UPC4092 RENESAS | Alldatasheet
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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. BIPOLAR ANALOG INTEGRATED CIRCUIT µPC4092 J-FET INPUT LOW-OFFSET DUAL OPERATIONAL AMPLIFIER Document No. G13905EJ2V0DS00 (2nd edition) Date Published March 2004 N CP(K) Printed in Japan DATA SHEET The mark shows major revised points. c The µPC4092 dual operational amplifier offers high input impedance, low offset voltage, high slew rate, and stable AC operating characteristics. NEC's unique high-speed PNP transistor (fT = 300 MHz) in the output stage solves the oscillation problem of current sinking with a large capacitive load. Zener-zap resistor trimming in the input stage produces excellent offset voltage and temperature drift characteristics.
FEATURES
- Stable operation with 10000 pF capacitive load Low input offset voltage ±3 mV (MAX.) ±7 µV/°C (TYP.) temperature drift Very low input bias and offset currents Low noise : en = 19 nV/ √Hz (TYP.) Output short circuit protection High input impedance ... J-FET Input Stage Internal frequency compensation High slew rate: 15 V/µs (TYP.)
ORDERING INFORMATION
µPC4092C 8-pin plastic DIP (7.62 mm (300)) µPC4092G2 8-pin plastic SOP (5.72 mm (225)) EQUIVALENT CIRCUIT (1/2 Circuit) PIN CONFIGURATION (Top View) II IN Q 1 Q 2 Q 4 Q 5 Q 8 D 1 C 1 Q 10 V V − OUT Q 9 Q 7 Q 6 Q 3 TRIMMED HIGH SPEED PNP PC4092C, 4092G2 V OUT 2 II2 IN2 II1 IN1 OUT 1 V µ
Data Sheet G13905EJ2V0DS 2 µPC4092 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) Parameter Symbol Ratings Unit Voltage between V and V –Note 1 V – V –0.3 to +36 V Differential Input Voltage V ID ±30 V Input Voltage Note 2 VI V –0.3 to V +0.3 V Output Voltage Note 3 VO V –0.3 to V +0.3 V C Package Note 4 350 mW Power Dissipation Note 5 PT 440 mW Output Short Circuit Duration Note 6 Indefinite sec Operating Ambient Temperature T A –20 to +80 °C Storage Temperature T stg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allow ed to input without damage or destruc tion. Even during the transition period of supply voltage, power on/off etc., this s pecification should be kep t. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is t he voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even dur ing the transition period of supply voltage, power on/off etc., this specification should be kept. T he output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is –5.0 mV/°C when oper ating ambient temperature is higher than 55 °C. 5. Thermal derating factor is –4.4 mV/°C when oper ating ambient temperature is higher than 25 °C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V ± ±5 ±16 V Output Current I O ±10 mA Capacitive Load (AV = +1, Rf = 0 Ω) C L 10000 pF
Data Sheet G13905EJ2V0DS 3 µPC4092 ELECTRICAL CHARACTERISTICS (TA = 25 °C, V± = ±15 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage V IO R S ≤ 50 Ω ±1 ±3 mV Input Offset Current Note 7 IIO ±25 ±100 pA Input Bias Current Note 7 IB 50 200 pA Large Signal Voltage Gain A V R L ≥ 2 kΩ , VO = ±10 V 25000 200000 Supply Current Note 8 ICC I O = 0 A 5 6.8 mA Common Mode Rejection Ratio CMR 70 100 dB Supply Voltage Rejection Ratio SVR 70 100 dB RL ≥ 10 kΩ ±12 +14.0 –13.3 V Output Voltage Swing Vom RL ≥ 2 kΩ ±10 +13.5 –12.8 V Common Model Input Voltage Range V ICM ±11 +14 –12 V Slew Rate SR A V = 1 15 V/ µs Unity Gain Frequency f unity 4 MHz Input Equivalent Noise Voltage Density e n R S = 100 Ω, f = 1 kHz 19 nV/ √Hz Channel Separation 120 dB Input Offset Voltage V IO R S ≤ 50 Ω, TA = –20 to +70 °C ±5 mV Average VIO Temperature Drift ∆VIO/∆T T A = –20 to +70 °C ±7 µV/°C Input Offset Current Note 7 IIO T A = –20 to +70 °C ±2 nA Input Bias Current Note 7 IB T A = –20 to +70 °C 7 nA Notes 7. Input bias currents flow into IC. Because each cu rrents are gate leak current of P-channel J-FET on input stage. And that are tem perature sensitive. Short time measur ing method is recommendable to maintain the junction temperature close to the operating ambient temperature. 8. This current flows irrespecti ve of the existence of use.
