UPC4061

UPC4061 NEC | Alldatasheet

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J-FET INPUT LOW-POWER OPERATIONAL AMPLIFIER DESCRIPTION FEATURES The yPC4061 is a J-FET input low-power opera- © Low supply current: 220 yA (TYP.) tional amplifier featuring low supply voltage operation © Very low input bias and offset currents from +2 V. Supply current is ten times smaller than © Offset voltage null capability uPC4081 type J-FET input op-amp. With very low input © High input impedance...J-FET Input Stage bias current characteristics, the uPC4061 is an excellent © Low supply voltage operation choice for hand-held measurement equipment and other © Output short circuit protection low-power application circuits. © Internal frequency compensation CONNECTION DIAGRAM EQUIVALENT CIRCUIT (Top View) re ~ Z Rr z Ra = Ro 7) HPC4061C, 4061G2 ony —— 9 ‘you OFFSET a drs NULL [s]Nc Che Ore ofl, SEES a AP Womb 'g, Qa |” 10) Rr cal | L\\ la \\ Re wh OUTPUT ‘o - ~_F Gra Ore — Qs, Os Q7 - OFFSET @ 8) Os oh | va ISI Nuut OFFSET (6) a NULL ZR = Ro OFFSET CS a) NULL

ORDERING INFORMATION

PART NUMBER PACKAGE QUALITY GRADE HPC4061C 8 PIN PLASTIC DIP (300 mil) uPC4061G2 8 PIN PLASTIC SOP (225 mil) Please refer to “Quality grade on NEC Semiconductor Devices” (Document number 1El-1209) published by NEC Corporation to know the specifications of quality grade on the devices and its recommended applications. SSeS Document No. IC-1990A (0.D. No, IC-6678B) Date Published March 1993 M Printed in Japan © NEC Corporation 1987

ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) PARAMETER SYMBOL uPC4061 UNIT Voltage between V* and V- (Note 1) 0.3 to +36 Input Voltage (Note 2) V-~0.3 to V' 40.3 Power Dissipation ockege Pr $0 nw Operating Temperature Range 2010 +80 Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -5.0 mV / °C when ambient temperature is higher than 55 °C. Note 5. Thermal derating factor is -4.4 mV / °C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Capacitive Load (Av = +1) a OFFSET VOLTAGE NULL CIRCUIT °. 2 8 __., o—~ VR | fe) Lo

ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V* = +15 V) Input Offset Voltage | ve [ [sz | +10 | ow [asssoo Input Offset Current Note 7) | wo | | a6 | aso | pa fT [int iascuron Mower? |__| | 0 | too | pa | SS Large Signal Voltage Gain | A | 3] 9 |_| vimv | as oma, vo=ni0v Supply Current [tcc [| | a0 | 250 | ya [eon Common Mode Rejection ratio | cwr | 70 | oo | | a | Supply Votage Rejection Ratio | sva | 7 | 90 | | a | Output Voltage Swing pve jan [ae] |v | Bre to ke +15 Common Model Input Voltage Range | Vicm +12 -13 v [Sewanee | i [ee Unity Gain Frequency [tow [oft ff me PO Input Equivalont Noise Votage Densiy |e» || a0 | [aviv] fs = 100.0, #1 te input Offeet Voltage [ve [os | mv [poes00, th =-20 00 70% Average Vio Temperature brit [avo/at| | +10 |__| wwrc | Te=-20 to 470°C Input Offset Current Now | to ||| #2 | nA | Te=-2010470°C Input Bias Current Note7) | te PT | 3s | na | t1=-2010 +700 Note 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the ambient temperature.

TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 °C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 600 120 SE Ce 2 of LE 8 so Lz 10 ka eee SC 8 ol TST 5 fe Pot TN | ET 8 300 NS & EEEEEPS CON Foltt ttt tS fl Sa BTREEEPEEPR] = CENT 2 gl EP 8 4

6 EEEEEEEEEH ect ttt IN |

Lt Ti Tt ty tt | 0 0 20 40 60 80 100 1 10 100 1k 10k 100k 1M 10M Ta - Ambient Temperature - °C f - Frequency ~ Hz LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING id “0 3 —-. 3 . n wey Ru= 100 nl ao} || 2 2 30 by ce a | 3 Fa Viz s10V & 8 3% 4 = 4 Fag a 5 fe} va 6 10 \\7 § § 3 3 %00 ik 10k 100k 1M 10M 0 10 £20 f — Frequency - Hz V* - Supply Voltage - V OUTPUT SOURCE CURRENT LIMIT OUTPUT SINK CURRENT LIMIT +15, 7 ~15 > == VAs415V > ae VA=s15V 3 \\ 5 é 20°C é 25 c 2 te=70°ch \\25°C 2 Ta= 70°C | -20+e 3 3 a Zz ' 1 0 5 10 15 0 5 10 15 lo source - Source Current - mA, lo sink — Sink Current — mA

VOLTAGE FOLLOWER PULSE RESPONSE. INPUT EQUIVALENT NOISE VOLTAGE DENSITY > | | | Ava +t Vi = 415V _ = a 2 a ° : Ba 30 ry PoOCP Eee fe Fe 0 0 5 10 15 20 10 100 ik 10k 100 k Time - ys { - Frequency - Hz INPUT BIAS CURRENT SUPPLY CURRENT 100 250 a) s 5 = 8 g 150 ba L & 100 s

7 Bea °

0.01 _ | ae -20 it) 20 40 60 80 0 +5 +10 #15 +20 Ts — Ambient Temperature - °C \\V* - Supply Voltage - V

8PIN PLASTIC DIP (300 mil) 8 5 1 4 A K _ P | > VOY | For ah Ww cB M ons" D P@C-100-2008,c NOTES | rrem | mitumeters | INCHES 1) Each lead centerline is located within 0.25 maximum material condition. [ 3 | 1.27 MAX. item “K” to center of leads when forme 20.10 73.908 | amin [0.0855 in| [a2 | onsen [Tsar max [0170 wax | [ee oz ~ [w [asia | oorortat— pw] oz | oo i WV

8 PIN PLASTIC SOP (225 mil)

tT] fi Cy) FI S ion eee B CL} Ch O O 1 4 A : H © J a fo | (ono 4 FR w : 8 OLN ofelm @) S8GM-50-225B-2 NOTE ITEM| MILLIMETERS INCHES Each lead centerline is located within 0.12 — maximum material condition. | 8 | 0.78 MAX. 1 4.4 0.173 0.15°332 0.006°9.988 0,620.2 0.12 0.005 0.15 0.006

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). [ uPC4061G2 ] Soldering - ee Recommended Soldering conditions condition symboi Infrared ray reflow Peak package's surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), 1R30-00-1 Number of reflow process: 1, Exposure limit*: None VPS Peak package's surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), VP15-00-1 Number of reflow process: 1, Exposure limit*: None Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below WS 15-00-1 Number of flow process: 1, Exposure limit*: None Partial heating method | Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for “Partial heating method.” TYPES OF THROUGH HOLE DEVICE [ uPC4061C ] Soldering A 7 Recommended Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below

[MEMO]

[MEMO] i No part of this document may be copied or reproduced in any from or by any means without the prior written | consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this \\ document. | NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual | property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, ! copyrights or other intellectual property rights of NEC Corporation or others. | The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear | reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use “Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. ! Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6