UPC3237TK RENESAS | Alldatasheet
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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
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DESCRIPTION
The μPC3237TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for the mobile digital TV etc. This device exhibits low noise figure and high power gain characteristics. This package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.
FEATURES
- Supply voltage : VCC = 2.4 to 3.3 V (2.8 V TYP.) Low current consumption : I CC = 5 mA TYP. @ VCC = 2.8 V Low Noise : NF = 1.4 dB TYP. @ f = 470 MHz : NF = 1.5 dB TYP. @ f = 770 MHz Power gain : G P = 15.3 dB TYP. @ f = 470 MHz : G P = 13.5 dB TYP. @ f = 770 MHz High-density surface mounting : 6- pin lead-less minimold package (1.5 × 1.1 × 0.55 mm)
APPLICATIONS
Low noise amplifier for the mobile digital TV etc.
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form μPC3237TK-E2 μPC3237TK-E2-A 6-pin lead-less minimold (1511 PKG) (Pb-Free) 6N • Embossed tape 8 mm wide
- Pin 1, 6 face the perforation side of the tape
- Qty 5 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office Part number for sample order: μPC3237TK DATA SHEET Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. BIPOLAR ANALOG INTEGRATED CIRCUIT μPC3237TK LOW NOISE WIDE BAND SILICON GERMANIUM MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS Document No. PU10675EJ01V0DS (1st edition) Date Published July 2007 NS Printed in Japan
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name 1 NC
2 GND
3 INPUT
4 V CC
5 GND
(Top View) (Bottom View) (Top View)
6 OUTPUT
Parameter Symbol Conditions Ratings Unit Supply Voltage VCC T A = +25°C 3.6 V Circuit Current ICC T A = +25°C 10 mA Power Dissipation PD T A = +85°C Note 203 mW Operating Ambient Temperature T A −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Power Pin T A = +25°C +8 dBm Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 2.4 2.8 3.3 V Operating Ambient Temperature T A −40 +25 +85 °C Data Sheet PU10675EJ01V0DS 2 μPC3237TK
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 2.8 V, ZS = ZL = 50 Ω, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No input signal 3.5 5 7 mA Power Gain 1 GP1 f = 470 MHz, P in = −30 dBm 13.0 15.3 17.5 dB Power Gain 2 GP2 f = 770 MHz, P in = −30 dBm 11.0 13.5 16.0 dB Noise Figure 1 NF1 f = 470 MHz − 1.4 1.9 dB Noise Figure 2 NF2 f = 770 MHz − 1.5 2.0 dB Input Return Loss 1 RLin1 f = 470 MHz, P in = −30 dBm 6.5 9.5 − dB Input Return Loss 2 RLin2 f = 770 MHz, P in = −30 dBm 5.5 8.5 − dB Output Return Loss 1 RLout1 f = 470 MHz, P in = −30 dBm 9 14 − dB Output Return Loss 2 RLout2 f = 770 MHz, P in = −30 dBm 10 15 − dB Isolation 1 ISL1 f = 470 MHz, P in = −30 dBm 17 22 − dB Isolation 2 ISL2 f = 770 MHz, P in = −30 dBm 16 21 − dB Gain 1 dB Compression Output Power 1 PO (1 dB) 1 f = 470 MHz −8 −5.5 − dBm Gain 1 dB Compression Output Power 2 P O (1 dB) 2 f = 770 MHz −8 −5.5 − dBm STANDARD CHARACTERISTICS FOR REFERENCE A = +25°C, VCC = 2.8 V, ZS = ZL = 50 Ω, unless otherwise specified) Parameter Symbol Test Conditions Reference Value Unit Saturated Output Power 1 PO (sat) 1 f = 470 MHz, P in = +2 dBm +1.3 dBm Saturated Output Power 2 PO (sat) 2 f = 770 MHz, P in = +2 dBm +1.3 dBm Input 3rd Order Distortion Intercept Point 1 IIP 31 f1 = 470 MHz, f2 = 471 MHz −10.5 dBm Input 3rd Order Distortion Intercept Point 2 IIP 32 f1 = 770 MHz, f2 = 771 MHz −9.5 dBm Output 3rd Order Distortion Intercept Point 1 OIP31 f1 = 470 MHz, f2 = 471 MHz +4.8 dBm Output 3rd Order Distortion Intercept Point 2 OIP 32 f1 = 770 MHz, f2 = 771 MHz +4.0 dBm K factor 1 K1 f = 470 MHz 1.15 − K factor 2 K2 f = 770 MHz 1.20 − Data Sheet PU10675EJ01V0DS 3 μPC3237TK
50 Ω 50 Ω The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF Data Sheet PU10675EJ01V0DS 4 μPC3237TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN OUT VCC C1 C2 Mounting direction Notes 1. 30 × 30 × 0.4 mm double sided copper clad FR-4 board. 2. Back side: GND pattern 3. Au plated on pattern : Through holes Data Sheet PU10675EJ01V0DS 5 μPC3237TK
