structure, power to the µ PC7073 must first be supplied to a low-voltage potential (VBB ). Accordingly, if power is supplied first to a power supply pin other than VBB , an overcurrent will flow within the µ PC7073 (an overcurrent will not flow if power is input to all power supply pins). Therefore, if feeding to a power supply pin other than VBB first, connect an external diode and limiting resistor (rated at several Ω ) in the directions described below.
• Reverse-bias direction between VBB pin and VCC pin.
• Reverse-bias direction between VBB pin and GND.
• Reverse-bias direction between VCC pin and GND.

µPC7073 3. ELECTRICAL SPECIFICATIONS

3.1 Discrete unit ratings

Absolute maximum ratings (TA = +25 °C) Parameter Symbol Conditions Rating Units Power supply voltage V BB Including spike voltage –63 to +0.3 V VCC Including spike voltage –0.3 to +7.0 VACOM ACOM pin –0.3 to V CC + 0.3 Input voltage V IN0 R X pin –0.3 to V CC + 0.3 VIN1 TS, RS, TE, and RE pins V BB – 0.3 to VCC + 0.3 VIN2 TTX IN pin To be defined Logic input voltage V IN3 BCUT, ALM, PD, RC 1, RC2, and RC3 pins –0.3 to V CC + 0.3 Relay driver output current IOL RY 1, RY2, and RY3 pins 40 mA Power consumption P T Thermal resistance: 160 °C/W, TA = 70 °C 1W Ambient operating T A 0 to 70 ˚C temperature Storage temperature T stg –65 to +150 Caution If the absolute maximum rating for any of the above parameters is exceeded even momentarily, it may adversely affect the quality of this product. In other words, these absolute maximum ratings have been set to prevent physical damage to the product. Do not use the product in such a way as to exceed any of these ratings. Recommended operating conditions Parameter Symbol Conditions MIN. TYP. MAX. Units Power supply voltage V BB –58 –48 –42 V VCC 4.75 5.0 5.25 VACOM ACOM pin 2.38 2.4 2.42 Ambient operating temperature TA 0 2 57 0˚ C High level input voltage V IH BCUT, ALM, PD, RC 1, RC2, and RC3 pins 2.0 V CC V Low level input voltage V IL 0 0.8 Digital input rise and fall timestR BCUT, ALM, PD, RC 1, RC2, and RC3 pins 200 ns tF 200 R X drive impedance 05 0 Ω R X -ACOM offset voltage –0.1 +0.1 V Loop resistance (line resistanceR L VBB = –51 V 200 Ω × 2 feeding modes 1900 Ω + termination resistance) 400 Ω × 2 feeding modes 1500 Terminal leakage current I ON-LEAK 08 m A during on-hook transmission AC inductive current I long f = 60 Hz, 2Pw-Tr Note 5.0 mA rms During loop detection (one line), during ground detection (one line) Note Pw-Tr is a power transistor for feeding.

µPC7073 DC Characteristics (VBB = –42 to –58 V, VCC = 5 V ± 0.25 V, TA = 0 to 70 ˚C, combined characteristics with µPD9903) Parameter Symbol Conditions MIN. TYP. MAX. Units On-hook supply current 1 IBB1 On-hook, including IPw-Tr Note IL = 0 mA 1.9 mA ICC1 Ilong = 0 mA, V BB = –48 V VCC = +5 V Off-hook supply current 1 IBB2 Off-hook, not including IPw-Tr Note IL = 20 mA 4.3 ICC2 Ilong = 0 mA, V BB = –48 V 2.0 VCC = +5 V On-hook supply current 2 IBB3 On-hook, including IPw-Tr Note IL = 0 mA 2.3 2.9 ICC3 Ilong = 0 mA, V BB = –58 V 1.3 1.7 VCC = +5.25 V Off-hook supply current 2 IBB4 Off-hook, not including IPw-Tr Note IL = 20 mA 4.4 5.5 ICC4 Ilong = 0 mA, V BB = –58 V 2.2 2.8 VCC = +5.25 V Power current during I BB6 On-hook, including IPw-Tr Note IL = 0 mA 3 3.9 on-hook transmission ICC6 Ilong = 0 mA, V BB = –58 V 2.1 2.7 VCC = +5.25 V ACOM input current I ACOM ACOM pin On-hook –100 –16 +100 µA Off-hook –100 0 +100 R X input current I RX R X , VRX = 2.4 V 8 12 16 Relay driver input I IH VI = 5.0 V 1.0 1.5 mA current For each RC 1, RC2, and RC3 pins Relay driver output V OL IOL = 35 mA +1.1 V voltage For each RY 1, RY2, and RY3 pins Digital pin high level I IH VI = 2.0 V 0.5 mA input current For each BCUT, ALM, PD, RC 1, RC2, and RC3 pins Digital pin low level I IL VI = 0.0 V 50 µA input current For each BCUT, ALM, PD, RC 1, RC2, and RC3 pins Control input voltage BCUT : I L = 50 mA → | IL | ≤ 1 mA 2.0 V : IL = 50 mA → – IL × 90 % : IL = 50 mA → | IL | ≤ 20 mA BCUT, IL = 50 mA → – IL × 90 % 0.8 DC feed resistance R BF 200 Ω feed 180 200 220 Ω 400 Ω feed 360 400 440 High and wet R H&W R L = 1900 Ω 100 k Ω impedance AC/DC Ground-fault/power V BB = –48 V 12.1 13.1 14.1 mA contact drooping current R TE5K /RRE5K = 3.6 kΩ Note IPw-Tr is the current to the power transistor for feeding.

