UPC4741 NEC | Alldatasheet
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HIGH PERFORMANCE QUAD OPERATIONAL AMPLIFIER DESCRIPTION FEATURES The uPC4741 consists of four independent fre- + Internal frequency compensation quency compensated operational amplifiers featur- + Low noise ing higher speed, broader band than general purpose + Qutput short circuit protection type as 741. The uPC4741 is most appropriate for AC signal amplifier applications such as active filters or pulse amplifiers. EQUIVALENT CIRCUIT (1/4 Circuit) CONNECTION DIAGRAM (Top View) vt ° t uPCA7A1C, 474162 Ri
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s 0» » BAY Ata bo Ko ach as Sh Qs bs le lwo Quo i Re SPs ve i [17] GND lon Rr Tp On an Ina, 110] Ineo 5 Fa Q7 © OUT ie [6] \\,/ \\e/ [9] lc Qs Qs ——{Tan > Y fs] our.
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ORDERING INFORMATION
14 PIN PLASTIC SOP (225 mil
Please refer to “Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-1197A -_ (O.D. No. 1C-6139C) Date Published March 1993P Printed in Japan
— NEC PATA ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) Input Voltage (Note 2) V-=0.3 to V*40.3 Vv ee Output Short Circuit Duration Woes) | = =| s—i‘imzC«dStsees—s Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -7.6 mW/°C when ambient temperature is higher than 50 °C. Note 5. Thermal derating factor is -5.5 mW/°C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Notes 4 and 5. RECOMMENDED OPERATING CONDITIONS [___eanracrenisne son an [eae [Sioowvomse ee
ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V* = +15V) CHARACTERISTIC SYMBOL UNIT CONDITION Input Bigs Curent Note 7) | Large Signal Voltage Gain A [50,000 | | Ri 2kQ, Vo=#10V Common Mode Rejection Ratio cMR | 90 | dB Supply Voltage Rejection Ratio SVR | so | 100 nV Maximum Output Voltage Vom R22kQ Common Mode Input V. Range View a Input Equivalent Noise Voltage 9 avi | f= 1kHz Density Channel Separation || tos [ae | f= 10 KHz Note 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage. Please be careful with followings: In low input level circuits, relative interferences may sometimes occur due to the temperature gradient in the IC chip when the difference of power dissipation between channels is extremely large. MEASUREMENT CIRCUIT Fig. 1 Channel Separation Measurement Circuit a Vor 50a Channel Separation
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=|20 «toa sas “Vail 1oke 10kQ ° B A OVor
——_ SES TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 ‘C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 120 ee a a a oe Ft tf | 5 aN re s i PERCE @ 600 1-4741C- —— % 80 ZN | Ci = 50 pF © 400 NIN > 60 N : SS pL EN : IN z° y B= gy | EE AL e 9 20 \\ . : 211 EI INI 0 20 40 60 80 100 1 10 100 ik 10k 100k 1M 10M Ta ~ Ambient Temperature ~ °C f ~ Frequency - Hz LARGE SIGNAL FREQUENCY RESPONSE COMMON MODE INPUT VOLTAGE RANGE i, a es” = VE = 215V 37 oD >o 2 ge 30 7 G 2 ef > ee | rs :
3 VF = 210 3
ic = 20 7 > is Fi 2 i i a a SAY £ ° VF = a5V 6 °° Y > & 0 = ° 100 1k 10k 100 k 1M 210 ‘#20 f ~ Frequency ~ Hz V+ ~ Supply Voltage - V OUTPUT VOLTAGE SWING VOLTAGE FOLLOWER PULSE RESPONSE 30 1
3 Ed ee ee Ce
1 & Ci. = 50 pF 2 2s Vi =215V 3 3° 2 3 FE 3% $ $5 a 10 £ 3 ge : 2 $ Ess oO 100 300 1k 3k 10k o 10 20 30 Ri ~ Load Resistance ~ 2 Time - us
CHANNEL SEPARATION INPUT EQUIVALENT NOISE VOLTAGE DENSITY 150 —_ 30 — : aS ee & 100 § . 20 8 Bz S $2 3 && z 50 — 2 8 10 Input equivalent ° 0 10 100 1k 10k 100 k 10 100 ik 10k 100 k f— Frequency - Hz f ~ Frequency - Hz SUPPLY CURRENT 6 _ <to5 | f €o4 “a S 5 ff) ) | So 3 S 2 fo} | fi Boia fe +5 #10 #15 +20 V# — Supply Voltage - V
14PIN PLASTIC DIP (300 mil) ~~ 14 8 to | A K [oe a | ~ VOIBRAUA'D i F {Lh D cB M O~15 P14¢-100-30081 NOTES ; item | MILLIMETERS 1) Each lead centerline is located within 0.25 eacumieal maximum material condition. 8 | 2.54 MAX em “K” to center of leads when forme — J 5.08 MAX. 0.200 MAX. VS
14 PIN PLASTIC SOP (225 mil)
a) | a) = [-] = ] HHRABARAREAEG | rl ry | rl | CI so in See SE te CI a) = = LI = CI roy 7 7 or H o) L J wl fT {cj fol _N_] D $14GM-50-225B, C-2 NOTE iTeM| MILLIMETERS | INCHES | Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at a 1.49 0.059 ee 0.60.2 0.02479 898 0.12 0.005
____NEC HPCA741 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). {uPC4741G2)} . . ioe Recommended condition Soldering method Soldering conditions symbol Infrared ray reflow Peak package's surface temperature: 230 “C or below, 1R30-00-1 Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 1, Exposure limit *: None VPS Peak package's surface temperature: 215 °C or below, VP15-00-1 Reflow time: 40 seconds or below (200 C or higher), Number of reflow process: 1, Exposure limit “: None Wave soldering Solder temperature: 260 °C or below, WS15-00-1 Flow time: 10 seconds or below, Number of flow process: 1, Exposure limit *: None Partial heating Terminal temperature: 300 °C or below, ° method Flow time: 10 seconds or below, Exposure limit *: None * Exposure limit before soldering after dry-pack package is opened. i Storage conditions: 25 °C and relative humidity at 65 % or less. | Note Do not apply more than a single process at once, except for “Partial heating method”. | TYPES OF THROUGH HOLE DEVICE | [uPC4741C] . ae Recommended condition Soldering method Soldering conditions symbol Wave soldering Solder temperature: 260 °C or below, fe) Flow time: 10 seconds or below
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a i, No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use “Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6