UPC4560 RENESAS | Alldatasheet
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The mark shows major revised points. BIPOLAR ANALOG INTEGRATED CIRCUIT µPC4560 HIGH PERFORMANCE DUAL OPERATIONAL AMPLIFIER DATA SHEET Document No. G15805EJ4V0DS00 (4th edition) Date Published March 2004 N CP(K) Printed in Japan The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. 1987
DESCRIPTION
The µPC4560 is a dual operational amplifier which features more improved slew rate and G.B. products than that of µPC4559 with unity gain frequency compensation. Also very low input noise and high output current drive capability make this device the optimum choice for audio applications and active filters.
FEATURES
- Internal frequency compensation
- Gain bandwidth products: 10 MHz TYP.
- Low noise: 6 µVp-p TYP.
- High output current
ORDERING INFORMATION
µPC4560C 8-pin plastic DIP (7.62 mm (300)) µPC4560G2 8-pin plastic SOP (5.72 mm (225)) EQUIVALENT CIRCUIT (1/2 Circuit) R 9 Q 5 Q 7 Q13 Q 11 R 5 R 7 R 8 OUT Q 2Q1 Q 8 R 3 Q 10 R 4R 2 C 1 II IN V Q 15 Q 4Q 3 C 2 D Q 14Q 12 R 6 PIN CONFIGURATION (Top View) PC4560C, 4560G2 V OUT 2 II2 IN2 II1 IN1 OUT 1 V 2+ – µ
Data Sheet G15805EJ4V0DS 2 µPC4560 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter Symbol Ratings Unit Voltage between V and V – Note 1 V - V –0.3 to +36 V Differential Input Voltage V ID ±30 V Input Voltage Note 2 V I V –0.3 to V +0.3 V Output Voltage Note 3 V O V –0.3 to V +0.3 V C Package Note 4 700 mW Power Dissipation Note 5 PT 440 mW Output Short Circuit Duration Note 6 0 sec Operating Ambient Temperature T A –20 to +80 °C Storage Temperature T stg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this s pecification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is –7.0 mW/°C when operat ing ambient temperature is higher than 25°C. 5. Thermal derating factor is –4.4 mW/°C when operat ing ambient temperature is higher than 25°C. 6. Must not short to GND, V , V , and other Voltage source. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V ± ±4 ±16 V
Data Sheet G15805EJ4V0DS 3 µPC4560 ELECTRICAL CHARACTERISTICS (T A = 25°C, V± = ±15 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage V IO R S ≤ 10 Ω ±0.5 ±6.0 mV Input Offset Current Note I IO ±5 ±200 nA Input Bias Current Note I B 60 500 nA Large Signal Voltage Gain A V R L ≥ 2 kΩ , VO = ±10 V 20,000 180,000 Power Consumption P d I O = 0 A 120 170 mW Common Mode Rejection Ratio CMR R S ≤ 10 kΩ 70 100 dB Source Variation Rejection Ratio SVR R S ≤ 10 kΩ 10 150 µV/V R L ≥ 2 kΩ ±12 ±14 V Output Voltage Swing Vom IO = ±25 mA ±10 ±13 V Common Mode Input Voltage Range V ICM ±12 ±14 V Slew Rate SR A V = 1 2.8 V/ µs Input Equivalent Noise Voltage V n R S = 1 kΩ, f = 1 Hz to 1 kHz (Figure1) 6 µVp-p Channel Separation f = 1 kHz (Figure2) 105 dB Note Input bias currents flow out from IC, because each currents are base current of PNP-transistor on input stage.