Data Sheet G13905EJ2V0DS 4 µPC4092 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 °C, TYP.) 600 500 400 300 200 100 0.01 0.1 1.0 100 100 120 100 1 k 10 k ±10 ±20100 k 1 M 10 M −40 −20 0 20 TA - Operating Ambient Temperature - °C INPUT OFFSET VOLTAGE INPUT BIAS CURRENT TA - Operating Ambient Temperature - °C40 60 80 −2 00 2 04 06 08 0 100 10 k 1 M1 k10 100 k 10 M40 60 80 100 RL = 10 kΩ RL = 10 kΩ PC4092G2 PC4092C TA - Operating Ambient Temperature - °C f - Frequency - Hz V ± - Supply Voltage - V LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING f - Frequency - Hz POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE PT - Total Power Dissipation - mWVom - Output Voltage Swing - Vp-p VIO - Input Offset Voltage - mV AV - Open Loop Voltage Gain - dBVom - Output Voltage Swing - Vp-p IB - Input Bias Current - nA V± = ±15 V RL = 2 kΩ V± = ±15 V V± = ±10 V V± = ±5 V µ µ 200 °C/W 227 °C/W each 5 samples data
Data Sheet G13905EJ2V0DS 5 µPC4092 VO - Output Voltage - V VOLTAGE FOLLOWER PULSE RESPONSE 2 (RL = 2 kΩ, CL = 10000 pF) t - Time - sµ −10 20 40 60 VO - Output Voltage - V VOLTAGE FOLLOWER PULSE RESPONSE 1 (RL = 2 kΩ, CL = 100 pF) t - Time - sµ −10 246 Voltage Density - nV/ Hz en - Input Equivalent Noise INPUT EQUIVALENT NOISE VOLTAGE DENSITY f - Frequency - Hz 100 1k 10k 100k ICC - Supply Current - mA SUPPLY CURRENT V± - Supply Voltage - V ±10 ±15 ±20 VO− - Output Voltage - V OUTPUT SINK CURRENT LIMITOUTPUT SOURCE CURRENT LIMIT IO SINK - Output Sink Current - mAIO SOURCE - Output Source Current - mA −10 −15 0 10 20 30 VO+ - Output Voltage - V 01 0 2 0 3 0 +10 +15 V± = ±15 V RS = 100 Ω TA = 70 °C 25 °C −20 °C 25 °C −20 °C TA = 70 °C
Data Sheet G13905EJ2V0DS 6 µPC4092 PACKAGE DRAWINGS ITEM MILLIMETERSNOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. P8C-100-300B,C-2 N 0.25 P 0.9 MIN. R0 ∼15° A 10.16 MAX. B 1.27 MAX. F 1.4 MIN. G 3.2 ±0.3 J 5.08 MAX. K 7.62 (T.P.) C 2.54 (T.P.) D 0.50 ±0.10 H 0.51 MIN. I 4.31 MAX. L 6.4 M 0.25 +0.10 −0.05 2. ltem "K" to center of leads when formed parallel. M A RM PI J H G F DN C B 8-PIN PLASTIC DIP (7.62mm(300)) L K
Data Sheet G13905EJ2V0DS 7 µPC4092 ITEM B C I 8-PIN PLASTIC SOP (5.72 mm (225)) D E F G H J P MILLIMETERS 1.27 (T.P.) 0.78 MAX. 4.4 ±0.15 0.1 ±0.1 0.42 1.59 ±0.21 6.5 ±0.3 1.49 +0.08 −0.07 1.1 ±0.2 3°+7° −3° NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. A 5.2 +0.17 −0.20 K L M N 0.6 ±0.2 0.17 0.12 0.10 +0.08 −0.07 S8GM-50-225B-6 1 4 S M C detail of lead end A M SN F G B E D P H I J K L
Data Sheet G13905EJ2V0DS 8 µPC4092 RECOMMENDED SOLDERING CONDITIONS The µPC4092 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC4092G2: 8-pin plastic SOP (5.72 mm (225)) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 230 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 1 time. IR30-00-1 Vapor Phase Soldering Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 1 time. VP15-00-1 Wave Soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300 °C or below, Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC4092C: 8-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering (only to leads) Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300 °C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be app lied only to leads, and make sure that the package body does not get jet soldered.
Data Sheet G13905EJ2V0DS 9 µPC4092 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E SEMICONDUCTOR DEVICE MOUNT MANUAL http ://www.necel.com/pkg/en/mount/index.html NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM IEI-1212 (STANDARD LINEAR IC)
µPC4092 The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1