UPC667 NEC | Alldatasheet

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© 1993, 1996 DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC667 10-BIT D/A CONVERTER The information in this document is subject to change without notice. The mark H shows major revised points.Document No. S11099EJ2V0DS00 (2nd edition) (Previous No. IC-3250) Date Published February 1996 P Printed in Japan The µPC667 is high-speed and high-precision 10-bit D/A converter. Clock rate of the µPC667 is 60 Msps. Conversion precision of the µPC667 is ±1.0 LSB.

FEATURES

  • Resolution 10-bit
  • Clock rate 60 Msps
  • Technology Bi-CMOS
  • Power supply +5 V
  • D/A conversion method R-2R ladder resistance and segment summing system
  • Analog output form Voltage output type
  • Built-in reference voltage generating circuit

ORDERING INFORMATION

µPC667CT 30-pin plastic shrink DIP (400 mil)

µPC667 BLOCK DIAGRAM CLK D1 to D10 Input buffer Master-slave F.F. Current switch R-2R ladder A OUT Reference voltage generator Amp. Reference current source Reference resistor V RSET VROUT VREF COMP AV CC DV CC AGND DGND

µPC667 PIN CONFIGURATION (Top View) D10 DGND CLK NC DGND NC DV CC AGND AV CC COMP A OUT VREF AV CC AGND DGND V ROUT VRSET NC NC NC NC µPC667CT AGND : Ground for Analog Circuit AOUT : Analog Output AV CC : Power Supply for Analog Circuit CLK : Clock COMP : Phase Compensation D1 to D10: Digital Signal DGND : Ground for Digital Circuit DV CC : Power Supply for Digital Circuit NC : No Connection VREF : Reference Voltage VROUT : Reference Voltage Output VRSET : Reference Voltage Adjustment

µPC667 PIN FUNCTIONS Pin Name Pin No. Input/ Function Equivalent CircuitOutput D1 to D10 1 to 10 Input Digital signal D1 is MSB, D10 is LSB. CLK 12 Input Clock The rising edge of signal input to this pin triggers analog output. DV CC 30 — Power supply for digital circuit DGND 11, 14, 22 — Ground for digital circuit VRSET 20 — Reference voltage adjustment Voltage adjusting pin for the incorporated reference voltage generating circuit. The output voltage of V ROUT pin varies according to the voltage applied to this pin. When no adjustment is necessary, connect approx. 0.1 µF capacitance between this pin and GND pin. VROUT 21 Output Reference voltage output Voltage output pin of the incorpo- rated reference voltage generating circuit. This pin has high output impedance, and must be connected with a high impedance element. DV CC 500 Ω DGND DGND DV CC DV CC 500 Ω DGND DGND DV CC DV CC DGND AV CC VROUT AGND 2 kΩ AV CC7.5 kΩ 3 kΩ VRSET AGNDReference voltage generator AV CC

µPC667 Pin Name Pin No. Input/ Function Equivalent CircuitOutput AGND AGND AV CC AV CC AV CC 9.7 kΩ 9.7 kΩ COMP AV CC VREF 25 Input Reference voltage The output full-scale range is set according to the voltage applied to this pin. Apply standard 4.0 V. When no adjustment is necessary, connect the output from V ROUT pin directly to this pin. AOUT 26 Output Analog signal Analog signal output pin. COMP 27 — Phase compensation Phase compensating capacitor connection pin for full-scale ampli- fier. Approx. 0.1 µF capacitor must be connected between this pin and AV CC pin. AV CC 24, 28 — Power supply for analog circuit AGND 23, 29 — Ground for analog circuit NC 13, 15 to 19 — No Connection AGNDAGNDAGND AGND AV CC 112.5 Ω 112.5 Ω 225 Ω 112.5 Ω R-2R Ladder resistance AV CC AGND AGND 5 kΩ 20 Aµ AV CC AGND AV CC

