UPC4556 RENESAS | Alldatasheet
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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
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BIPOLAR ANALOG INTEGRATED CIRCUIT µPC4556 HIGH PERFORMANCE DUAL DECOMPENSATED OPERATIONAL AMPLIFIER DATA SHEET Document No. G10240EJ7V0DS00 (7th edition) Date Published March 2004 N CP(K) Printed in Japan The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. 1987
DESCRIPTION
The µPC4556 is a dual operational amplifier which features further advanced A.C. performance than that of the µPC4558. Decompensation characteristic guarantees 20MHz gain-bandwidth product higher than 20 dB. Also featured are low input noise and high output drive capability making this device the optimum choice for audio application.
FEATURES
- Gain bandwidth products: 20 MHz (A v ≥ 20 dB)
- High slew rate: 5 V/ µs
- Low input noise voltage: 6 µVp-p
- Internal frequency compensation (A v ≥ 20 dB)
ORDERING INFORMATION
µPC4556C 8-pin plastic DIP (7.62 mm (300)) µPC4556G2 8-pin plastic SOP (5.72 mm (225)) EQUIVALENT CIRCUIT II IN R3 R4C1 Q14 Q11 Q12 Q10 Q13 Q15R6 D OUT PIN CONFIGURATION (Top View) PC4556C, 4556G2 V OUT2 II2 IN2 II1 IN1 OUT1 V µ
Data Sheet G10240EJ7V0DS 2 µPC4556 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter Symbol Ratings Unit Voltage between V+ and V– Note 1 V – V –0.3 to +36 V Differential Input Voltage VID ±30 V Input VoltageNote 2 VI V –0.3 to V+ +0.3 V Output VoltageNote 3 VO V –0.3 to V+ +0.3 V C Package Note 4 700 mW Power Dissipation PT 440 mW Output Short Circuit DurationNote 6 Indefinite sec Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the tr ansition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is –7.0 mV/°C when operating ambient temperature is higher than 25°C. 5. Thermal derating factor is –4.4 mV/°C when operating ambient temperature is higher than 25°C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V± ±4 ±16 V
Data Sheet G10240EJ7V0DS 3 µPC4556 ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage VIO R S ≤ 10 kΩ ±0.5 ±6 mV Input Offset Current Note 7 IIO ±5 ±200 nA Input Bias Current Note 7 IB 180 500 nA Large Signal Voltage Gain AV R L ≥ 2 kΩ , VO = ±10 V 20000 100000 Power Consumption Pd I O = 0 A 90 170 mW Common Mode Rejection Ratio CMR R S ≤ 10 kΩ 70 90 dB Supply Voltage Rejection Ratio SVR R S ≤ 10 kΩ 30 150 µV/V RL ≥ 2 kΩ ±12 ±14 V Output Voltage Swing Vom IO = ±25 mA ±10 ±11.5 V Common Mode Input Voltage Range V ICM ±12 ±14 V Slew Rate SR A V ≥ 10 (20 dB) 5 V/ µs Input Equivalent Noise Voltage Vn R S = 1 kΩ, f = 1 Hz to 1 kHz 6 µVp-p Channel Separation f = 1 kHz 105 dB Notes 7. Input bias currents flow out from IC. Because each cu rrents are base current of PNP-transistor on input stage.
Data Sheet G10240EJ7V0DS 4 µPC4556 TYPICAL APPLICATION CIRCUIT VO R2R1 VIN R3 9 R2⋅ ≥ R1 = R2 VIN C VO R4, C are necessary when R2 < 10 R1⋅ R2/R4 ⋅2 R4 5 MHz⋅π⋅C ≥ R4 R2≤ 1 Noninverting Amplifier Inverting Amplifier
Data Sheet G10240EJ7V0DS 5 µPC4556 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) TA - Operating Ambient Temperature - °C POWER DISSIPATION PT - Total Power Dissipation - mW 800 600 400 200 20 40 60 80 100
227 C/W°
143 C/W°
µ PC4556Cµ 1 10 100 1 k 10 k 100 k 1 M 10 M 120 100 f - Frequency - Hz OPEN LOOP FREQUENCY RESPONSE A V - Open Loop Voltage Gain - dB V= ±15 V 02 0 4 0 6 0 8 0 INPUT OFFSET VOLTAGE V IO - Input Offset Voltage - mV −20 V = ±15 V The characteristic of the optional sample. (Quantity:five) TA - Operating Ambient Temperature - C° −2 00 2 04 06 08 0 200 160 120 INPUT BIAS CURRENT IB - Input Bias Current - nA V = ±15 V TA - Operating Ambient Temperature - C° 100 1 k 10 k 100 k 1 M f - Frequency - Hz LARGE SIGNAL FREQUENCY RESPONSE V om - Output Voltage Swing - V p-p V= ±15 V 0 2 04 06 08 0 OUTPUT CURRENT LIMIT V= ±15 V VO IO SOURCE VO IO SINK ±20 ±15 ±10 VO - Output Voltage - V IO - Output Current - mA
Data Sheet G10240EJ7V0DS 6 µPC4556 OUTPUT VOLTAGE SWING V - Supply Voltage - V± ±10 ±20 −10 −20 VICM - Common Mode Input Voltage Range - V SUPPLY CURRENT V - Supply Voltage - V ICC - Supply Current - mA ±10 ±20 1 10 100 1 k 1000 300 100 Voltage Density en - Input Equivalent Noise INPUT EQUIVALENT NOISE VOLTAGE DENSITY f - Frequency - Hz - nV/ Hz 0 1 02 03 04 0 V O - Output Voltage - V VOLTAGE FOLLOWER PULSE RESPONSE t - Time - sµ −10 V= ±15 V
Data Sheet G10240EJ7V0DS 7 µPC4556 PACKAGE DRAWINGS (Unit : mm) ITEM MILLIMETERSNOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. P8C-100-300B,C-2 N 0.25 P 0.9 MIN. R0 ∼15° A 10.16 MAX. B 1.27 MAX. F 1.4 MIN. G 3.2± 0.3 J 5.08 MAX. K 7.62 (T.P.) C 2.54 (T.P.) D 0.50± 0.10 H 0.51 MIN. I 4.31 MAX. L 6.4 M 0.25 +0.10 −0.05 2. ltem "K" to center of leads when formed parallel. M A RM PI J H G F DN C B 8-PIN PLASTIC DIP (7.62mm(300)) L K
Data Sheet G10240EJ7V0DS 8 µPC4556 ITEM B C I 8-PIN PLASTIC SOP (5.72 mm (225)) D E F G H J P MILLIMETERS 1.27 (T.P.) 0.78 MAX. 4.4±0.15 0.1±0.1 0.42 1.59±0.21 6.5±0.3 1.49 +0.08 −0.07 1.1±0.2 3°+7° −3° NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. A 5.2 +0.17 −0.20 K L M N 0.6±0.2 0.17 0.12 0.10 +0.08 −0.07 S8GM-50-225B-6 1 4 S M C detail of lead end A M S N F G B E D P H I J K L
Data Sheet G10240EJ7V0DS 9 µPC4556 RECOMMENDED SOLDERING CONDITIONS The µPC4556 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC4556G2: 8-pin plastic SOP (5.72 mm (225)) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 235° C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 3 time. IR35-00-3 Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 3 time. VP15-00-3 Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC4556C: 8-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to l eads, and make sure that the package body does not get jet soldered.
µPC4556 The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard":Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific":Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or forNEC Electronics (as defined above). M8E 02. 11-1