µPC7073

3.2 Combined specifications with µPD9903

µPC7073 (V BB = –42 to –58 V, VCC = 5 V ± 0.25 V, TA = 0 to 70 ˚C, 18 ≤ IL ≤ ILMAX (mA)) µPD9903 (T A = 0 to 70 ˚C, VDD = 5 V ± 0.25 V, VDD = VAG = 0 V, fDCLK = 2048 kHz) Parameter Symbol Conditions MIN. TYP. MAX. Units DC feed resistance R BF 200 Ω feed 180 200 220 Ω 400 Ω feed 360 400 440 Minimum loop unit I LMIN VBB = –51 V 200 Ω feed 21.7 22.2 22.6 mA R L = 1900 Ω 400 Ω feed 18.2 18.8 19.3 Maximum current setting I LMAX ILMAX = 76 mA setting 200 Ω feed 70 76 82 mA 400 Ω feed 50 55 60 ILMAX = 45 mA setting 40 45 50 ILMAX = 35 mA setting 31 35 39 Pin voltage during on-hook V TS Normally on-hook, 2.25 2.55 2.85 V between Tip and GND, VBB = –48 V VRS Normally on-hook, 3.05 3.35 3.65 between Ring and VBB , VBB = –48 V VTS On-hook transmission, 2.25 2.55 2.85 between Tip and GND, VBB = –48 V VRS On-hook transmission, 3.05 3.35 3.65 between Ring and VBB , VBB = –48 V Voltage between lines V TS VBB = –48 V V BB – 7.0 VBB – 5.9 VBB – 5.0 V during on-hook Supervisory control V BBF 32 35 38 V – VBB fault voltage

µPC7073 Parameter Symbol Conditions MIN. TYP. MAX. Units Loop detection operating R ON1 Includes termination 200 Ω feed 2500 Ω resistance (during normal resistance 400 Ω feed 2100 transmission) Loop detection non-operating 200 Ω feed 3900 resistance (during normal 400 Ω feed 3500 transmission) Loop detection operating R ON2 Includes termination 200 Ω feed 1900 Ω resistance (during on-hook resistance 400 Ω feed 1500 transmission) Loop detection non-operating 200 Ω feed 2840 resistance (during on-hook 400 Ω feed 2440 transmission) Loop release non-operating R ON3 Includes termination 200 Ω feed 2960 Ω resistance resistance 400 Ω feed 2560 Loop release operating 200 Ω feed 4540 resistance 400 Ω feed 4140 Ground detection 1 (C/O) R ON4 Includes termination resistance 5.2 k Ω operating resistance Ground detection 1 (C/O) 20 non-operating resistance Ground-fault/power line R ON6 Includes terminationILMAX = 45/76 mA 340 Ω contact detection resistance operating resistance Off-hook stage ILMAX = 35 mA 480 Ground-fault/power line Includes termination ILMAX = 45/76 mA 870 Ω contact detection non- resistance ILMAX = 35 mA 1130operating resistance Ground-fault/power line R ON7 Includes termination resistance 1.4 k Ω contact release non- operating resistance Ground-fault/power line 10 contact release operating resistance Note The above values are resistance-converted values.

