UPC4556 NEC | Alldatasheet
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. ! = c BIPOLAR ANALOG INTEGRATED CIRCUIT HIGH PERFORMANCE DUAL DECOMPENSATED OPERATIONAL AMPLIFIER DESCRIPTION FEATURES The uPC4556 is a dual operational amplifier which + Gain bandwidth products: 20 MHz (Av > 20 dB) features further advanced A.C. performance than + High slew rate: 5 V/us that of the uPC4558. Decompensation characteris- + Low input noise voltage 6 yVp-p tic guarantees 20MHz gain-bandwidth producthigher + _ Internal frequency compensation (Av = 20 dB) than 20 dB. Also featured are low input noise and high output drive capability making this device the optimum choice for audio application. EQUIVALENT CIRCUIT CONNECTION DIAGRAM (Top View) 1/2 CIRCUIT + UPC45S6C, 455662 vto yg tal Qs Tas a ouT1 Gi} [s]v* Keo EK fH 4A ho hn 17] OuT2 oH In iE Ie oly v-y Inez ® Ae} v-o
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PART NUMBER PACKAGE QUALITY GRADE HPC4556C 8 PIN PLASTIC DIP (300 mil) Standard uPC4556G2 8 PIN PLASTIC SOP (225 mil} Standard Please refer to “Quality grade on NEC Semiconductor Devices” (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. © DocumentNo, 1C-12858 Date Published March 1993 P Printed in Japan © NEC Corporation 1987
ABSOLUTE MAXIMUM RATINGS (Ta=25 °C) | ~~ | Package (Note 4) 700.77” mW Power Dissipation —— Pr rm es Note 1, Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -7.0 mV/°C when ambient temperature is higher than 25 °C. Note 5. Thermal derating factor is -4.4 mV/°C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS [Seoyvowwse Ped te Vd ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V+ = +15 V) [___caanacrenstic _[syaor [win [WW [wax [unt | Test Conomons | [inowt feet Votage ————~i|—ve | ane Paso [mw [eetoan [iu oveet Curent oie [te [ | 38 | 2200. | na | Input Bias Current (Note7) | le | | 180 | 500 | na | : Large Signal Voltage Gain. ——|_—Av “sia fal ef RLZ2KQ,VO=210V [common Mode Rejection Rao | wR [70 | 9 || #8 [meio [Supply vonage RoiectonRario | svn | | 20 | 150 [pW [RestoKa =i [oupurvorase swing | von | sia [aw || v [Rzaa —*d| Output Voltage Swing Vom 410 | 411.5 lo= 425 mA Common Mode input Voltage Range | Viom s12 | 14 | 7 —_ SlewRate | SR “|S” A.210(20dB) [Input Equivalent Noise Vonage [vs || 6 | | spp [Re= TAR Ye Tete TH ES Note 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.
TYPICAL APPLICATION CIRCUIT Noninverting Amplifier Re | Vo Rs 2 9-Re Vow |_| ° Ri = Re Ri Ra Inverting Amplifier Ra Rs, C are necessary 4 fs> Xe Re <¥ Re Re: Ro/Rs i C2 FeR-5 MHz t Rs
TYPICAL PERFORMANCE CHARACTERISTICS (Ta=25 °C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE [ty TT] oe i = 800 1 + ee ee 5 LE IN ELT ' oO 5 IN _ PCCOINT TE 2 5 & s 2 soon | L q 0 rN os = got ELINA Pt LPN gE LETTING é g B 200 i oO 20 . : e LLtt tt i g ib 1 ft 0 o 1 10 100 1k 10k100k1M10M 0 20 40 60 80 100 f Frequency - Hz Ta - Ambient Temperature - °C LARGE SIGNAL FREQUENCY RESPONSE OUTPUT CURRENT LIMIT o +20 ; a | | | ee eS : 7 ° WN € 4 s tL 100 1k 10k 100 k 1M i?) 20 40 60 80 f - Frequency ~ Hz Output Current - mA INPUT BIAS CURRENT SUPPLY CURRENT < 200 xt NN] € Pp 1 3 —— i=4 —— . | 5 160 —__ 5 é i | | | : g 120 a 2 2 80 3 ee 7 - * LEE | tt ft 20 0 2 40 60 8 0 . #10 #20 Ta - Ambient Temperature ~ °C V* - Supply Voltage - V
i NEC uPC4556 COMMON MODE INPUT VOLTAGE RANGE VOLTAGE FOLLOWER PULSE RESPONSE f @ 2 1 j
320 A °
Fi a || B10 ra | > 8
5 TH :
£0 iq So ° = | | 2 > 3 “ oo g 10 | 5 5 a 8 -20 Dy -10 10 #10 £20 0 10 20 #30 40 s V* - Supply Voltage - V Time - ys INPUT EQUIVALENT NOISE VOLTAGE DENSITY 1000 ole 3E 300 BS ee Sy £2100 gs °~ 40 0 10 100 1k f ~ Frequency — Hz
8PIN PLASTIC DIP (300 mil) 8 5 yee A K Pp o lz | L F il Cc B M O~15° D P8C-100-300B,C_ NOTES MILLIMETERS INCHES 1) Each lead centerline is located within 0.25 - Item to center of leads when former parallel. | | 0.50*°"° 0.020888 iF | 1.4 MIN 0.055 MIN VY
8PIN PLASTIC SOP (225 mil) 8 5 Wood HWY HW Pi fy fi to S in WHY y By fl O OF Co 1 4 ee , nae ae 7 eee L uw 8 oN | o [elm @) S8GM-50-225B-2 NOTE ITem| MILLIMETERS | INCHES | Each lead centerline is located within 0.12 maximum material condition. | 8 | 0.78 MAX. F 1.8 MAX. 0.071MAX. a a es er bce | ems
NEC uPC4556 ; RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IE1-1207). [uPC4556G2} Recommended Soldering method Soldering conditions condition symbol Peak package's surface temperature : 230 °C or below, Infrared ray reflow Reflow time : 30 seconds or below (210 °C or higher), 1R30-00-1 Number of reflow process : 1, Exposure limit* : None Peak package's surface temperature : 215 °C or below, vPS Reflow time : 40 seconds or below (200 °C or higher), VP15-00-1 Number of reflow process : 1, Exposure limit* : None Solder temperature: 260 °C or below, Wave soldering Flow time: 10 seconds or below, WS15-00-1 Number of flow process: 1, Exposure limit*: None Terminal temperature : 300 °C or below, Partial heating method | Flow time : 10 seconds or below, Exposure limit* : None * Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method”. TYPES OF THROUGH HOLE DEVICE [uPC4556C] Recommended Soldering method Soldering conditions condition symbol Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below
[MEMO]
[MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance Application examples recommended by NEC Corporation Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6 eee