UPC4741 RENESAS | Alldatasheet

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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. BIPOLAR ANALOG INTEGRATED CIRCUIT µPC4741 HIGH PERFORMANCE QUAD OPERATIONAL AMPLIFIER DATA SHEET Document No. G16051EJ4V0DS00 (4th edition) Date Published March 2004 N CP(K) Printed in Japan The mark shows major revised points. 1987

DESCRIPTION

The µPC4741 consists of four independent frequency compensated operational amplifiers featuring higher speed, broader band than general purpose type as 741. The µPC4741 is most appropriate for AC signal amplifier applications such as active filters or pulse amplifiers.

FEATURES

  • Internal frequency compensation
  • Low noise
  • Output short circuit protection

ORDERING INFORMATION

µPC4741C µPC4741C(5) 14-pin plastic DIP (7.62 mm (300)) 14-pin plastic DIP (7.62 mm (300)) µPC4741G2 µPC4741G2(5) 14-pin plastic SOP (5.72 mm (225)) 14-pin plastic SOP (5.72 mm (225)) EQUIVALENT CIRCUIT (1/4 Circuit) R 1 R 5 R 4 R 7R 6 R 8 D 2 Q 15 R 3R 2 II IN Q 1 Q 2 Q 8 Q 16 Q 9 Q 10 Q 12 Q 13 Q 5 Q 14 Q 3 Q 4 Q 6 Q 11 Q 7 C 1 D 1 OUT V V PIN CONFIGURATION (Top View) OUT 4 II4 IN4 IN3 II3 OUT 3 OUT 1 II1 IN1 IN2 II2 OUT 2 −+ −+ −+ −+ PC4741C, 4741G2µ

Data Sheet G16051EJ4V0DS 2 µPC4741 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter Symbol Ratings Unit Voltage between V and V− Note1 V − V− −0.3 to +40 V Differential Input Voltage V ID ±30 V Input Voltage Note2 VI V−−0.3 to V +0.3 V Output Voltage Note3 VO V−−0.3 to V +0.3 V C Package Note4 570 mW Power Dissipation Note5 PT 550 mW Output Short Circuit Duration Note6 10 sec Operating Ambient Temperature T A −20 to +80 °C Storage Temperature T stg −55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc ., this specification should be kep t. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is t he voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even duri ng the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is –7.6 mW/°C w hen ambient temperature is higher than 50°C. 5. Thermal derating factor is –5.5 mW/°C w hen ambient temperature is higher than 25°C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V ± ±4 ±16 V

Data Sheet G16051EJ4V0DS 3 µPC4741 µPC4741C, 4741G2 ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage V IO R S ≤ 100 Ω ±1.0 ±5.0 mV Input Offset Current Note IIO ±30 ±50 nA Input Bias Current Note IB 70 300 nA Large Signal Voltage Gain A V R L ≥ 2 kΩ , VO = ±10 V 25,000 50,000 Power Consumption Pd I O = 0 A 150 210 mW Common Mode Rejection Ratio CMR 80 100 dB Supply Voltage Rejection Ratio SVR 50 100 µV/ V Maximum Output Voltage V om R L ≥ 10 kΩ ±12 ±13.7 V Maximum Output Voltage V om R L ≥ 2 kΩ ±10 ±12.5 V Common Mode Input Voltage Range V ICM ±12 ±14 V Slew Rate SR A V = 1 1.6 V/ µs Input Equivalent Noise Voltage Density en f = 1 kHz 9 nV/ Hz Channel Separation f = 10 kHz 108 dB Note Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage. µPC4741C (5), 4741G2 (5) ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage V IO R S ≤ 100 Ω ±1.0 ±2.0 mV Input Offset Current Note IIO ±30 ±50 nA Input Bias Current Note IB 100 nA Large Signal Voltage Gain A V R L ≥ 2 kΩ , VO = ±10 V 28,000 50,000 Power Consumption Pd I O = 0 A 150 210 mW Common Mode Rejection Ratio CMR 85 90 dB Supply Voltage Rejection Ratio SVR 50 µV/ V Maximum Output Voltage V om R L ≥ 10 kΩ ±12.5 ±13.7 V Maximum Output Voltage V om R L ≥ 2 kΩ ±11 ±12.5 V Common Mode Input Voltage Range V ICM ±13 ±14 V Slew Rate SR A V = 1 1.6 V/ µs Input Equivalent Noise Voltage Density en f = 1 kHz 9 nV/ Hz Channel Separation f = 10 kHz 108 dB Note Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.

