UPC3234GV RENESAS | Alldatasheet
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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
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DESCRIPTION
The μPC3234GV is a silicon monolithic IC designed for use as AGC amplifier for digital CATV, cable modem and digital terrestrial systems. This IC consists of gain control amplifier and video amplifier. The package is 8-pin SSOP (Shrink Small Outline Package) suitable for surface mount. This IC is manufactured using our 30 GHz f max UHS0 (U ltra High Speed Process) silicon bipolar process. This process uses silicon nitride passivation film. This material can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
- Low distortion : IM3 = 54.0 dBc TYP. @ single-ended output, Vout = 105 dBμV (0.5 Vp-p) /tone, P in = −30 dBm/tone Low noise figure : NF = 4.0 dB TYP. @ maximum gain Wide AGC dynamic range : GCR in = 58.5 dB TYP. @ input prescribe High ESD protection Packaged in 8-pin SSOP suitable for surface mounting
APPLICATIONS
Digital terrestrial TV Digital CATV Cable modem receivers USB card
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form μPC3234GV-E1 μPC3234GV-E1-A 8-pin plastic SSOP (4.45 mm (175)) (Pb-Free) 3234 • Embossed tape 8 mm wide
- Pin 1 indicates pull-out direction of tape
- Qty 1 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPC3234GV DATA SHEET Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. GENERAL PURPOSE 5 V 100 MHz AGC AMPLIFIER BIPOLAR ANALOG INTEGRATED CIRCUIT μPC3234GV Document No. PU10695EJ01V0DS (1st edition) Date Published November 2007 NS Printed in Japan
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS VCC INPUT1 INPUT2 VAGC GND1 OUTPUT1 OUTPUT2 GND2 AGC AMP. Driver AMP. AGC Control (Top View) Data Sheet PU10695EJ01V0DS 2 μPC3234GV
No. Pin Name Applied Voltage (V) Pin Voltage (V) Note Function and Application Internal Equivalent Circuit 1 V CC 4.5 to 5.5 − Power supply pin. This pin should be externally equipped with bypass capacitor to minimize ground impedance. ⎯⎯⎯ 2 INPUT1 − 1.2 Signal input pins to AGC amplifier. This pin should be coupled with capacitor for DC cut. 3 INPUT2 − 1.2 AGC Control 4 V AGC 0 to V CC − Gain control pin. This pin’s bias govern the AGC output level. Minimum Gain at VAGC : 0 to 0.4 V Maximum Gain at VAGC : 3.0 to 3.5 V Recommended to use AGC voltage with externally resister (example: 1 kΩ). AGC Amp. 5 GND2 0 − Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. ⎯⎯⎯ 6 OUTPUT2 − 2.4 Signal output pins of video amplifier. This pin should be coupled with capacitor for DC cut. 7 OUTPUT1 − 2.4 8 GND1 0 − Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All ground pins must be connected together with wide ground pattern to decrease impedance difference. ⎯⎯⎯ Note Pin voltage is measured at V CC = 5.0 V. Data Sheet PU10695EJ01V0DS 3 μPC3234GV
Parameter Symbol Test Conditions Ratings Unit Supply Voltage VCC T A = +25°C 6.0 V Gain Control Voltage Range VAGC T A = +25°C 0 to V CC V Power Dissipation PD T A = +85°C Note 250 mW Operating Ambient Temperature T A −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature T A V CC = 4.5 to 5.5 V −40 +25 +85 °C Gain Control Voltage Range VAGC 0 − 3.5 V Operating Frequency Range fBW 30 − 100 MHz Data Sheet PU10695EJ01V0DS 4 μPC3234GV