µPC667 H ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25 ˚C) Parameter Symbol Ratings Unit Supply voltage for digital circuit DVCC –0.3 to +6.0 V Input voltage V I –0.3 to VCC +0.3 V Operating ambient temperature T A –20 to +70 ˚C Storage temperature T stg –40 to +125 ˚C Power dissipation P D 0.8 (TA = +60 ˚C) W Supply voltage for analog circuit AV CC DV CC –0.3 to DVCC +0.3 V Caution Exposure to Absolute Maximum Rating for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. Recommended Operating Conditions Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply voltage for digital circuit DVCC 4.75 5.0 5.25 V Supply voltage for analog circuit AV CC 4.75 5.0 5.25 V Reference voltage input pin voltage VREF 3.8 4.0 4.2 V High-level voltage of digital input VIH 2.0 V Low-level voltage of digital input VIL 0.8 V Conversion clock frequency f CLK 60 MHz Phase compensation capacitance C COMP 1.0 µF

µPC667 DC Characteristics and AC Characteristics (TA = –10 to +70 ˚C, DVCC = AVCC = +5 ±0.25 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Resolution RSL 10 Bit Integral linearity error ILE T A = 0 to 60 ˚C, VREF = 4.0 V –1.0 +1.0 LSB Differential linearity error DLE T A = 0 to 60 ˚C, VREF = 4.0 V –1.0 +1.0 LSB Supply current I CC 50 71 mA Set-up time t s 37 n s Hold time t h 1.5 7 ns Settling time t SET TA = 25 ˚C, RL = 375 Ω , VREF = 4.0 V 13 ns Output delay time t d VREF = 4.0 V 9 13 ns Full-scale voltage output V ofs VREF = 4.0 V, RL > 100 kΩ 4.95 5.0 V Zero-scale voltage output V ozs VREF = 4.0 V, RL > 100 kΩ 3.95 4 4.05 V Output resistance Z out VREF = 4.0 V 70 85 100 Ω Internal reference voltage output voltageVROUT AV CC = 5.0 V 3.8 4.0 4.2 V Cautions 1. As for the phase compensation capacitance, capacitor of 1 µF should be connected between the phase compensation capacitance pin (COMP) and the power supply pin for analog circuit (AV CC ). 2. The internal reference voltage output pin (VROUT ) and the reference voltage input pin (VREF ) should be shorted. 3. The power supply and GND lines for analog circuit (AVCC and AGND) and those for digital circuit (DVCC and DGND) should be located as separately as possible.

µPC667 Timing Chart ± 1/2 LSB tSET Final value ± 1/2 LSB tSETtD ts th D n D n+1 An An+1An-1 tPWH tPWL D1 to D10 AOUT CLK H

µPC667 APPLICATION CIRCUIT EXAMPLE Power supply for analog circuit AGND DGND Power supply for digital circuit Conversion clock 10-bit digital input PC667CT 4.7 F 1000 pF 4.7 F 1000 pF 1 F D1 (MSB) D10 (LSB) DGND CLK NC DGND NC DV CC AGND AV CC COMP AOUT VREF AV CC AGND DGND VROUT VRSET NC NC NC NC µ µ µ µ Analog output

µPC667 PACKAGE DRAWING 30PIN PLASTIC SHRINK DIP (400 mil) ITEM MILLIMETERS INCHESNOTES 1) Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition. N 0.17 0.007 A 28.46 MAX. 1.121 MAX. B 1.78 MAX. 0.070 MAX. F 0.85 MIN. 0.033 MIN. J 5.08 MAX. 0.200 MAX. D 0.50±0.10 0.020 +0.004 –0.005 H 0.51 MIN. 0.020 MIN. I 4.31 MAX. 0.170 MAX. L 8.6 0.339 M 0.25 0.010 +0.004 –0.003 +0.10 –0.05 M RM I H G F DN C B K S30C-70-400B-1 R 0~15 ° 0~15 ° 2) ltem "K" to center of leads when formed parallel. 11 5 30 16 A L J

µPC667 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). Through-hole device µPC667CT: 30-pin plastic Shrink DIP (400 mil) Process Conditions Wave soldering Solder temperature: 260 ˚C or below, (only to leads) Flow time: 10 seconds or less. Partial heating method Terminal temperature: 300 ˚C or below, Heat time: 3 seconds or less (Per each lead). Caution For through-hole devices, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. H

µPC667 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 [MEMO] The application circuits and their parameters are for references only and are not intended for use in actual design-in's.