µPC7073 Transmission Characteristics µPC7073 (VBB = –42 to –58 V, VCC = 5 V ± 0.25 V, TA = 0 to 70 ˚C, 18 ≤ IL ≤ ILMAX (mA)) µPD9903 (TA = 0 to 70 ˚C, VDD = 5 V ± 0.25 V, VDG = VAG = 0 V, fDCLK = 2048 kHz) Parameter Symbol Conditions MIN. TYP. MAX. Units Insertion loss IL A-D input signal –0.45 0.0 +0.45 dB 0 dBm0 1 kHz D-A input signal –0.45 0.0 +0.45 0 dBm0 1 kHz Transfer loss frequency F RX A-D 60 Hz 24.0 – dB characteristics Reference input signal 200 Hz 0.6 2.0 1015 Hz 0 dBm0 300 Hz –0.15 +0.21 400 to 3000 Hz –0.15 +0.15 3200 Hz –0.15 +0.65 3400 Hz 0.2 0.8 FRR D-A 60 Hz 0.2 4.0 Reference input signal 200 Hz 0.1 1.0 1015 Hz 0 dBm0 300 Hz –0.15 +0.25 400 to 3000 Hz –0.15 +0.15 3200 Hz –0.15 +0.65 3400 Hz 0.2 0.8 Gain tracking GT X A-D +3 to –40 dBm0 –0.2 +0.2 dB (tone method) Reference input signal –50 dBm0 –0.5 +0.5 –10 dBm0 –55 dBm0 –1.0 +1.0 f = 700 to 1100 Hz GT R D-A +3 to –40 dBm0 –0.2 +0.2 Reference input signal –50 dBm0 –0.4 +0.4 –10 dBm0 –55 dBm0 –0.8 +0.8 f = 700 to 1100 Hz Return loss RL Input signal 300 Hz 16 dB 0 dBm0 500 to 2000 Hz 20 ZT = 600 Ω + 2.16 µF 2000 to 3400 Hz 16 Echo attenuation TBRL Input signal 300 Hz 18 dB 0 dBm0 500 to 2500 Hz 22 ZT = 600 Ω + 2.16 µF 3400 Hz 18 Transmit channel total SD X A-D +3 to –30 dBm0 36 dB power distortion ratio Input signal –40 dBm0 30 (tone method) f = 700 to 1100 Hz –45 dBm0 25 SD R D-A +3 to –30 dBm0 36 Input signal –40 dBm0 30 f = 700 to 1100 Hz –45 dBm0 25

µPC7073 Parameter Symbol Conditions MIN. TYP. MAX. Units Absolute delay D A A-A input signal 0 dBm0 540 µs characteristics Absolute delay distortion D O A-A 500 Hz 1400 frequency characteristics 600 HZ 700 1000 to 2600 Hz 200

2800 Hz 1400

Intermodulation (2 Tone) IMD A-D input signal 44.0 dB f1, f2: 300 to 3400 Hz –4 to –21 dBm0 Measured signal: 2 × f1 – f2 level (2 × f1 – f2) vs level (f1, f2) D-A input signal 44.0 f1, f2: 300 to 3400 Hz –4 to –21 dBm0 Measured signal: 2 × f1 – f2 level (2 × f1 – f2) vs level (f1, f2) Single frequency noise N SF D-A –54 dBm0 PAD level set at 0 dB Measured signal up to f = 256 kHz Deviation in gain setting Δ DGS X Difference from A-D reference set value dB for transmit channel Setting value: +7.5 to +3.0 dB –0.2 +0.2 Gain setting deviation Δ DGS R Difference from D-A reference set value for receive chanel Setting value: 0.0 to –5.0 dB –0.1 +0.1 Idle circuit noise ICN 24 2W-4W A-law Psophometric weighted –67 dBm0p µ-law C message weighted 23 dBrnc0 ICN42 4W-2W A-law Psophometric weighted –76 dBm0p µ-law C message weighted 14 dBrnc0 Line to ground balance LB R F = 50 Ω f = 300 to 600 Hz 42 dB attenuation Relative accuracy = 0.5 %f = 600 to 3400 Hz 48 VBB -PSRR (tone method) PSRR B IL = 20 mA f = 60 to 3400 Hz 30 dB f = 100 kHz –5 VCC -PSRR (tone method) PSRR C IL = 20 mA f = 60 to 3400 Hz 25 f = 100 kHz 5 AC induction noise LFI I L = 0 mA V IN = 6 Vrms 43 dBrnc resistance IL = 20 mA V IN = 15 Vrms 20