ELECTRICAL CHARACTERISTICS
(TA = +25°C, VCC = 5 V, f = 45 MHz, ZS = 50 Ω, ZL = 250 Ω, single-ended output) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit DC Characteristics Circuit Current ICC V CC = 5 V, No input signal Note 1 − 28.5 38 mA AGC Voltage High Level VAGC (H) @ Maximum gain Note 1 3.0 − 3.5 V AGC Voltage Low Level VAGC (L) @ Minimum gain Note 1 0 − 0.4 V RF Characteristics IF Input Frequency Range fIFin f C = −3 dB @ 45 MHz Note 1 30 − 100 MHz Maximum Voltage Gain GMAX V AGC = 3.0 V, Pin = −60 dBm Note 1 60 63 66 dB Minimum Voltage Gain GMIN V AGC = 0.4 V, Pin = −30 dBm Note 1 1.5 4.5 7.5 dB Gain Control Range (input prescribe) GCR in V AGC = 0.4 to 3.0 V Note 1 52.5 58.5 − dB Output Voltage Vout P in = −59 to −17 dBm Note 1 − 1.0 − Vp-p Maximum Output Voltage Voclip V AGC = 3.0 V Note 1 2.0 2.7 − Vp-p Noise Figure NF V AGC = 3.0 V Note 2 − 4.0 5.5 dB 3rd Order Intermodulation Distortion IM 3 f1 = 44 MHz, f2 = 45 MHz, Pin = −30 dBm/tone, Vout = 105 dBμV (0.5 Vp-p) /tone Note 1 48 54 − dBc Input Impedance Zin V AGC = 0 V Note 3 − 0.7//2.8 − kΩ//pF Notes 1. By measurement circuit 1 2. By measurement circuit 2 3. By measurement circuit 3 Data Sheet PU10695EJ01V0DS 5 μPC3234GV
50 Ω 50 Ω 200 Ω 1 kΩ VAGC VCC Vout Pout Pin 1 Fμ 200 Ω 1 Fμ 100 pF 100 pF 100 pF 100 pF 50 Ω Signal Generator AGC AMP. Driver AMP. AGC Control Note2 Notes 1. Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type) 2. V out (dBmV) = Pout (dBm) + 20 log (250 Ω/50 Ω) + 46.99 MEASUREMENT CIRCUIT 2 Note NF Meter HP8970 50 Ω 50 Ω 200 Ω 1 kΩ VAGC VCC 1 Fμ 200 Ω 1 Fμ Noise Source Agilent 346A AGC AMP. Driver AMP. AGC Control 100 pF 100 pF 100 pF 100 pF Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10695EJ01V0DS 6 μPC3234GV
50 Ω50 Ω 50 Ω50 Ω 1 kΩ VAGC VCC 1 Fμ 1 Fμ 100 pF 100 pF 100 pF 100 pF AGC AMP. Driver AMP. AGC Control The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet PU10695EJ01V0DS 7 μPC3234GV
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD (MEASUREMENT CIRCUIT 1) VCC 1 Fμ 100 pF 100 pF 100 pF 100 pF 1 Fμ Note VAGC PC3234GVμ 1 kΩ 200 Ω 200 Ω PC3234GVμ Note Balun Transformer Remarks 1. Back side: GND pattern 2. Au plated on pattern : Through hole 4. represents short-circuit strip Data Sheet PU10695EJ01V0DS 8 μPC3234GV
TYPICAL CHARACTERISTICS (TA = +25°C , unless otherwise specified) 0123456 V CC = 5.0 V f = 45 MHz 0 1.0 2.0 3.0 00 1.0 2.0 3.0 f = 45 MHz –10 –20 –30 10 100 1 000 V CC = 4.5 V 5.0 V 5.5 V VAGC = 3.0 V (Pin = –60 dBm) VAGC = 1.2 V (Pin = –60 dBm) VAGC = 0.4 V (Pin = –30 dBm) No input signal TA = –40˚C +25˚C +85˚C VCC = 4.5 V5.0 V5.5 V TA = –40˚C+25˚C +85˚C CIRCUIT CURRENT vs. SUPPLY VOLTAGE Circuit Current ICC (mA) Supply Voltage VCC (V) VOLTAGE GAIN vs. FREQUENCY Voltage Gain (dB) Frequency f (MHz) VOLTAGE GAIN vs. GAIN CONTROL VOLTAGE RANGE Voltage Gain (dB) Gain Control Voltage Range VAGC (V) VOLTAGE GAIN vs. GAIN CONTROL VOLTAGE RANGE Voltage Gain (dB) Gain Control Voltage Range VAGC (V) f = 45 MHz V AGC = 3.0 V VCC = 4.5 V 5.0 V 5.5 V OUTPUT VOLTAGE vs. INPUT POWER Output Voltage Vout (dBmV) Input Power Pin (dBm) OUTPUT VOLTAGE vs. INPUT POWER Output Voltage Vout (dBmV) Input Power Pin (dBm) VCC = 5.0 V f = 45 MHz VAGC = 3.0 V TA = –40˚C +25˚C +85˚C Remark The graphs indicate nominal characteristics. Data Sheet PU10695EJ01V0DS 9 μPC3234GV