Data Sheet G16051EJ4V0DS 4 µPC4741 MEASUREMENT CIRCUIT Fig.1 Channel Separation Measurement Circuit VO2 1000 Channel Separation = 20 log 50 Ω 50 kΩ VO1 10 kΩ 10 kΩ VO1 VO2

Data Sheet G16051EJ4V0DS 5 µPC4741 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) TA - Operating Ambient Temperature - ˚C POWER DISSIPATION PT - Total Power Dissipation - mW 800 600 400 200 0 20 40 60 80 100 PC4741G2µ PC4741Cµ 132˚C/W 182˚C/W 100 120 1 100 10 k 1 M 1 k10 100 k 10 M f - Frequency - Hz OPEN LOOP FREQUENCY RESPONSE AV - Open Loop Voltage Gain - dB V± = ±15 V RL = 2 kΩ CL = 50 pF 2.5 1.5 0.5 −0.5 −1.5 −2.5 −20 02 04 0 6 0 8 0 INPUT OFFSET VOLTAGE VIO- Input Offset Voltage - mV TA - Operating Ambient Temperature - ˚C V= ±15 V± each 5 samples data 100 −20 02 04 0 6 0 8 0 INPUT BIAS CURRENT IB - Input Bias Current - nA TA - Operating Ambient Temperature - ˚C V= ±15 V± f - Frequency - Hz LARGE SIGNAL FREQUENCY RESPONSE Vom - Output Voltage Swing - Vp-p 100 1 k 10 k 100 k 1 M V= ±15 V± V= ±10 V± V= ±5 V± COMMON MODE INPUT VOLTAGE RANGE VICM - Common Mode Input Voltage Range - V 0 ±10 ±20 V - Supply Voltage - V±

Data Sheet G16051EJ4V0DS 6 µPC4741 OUTPUT VOLTAGE SWING Vom - Output Voltage Swing - Vp-p 100 300 1 k 3 k 10 k RL - Load Resistance - Ω VOLTAGE FOLLOWER PULSE RESPONSE VI - Input Voltage - V VO - Output Voltage - V 01 0 2 03 0 t - Time - s µ V= ±15 V± CL = 50 pF RL = 2 kΩ−5 SUPPLY CURRENT ICC - Supply Current - mA 0 ±10 ±20 V - Supply Voltage - V± ±15 −20 02 04 0 6 0 8 0 SUPPLY CURRENT ICC - Supply Current - mA TA - Operating Ambient Temperature - ˚C V= ±15 V± CHANNEL SEPARATION Channel Separation - dB 150 100 10 100 1 k 10 k 100 k f - Frequency - Hz f - Frequency - Hz INPUT EQUIVALENT NOISE VOLTAGE DENSITY en - Input Equivalent Noise Voltage Density - nV/ Hz 100 1 k 10 k 100 k10

Data Sheet G16051EJ4V0DS 7 µPC4741 PACKAGE DRAWINGS (Unit: mm) 14-PIN PLASTIC DIP (7.62 mm (300)) ITEM MILLIMETERS A 19.22 ±0.2 2.14 MAX. F I J D 1.32 ±0.12 G 3.6 ±0.3 C B 2.54 (T.P.) 0.50 ±0.10 R 0~15 ° H 0.51 MIN. K 7.62 (T.P.) L 6.4 ±0.2 3.55 4.3 ±0.2 N 0.25 J B M R H G I C F DN NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. P14C-100-300B1-3 14 8 M A L K M 0.25 +0.10 −0.05

Data Sheet G16051EJ4V0DS 8 µPC4741 C D M G P detail of lead end M 14 8 F E B S K L J A H I NS ITEM B C I 14-PIN PLASTIC SOP (5.72 mm (225)) D E G H J P MILLIMETERS 1.27 (T.P.) 1.42 MAX. A 10.2 ±0.26 4.4 ±0.1 0.1 ±0.1 0.42 6.5 ±0.2 1.49 +0.08 −0.07 1.1 ±0.16 3°+7° −3° NOTE Each lead centerline is located within 0.1 mm of its true position (T.P.) at maximum material condition. F 1.59 +0.21 −0.2 K L M N 0.6 ±0.2 0.17 0.1 0.10 +0.08 −0.07 S14GM-50-225B, C-6

Data Sheet G16051EJ4V0DS 9 µPC4741 RECOMMENDED SOLDERING CONDITIONS The µPC4741 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC4741G2, 4741G2(5): 14-pin plastic SOP (5.72 mm (225)) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 235° C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 3 time. IR35-00-3 Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 3 time. VP15-00-3 Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC4741C, 4741C(5): 14-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.

µPC4741 The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC E lectronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1