µPC7073 4. SYSTEM APPLICATION EXAMPLE USING µPC7073 AND µPD9903 48 25 27 29 1 F (6 V) µ C VCC R T1 T2 VCC (+5 V) VCC RY1 RY2 RY3 ACOM TB37Q1 TE38 TEF24R TE TS40 R S42 3.6 kΩ (1 %, 1 W) 32R RE R B45Q4 R E R EF D1D2 D4D3 50 Ω (0.5 %, 1 W)Z1 Z2 R FR 50 Ω (0.5 %, 1 W) TS R S TEST0 TEST1 TEST2 TEST3 GG CR T1 R R FT VBB (–48 V) VBB TTXIN GND2 GND1 CPSR CDC OPIN+ OPIN– C VBB 0.1 F (100 V) µ PSR 0.68 F (50 V) µ C DC 0.68 F (10 V) µ PC7073 (BS-LSI)µ C AC

0.68 F (50 V)

µ T X BIAS R X DC OUT3 DC OUT2 DC OUT1 DC IN1 DC IN2 BCUT ALM PD RC 1 RC 2 RC 3 BB OUT ASCN AGDT AVDD SUS PC9903 (HCS-LSI)µ AIN A OUT CD IN3 CD IN2 CD IN1 DC OUT1 DC OUT2 BCUT ALM PD RC RC 2 RC 3 BB IN ASCN AGDT ACOM IN ACOM OUT HW X 23 HW X TYPE 24 TYPE FS 22 FS DCLK 21 DCLK HW R 20 HW R EXD 19 EXS 18 RST 17 AUX/MODE 14 DVDD2 DVDD1 BSY AGND DGND2 SUB DGND1 RTIN1 RTIN0 0.1 F (5 V) C COM C VDD 0.1 F (6 V) µ 11 12 13 16 15 R SUS 1 kΩ R BSY 1 kΩ 2k Ω R PULL VDD (+5 V) 36 35 34 33 26 25 Ring-Trip detector C GDT 0.68 F (10 V) µ AUX/MODE EXD EXS RST µ

µPC7073 5. PACKAGE DRAWING

48 PIN PLASTIC SHRINK SOP (375 mil)

C BD E F G A12 4 48 25 L I H J K detail of lead end MM N +7° –3° P48GT-65-375B-1 ITEM MILLIMETERS INCHES A B C D E F G H I J K 16.21 MAX. 0.65 (T.P.) 2.0 MAX. 1.7 ±0.1 10.0 ±0.3 0.63 MAX. 0.639 MAX. 0.005 ±0.003 0.079 MAX. 0.394 0.315 ±0.008 0.025 MAX. NOTE L M 0.5 ±0.2 0.15 1.0 ±0.2 8.0 ±0.2 0.004 0.020 +0.008 –0.009 Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. 0.067 ±0.004 0.026 (T.P.) 0.006 N 0.10 0.004 0.0120.30 ±0.10 0.125 ±0.075 +0.004 –0.002 0.10 +0.10 –0.05 +0.004 –0.005 +0.012 –0.013 0.039 +0.009 –0.008

µPC7073 6. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the conditions recommended below. For details of recommended soldering conditions, refer to the information document Semiconductor Device Mounting Technology Manual (C10535E) . For soldering methods and conditions other than those recommended, please contact your NEC sales representative. SURFACE MOUNT TYPE µPC7073GT: 48-pin plastic shrink SOP (375 mil) Soldering Method Soldering Conditions Recommended Condition Symbol Infrared reflow Package peak temperature: 235 ˚C IR35-00-1 Duration: 30 sec. max. (210 ˚C or above) Number of times: 1 Pin heating Pin temperature: 300 ˚C max. – Duration: 3 sec. max. (per side of device) Note For the storage period after unpacking from the dry-pack, storage conditions are max. 25 ˚C, 65 % RH.

µPC7073 Notes on Handling Devices against Electrostatic Discharge Caution When handling this device, special care against electrostatic discharge (ESD) must be taken. If a strong ESD is applied to this device, the junction parts of the internal transistors may be destroyed. Therefore, when transporting or storing this device, be sure to use the conductive tray or magazine case in the packing provided by NEC, or use a conductive buffer material or metal case. Also be sure to ground the operator's body and any tools that may enter in contact with the device during assembly processes. Never put or leave the device on a plastic board or table, and do not touch the device pins directly by hand.

µPC7073 [MEMO]

µPC7073 [MEMO]

µPC7073 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.