UPC4082C

UPC4082 NEC | Alldatasheet

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J-FET INPUT DUAL OPERATIONAL AMPLIFIER eee DESCRIPTION FEATURES The uPC4082 is a dual operational amplifier + Very low input bias and offset currents incorporating well matched ion implant P-channel + High input impedance --- J-FET Input Stage J-FET on the same chip with standard bipolar tran- + High slew rate: 13 V/us (TYP.) sistors. The key features of this op amp is very low + Internal frequency compensation input bias current and high slew rate for ten times + Output short circuit protection faster than conventional general purpose op amps. By these features the 4PC4082 is excellent choice for wide variety of applications including integrator, active filter, pulse amp etc. EQUIVALENT CIRCUIT (1/2 Circuit) CONNECTION DIAGRAM (Top View) ve MPC4082C, 408262 Ra out: fe}v+ ro — Qe In OUT: wosfa aly Qe She Qu AN Ino —f Oro Ins he ost Ro Say | ors | Qu: vf Ine L Ko ° (| 0 OUT Qs, Qs Qn H - —— Rn fo SPSR, ERs 3R De LL tt 1 ov-

ORDERING INFORMATION

8 PIN PLASTIC DIP (300 mil) Standard

8 PIN PLASTIC SOP (225 mil) Standard

Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-1975A - (0.D. No. 1C-5824C) Date Published April 1993P Printed in Japan

ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) Input Voltage (Note 2) vi V--0.3 to V*+0.3 v Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -5.0 mV/'C when ambient temperature is higher than 55 °C. Note 5. Thermal derating factor is -4.4 mV/'C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Notes 4 and 5. RECOMMENDED OPERATING CONDITIONS [___eianacrensne [sot [ane [ve [ae nr] [Sieyvorge es Pe |

____ NEC ee HPC4082 ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V* = +15V) [aamcrenene [Samer [wm [ve [wae [un conomions [roe Omevonwue | ve [| sso [seo | ww [momo [nou ona Curenk wow te [| ss [wo fm | | [Sieevcwren | mea ae | ma [ws on ar Common Mode Rejection Ratio | cwn | 70 | 76 || #® | Sd Eid all al EA Range 127 [iy esinFegsney few fe | Density aaa a a el [row orservoe | we [||| eto a | Average Vio Temperature Drift Te =-20 to +70 °C a ee Low tis cures Woes] | | | | oa |r t00.70e | Note 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the ambient temperature.

TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 °C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 600 120 ELLE Ly Yop FIN vt eai5V g aoe fT] gs’) INCL 4 a oO pe EREREEER Pe NY B x00 HP ASS © 6 bo LECCE SS 8 \\ Boll LLL LLL] & x N eg ee 4 | | IN « a 2, N 0 20 40 60 80 100 1 10 100 1k 10k 100k 1M 10M Te- Ambient Temperature ~ °C #~ Frequency ~ Hz LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING eg a A 40 > Vis e15V > Ru = 10kQ Lu Ru = 10kQ iy z a z 2% 3 0 3 ° rs ee | ° 8 & g vt =s10V £99 z | \\ 2 g% g Z| BN & k N a 100 1k 10k 100 k 1M 10M #10 #20 f Frequency - Hz V# - Supply Voltage ~ V OUTPUT VOLTAGE SWING VOLTAGE FOLLOWER PULSE RESPONSE 30 1 7 ve g Ri Ci = 100 pF 2 =218V AT s / output| Wve si8v g So & > 6 1 > o 5 LA i ee 1 y 5 § £ -5 an LL [| [| TT) 100 300 1k 3k 10k i) 1 2 3 4 Ri - Load Resistance ~ Q Time - 1s

INPUT BIAS CURRENT INPUT EQUIVALENT NOISE VOLTAGE DENSITY 100 10* Ma Vt=215V t Ves s18V Sle Rs = 1002 2 10 220 € BS 5 ee 2 ay g 10 y 32 10 5 30 . -& 20 oO 20 40 60 80 10 100 1k 10k 100k Ta— Ambient Temperature ~ °C f— Frequency ~ Hz SUPPLY CURRENT 5.0 E 40 2 30 2 20 g 10 oO +5 210 215 £20 V* — Supply Voltage - V

8PIN PLASTIC DIP (300 mil) ~ 8 5 jr 4| A K P o lz | F Lh cB M 0~15° D P8C-100-300B,C NOTES ITEM MILLIMETERS. INCHES 1) Each lead centerline is located within 0.25 maximum material condition. 8 1.27 MAX. 2) Item “K” to center of leads when formed t— me parallel. D 0.50*919 0.020 *8:888 0.51 MIN. 0.020 MIN 5.08 MAX. 0.200 MAX. 6.4 0.252 jm | o25788t | o.o107888 | | P| 0.9 MIN. 0.035 MIN V

8 PIN PLASTIC SOP (225 mil)

SS Os, ue Woe e OO Oo Oo 1 4 rn 4 oO ETT 4 f\\ 5 te - w NI D S8GM-50-225B-2 NOTE ITEM] MILLIMETERS INCHES Each lead centerline is located within 0.12 ae ——— ee [vo | 0.40xg39 0.01619.004 fe | 01201 | 0,004+0.004 1.8 MAX. | 0.071MAXx | 6.5403 0.256#0.012 Jf ooaa 0.043 L | 0.6+0.2 0.02479 808 M 0.12 0.005 0.15 0.006

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). [uPC4082G2] Soldering method Soldering conditions Recommended condition symbol Infrared ray reflow Peak package's surface temperature: 230 °C or below, 1R30-00-1 Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 1, Exposure limit *: None vPs Peak package's surface temperature: 215 ‘C or below, VP15-00-1 Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 1, Exposure limit *: None Wave soldering Solder temperature: 260 °C or below, WS15-00-1 Flow time: 10 seconds or below, Number of flow process: 1, Exposure limit *: None Partial heating Terminal temperature: 300 °C or below, fe) method Flow time: 10 seconds or below, Exposure limit ": None * Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method”. TYPES OF THROUGH HOLE DEVICE [uPC4082C1 R ded conditi Soldering method Soldering conditions ecommencied coneition symbol Wave soldering Solder temperature: 260 °C or below, ° Flow time: 10 seconds or below

— NEC OBA MEMO}

eT SSSSSSSSSSSSSSSSSSSSSSSSFSFSFSFFFFSeSsSSSsssFeFSSSSSSFFSSeFsFFeeFeFeFeFeeFeeSSSSeeeeeeee MOE No part of this document may be copied or reproduced in any form or by any means without the prior written | consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this i document. | NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual | property rights of third parties by or arising from use of a device described herein or any other liability arising ' from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. | The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear ' reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact : our sales people in advance. Application examples recommended by NEC Corporation Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, ete. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6