Data Sheet G15805EJ4V0DS 4 µPC4560 MEASUREMENT CIRCUIT Figure1 Noise Measurement Circuit 50 Ω 1 kΩ −15 V 1 kΩ 100 kΩ +15 V VO Vn = VO 2000 Figure2 Channel Separation Measurement Circuit 50 kΩ 50 Ω VO2 VO1 Channel separation = 20 log ( )1 1000 VO2 VO1 10 kΩ 10 kΩ
Data Sheet G15805EJ4V0DS 5 µPC4560 TYPICAL PERFORMANCE CHARACTERISTICS (T A = 25°C, TYP.) 100 1 k 10 k 100 k 1 M LARGE SIGNAL FREQUENCY RESPONSE Vom - Output Voltage Swing - Vp-p f - Frequency - Hz = 15 VV +_ _+ 100 INPUT BIAS CURRENT IB - Input Bias Current - nA TA - Operating Ambient Temperature - ˚C = 15 VV +_ _+ −20 0 40 60 80 100 120 01 10 1 k 100 k 1 M 10 M100 10 k OPEN LOOP FREQUENCY RESPONSE AV - Open Loop Voltage Gain - dB f- Frequency - Hz = 15 VV +_ _+800 600 400 200 0 2 04 06 08 0 1 0 0 POWER DISSIPATION PT - Total Power Dissipation -mW TA - Operating Ambient Temperature - ˚C PC4560Cµ PC4560G2µ SUPPLY CURRENT ICC - Supply Current - mA V - Supply Voltage - V 20_+10_+ 0 2 04 06 08 0 OUTPUT CURRENT LIMIT V= ±15 V ±20 ±15 ±10 VO - Output Voltage - V IO - Output Current - mA VO , IO SOURCE+ VO , IO SINK−
Data Sheet G15805EJ4V0DS 6 µPC4560 COMMON MODE INPUT VOLTAGE RANGE VICM - Common Mode Input Voltage Range -V V - Supply Voltage - V −10 −20 20+_10+_ VO - Output Voltage - V −10 VOLTAGE FOLLOWER PULSE RESPONSE 403020100 t - Time - sµ = 15 VV+_ _+ Av = 1 100 INPUT EQUIVALENT NOISE VOLTAGE DENSITY f - Frequency - Hz 1 k10 100 en - Input Equivalent Noise Voltage Density - nV/ Hz RS = 100 f = 1 HZ∆ Ω
Data Sheet G15805EJ4V0DS 7 µPC4560 APPLICATION CIRCUITS Head Phone Amp 10 kΩ 51 kΩ PC4560 100 kΩ 51 kΩ 10 kΩ 100 Ω +20 V 100 F 0.47 Fµ µ 4.7 Fµ −C4 10 Fµ µ 180 Ω HEAD PHONE 8 Ω 2.5 mW TYP. Maximum Power 2.2 kΩ 390 kΩ 36 kΩ PC456033 F 56 kΩ 1 kΩ −15 V 100 F 10 kΩ 100 F +15 V 33 F 0.0022 Fµ 0.01 Fµ µ µ µ µ 47 Fµ µ − − RIAA Amp 1.0 0.1 0.01 0.01 0.1 1.0 THD - Total Harmonic Distortion - % VO - Output Voltage - Vr.m.s. 0.001 TOTAL HARMONIC DISTORTIONC3 C4 R5R4 f = 1kHZ
Data Sheet G15805EJ4V0DS 8 µPC4560 PACKAGE DRAWINGS (Unit : mm) ITEM MILLIMETERSNOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. P8C-100-300B,C-2 N 0.25 P 0.9 MIN. R0 ∼15° A 10.16 MAX. B 1.27 MAX. F 1.4 MIN. G 3.2 ±0.3 J 5.08 MAX. K 7.62 (T.P.) C 2.54 (T.P.) D 0.50 ±0.10 H 0.51 MIN. I 4.31 MAX. L 6.4 M 0.25 +0.10 −0.05 2. ltem "K" to center of leads when formed parallel. M A RM PI J H G F DN C B 8-PIN PLASTIC DIP (7.62mm(300)) L K
Data Sheet G15805EJ4V0DS 9 µPC4560 ITEM B C I 8-PIN PLASTIC SOP (5.72 mm (225)) D E F G H J P MILLIMETERS 1.27 (T.P.) 0.78 MAX. 4.4 ±0.15 0.1 ±0.1 0.42 1.59 ±0.21 6.5 ±0.3 1.49 +0.08 −0.07 1.1 ±0.2 3°+7° −3° NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. A 5.2 +0.17 −0.20 K L M N 0.6 ±0.2 0.17 0.12 0.10 +0.08 −0.07 S8GM-50-225B-6 1 4 S M C detail of lead end A M SN F G B E D P H I J K L
Data Sheet G15805EJ4V0DS 10 µPC4560 RECOMMENDED SOLDERING CONDITIONS The µPC4560 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC4560G2: 8-pin plastic SOP (5.72 mm (225)) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 230°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 1 time. IR30-00-1 Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 1 time. VP15-00-1 Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC4560C: 8-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.
µPC4560 The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC El ectronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1