TYPICAL CHARACTERISTICS (TA = +25°C, VCC = 2.8 V, ZS = ZL = 50 Ω, unless otherwise specified) 0 12 3 4 +25°C –40°C TA = +85°C –50 –25 0 25 50 75 100 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 2.4 V VCC = 3.3 V 2.8 V 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 TA = –40°C 3.0 2.5 2.0 1.5 1.0 0.5 0.0 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 VCC = 2.4 V 3.3 V 2.8 V 3.0 2.5 2.0 1.5 1.0 0.5 0.0 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 +25°C +85°C TA = +85°C +25°C –40°C CIRCUIT CURRENT vs. SUPPLY VOLTAGECircuit Current ICC (mA) Supply Voltage VCC (V) No Input Signal No Input Signal CURCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE Circuit Current ICC (mA) Operating Ambient Temperature TA (°C) Frequency f (MHz) POWER GAIN vs. FREQUENCY Power Gain GP (dB) Frequency f (MHz) POWER GAIN vs. FREQUENCY Power Gain GP (dB) NOISE FIGURE vs. FREQUENCY Frequency f (MHz) Noise Figure NF (dB) NOISE FIGURE vs. FREQUENCY Frequency f (MHz) Noise Figure NF (dB) Remark The graphs indicate nominal characteristics. Data Sheet PU10675EJ01V0DS 6 μPC3237TK
–10 –15 –20 –25 –30 –35 –40 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 –10 –15 –20 –25 –30 –35 –40 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 –10 –15 –20 –25 –30 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 –10 –15 –20 –25 –30 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 –10 –15 –20 –25 –30 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 –10 –15 –20 –25 –30 VCC = 2.4 V 3.3 V 2.8 V TA = –40°C +25°C +85°C VCC = 2.4 V 3.3 V 2.8 V TA = +85°C –40°C +25°C VCC = 2.4 V 3.3 V 2.8 V TA = +85°C –40°C +25°C Frequency f (MHz) ISOLATION vs. FREQUENCY Isolation ISL (dB) Frequency f (MHz) ISOLATION vs. FREQUENCY Isolation ISL (dB) INPUT RETURN LOSS vs. FREQUENCY Frequency f (MHz) Input Return Loss RLin (dB) INPUT RETURN LOSS vs. FREQUENCY Frequency f (MHz) Input Return Loss RLin (dB) Frequency f (MHz) OUTPUT RETURN LOSS vs. FREQUENCYOutput Return Loss RLout (dB) Frequency f (MHz) OUTPUT RETURN LOSS vs. FREQUENCYOutput Return Loss RLout (dB) Remark The graphs indicate nominal characteristics. Data Sheet PU10675EJ01V0DS 7 μPC3237TK
–10 –15 –20 –25 –30 f = 170 MHz –10 –15 –20 –25 –30 f = 470 MHz Pout IM3 f1 = 470 MHz f2 = 471 MHz –10 –20 –30 –40 –50 –60 –70 –80 –10 –15 –20 –25 –30 f = 770 MHz Pout IM3 f1 = 770 MHz f2 = 771 MHz –10 –20 –30 –40 –50 –60 –70 –80 Pout IM3 f1 = 170 MHz f2 = 171 MHz –10 –20 –30 –40 –50 –60 –70 –80 2.4 V VCC = 3.3 V 2.8 V OIP3 = +5.0 dBm IIP3 = –11.5 dBm 2.4 V VCC = 3.3 V 2.8 V OIP3 = +4.8 dBm IIP3 = –10.5 dBm 2.4 V VCC = 3.3 V 2.8 V OIP3 = +4.0 dBm IIP3 = –9.5 dBm OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10675EJ01V0DS 8 μPC3237TK
f = 470 MHz f = 770 MHz –10 –15 –20 –25 –30–50 –25 0 25 50 75 100 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 –10 –15 –20 –25 –30–50 –25 0 25 50 75 100 VCC = 3.3 V 2.4 V 2.8 V VCC = 3.3 V 2.4 V 2.8 V PO (1 dB) vs. OPERATING AMBIENT TEMPERATURE Gain 1 dB Compression Output Power PO (1 dB) (dB) Operating Ambient Temperature TA (°C) PO (1 dB) vs. OPERATING AMBIENT TEMPERATURE Gain 1 dB Compression Output Power PO (1 dB) (dB) Operating Ambient Temperature TA (°C) K FACTOR vs. FREQUENCY Frequency f (MHz) K Factor K Remark The graphs indicate nominal characteristics. Data Sheet PU10675EJ01V0DS 9 μPC3237TK
S-PARAMETERS (TA = +25°C, VCC = 2.8 V, monitored at connector on board) S11−FREQUENCY START : 100.000 000 MHz STOP : 3 100.000 000 MHz 1 : 470 MHz 48.832 Ω –35.260 Ω 2 : 770 MHz 32.758 Ω –26.611 Ω 2 1 S22−FREQUENCY START : 100.000 000 MHz STOP : 3 100.000 000 MHz 1 : 470 MHz 61.666 Ω –18.627 Ω 2 : 770 MHz 50.924 Ω –18.180 Ω 2 1 Data Sheet PU10675EJ01V0DS 10 μPC3237TK
6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) 0.48±0.050.48±0.05 1.5±0.1 1.3±0.05 1.1±0.1 0.55±0.03 0.11+0.1 –0.05 0.16±0.05 0.9±0.10.2±0.1 (Bottom View)(Top View) Data Sheet PU10675EJ01V0DS 11 μPC3237TK
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. (4) The DC cut capacitor should be attached to Input and Output pin. (5) Pin 1 (NC) should be connected to the ground pattern. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating). Data Sheet PU10675EJ01V0DS 12 μPC3237TK
The information in this document is current as of July, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific": μPC3237TK