f = 45 MHz V AGC = 1.2 V VCC = 4.5 V 5.0 V 5.5 V OUTPUT VOLTAGE vs. INPUT POWER Output Voltage Vout (dBmV) Input Power Pin (dBm) f = 45 MHz V AGC = 0.4 V –10–20 0–30 20 10–40 2.0 3.01.0 VCC = 4.5 V 5.0 V 5.5 V OUTPUT VOLTAGE vs. INPUT POWER Output Voltage Vout (dBmV) Input Power Pin (dBm) OUTPUT VOLTAGE vs. INPUT POWER Output Voltage Vout (dBmV) Input Power Pin (dBm) VCC = 5.0 V f = 45 MHz V AGC = 1.2 V TA = –40˚C +25˚C +85˚C V CC = 5.0 V f = 45 MHz V AGC = 0.4 V TA = –40˚C +25˚C +85˚C V CC = 5.0 V f = 45 MHz TA = –40˚C +25˚C +85˚C –10–20 0–30 20 10–40 OUTPUT VOLTAGE vs. INPUT POWER Output Voltage Vout (dBmV) Input Power Pin (dBm) f = 45 MHz NOISE FIGURE vs. GAIN CONTROL VOLTAGE RANGE Noise Figure NF (dB) Gain Control Voltage Range VAGC (V) 2.0 3.01.0 NOISE FIGURE vs. GAIN CONTROL VOLTAGE RANGE Noise Figure NF (dB) Gain Control Voltage Range VAGC (V) VCC = 4.5 V 5.0 V 5.5 V Remark The graphs indicate nominal characteristics. Data Sheet PU10695EJ01V0DS 10 μPC3234GV
0–40 –30 –20 0–10 –10 –20 –30 V AGC = 3.0 V f1 = 44 MHz f2 = 45 MHz IM3 Vout VCC = 5.0 V VAGC = 3.0 V f1 = 44 MHz f2 = 45 MHz f = 45 MHz –10 –20–60 –70 NOISE FIGURE vs. GAIN REDUCTION Noise Figure NF (dB) Gain Reduction (dB) Input Power Pin (dBm) OUTPUT VOLTAGE, IM3 vs. INPUT POWER Output Voltage Vout (dBmV) 3rd Order Intermodulation Distortion IM3 (dBmV) –10 –20 –30 –40 IM Vout –50 –20 –10 0 20 10–30 –40 –50 –20 –10 0 20 10–30 –40 Input Power Pin (dBm) OUTPUT VOLTAGE, IM3 vs. INPUT POWER Output Voltage Vout (dBmV) 3rd Order Intermodulation Distortion IM3 (dBmV) VCC = 4.5 V 5.0 V 5.5 V 0–40 –30 –20 0–10 NOISE FIGURE vs. GAIN REDUCTION Noise Figure NF (dB) Gain Reduction (dB) VCC = 5.0 V f = 45 MHz TA = –40˚C +25˚C +85˚C VCC = 4.5 V 5.0 V 5.5 V VAGC = 1.2 V f1 = 44 MHz f2 = 45 MHz VCC = 4.5 V 5.0 V 5.5 V –10 –20 –30 –40 IM Vout Input Power Pin (dBm) OUTPUT VOLTAGE, IM3 vs. INPUT POWER Output Voltage Vout (dBmV) 3rd Order Intermodulation Distortion IM3 (dBmV) –10 –20 –30 –40 IM Vout Input Power Pin (dBm) OUTPUT VOLTAGE, IM3 vs. INPUT POWER Output Voltage Vout (dBmV) 3rd Order Intermodulation Distortion IM3 (dBmV) TA = –40˚C +25˚C +85˚C VCC = 5.0 V VAGC = 1.2 V f1 = 44 MHz f2 = 45 MHz TA = –40˚C +25˚C +85˚C Remark The graphs indicate nominal characteristics. Data Sheet PU10695EJ01V0DS 11 μPC3234GV
V out = 0.5 Vp-p/tone f1 = 44 MHz f2 = 45 MHz –60 Input Power Pin (dBm) IM3 vs. INPUT POWER 3rd Order Intermodulation Distortion IM3 (dBc) Input Power Pin (dBm) IM3 vs. INPUT POWER 3rd Order Intermodulation Distortion IM3 (dBc) VCC = 5.0 V Vout = 0.5 Vp-p/tone f1 = 44 MHz f2 = 45 MHz –60 VCC = 4.5 V 5.0 V 5.5 V TA = –40˚C +25˚C +85˚C Remark The graphs indicate nominal characteristics. Data Sheet PU10695EJ01V0DS 12 μPC3234GV
S-PARAMETERS (TA = +25°C, VCC = 5.0 V, VAGC = 0 V) S11−FREQUENCY 1 : 30 MHz 1.191 kΩ –1.468 kΩ 3.614 pF 2 : 45 MHz 707.0 Ω –1.248 kΩ 2.834 pF 3 : 75 MHz 340.1 Ω –894.3 Ω 2.373 pF 4 : 100 MHz 215.7 Ω –712.6 Ω 2.233 pF 1 23 4 S22−FREQUENCY 1 : 30 MHz 53.28 Ω –51.66 Ω 102.7 pF 2 : 45 MHz 53.32 Ω –32.47 Ω 108.9 pF 3 : 75 MHz 53.42 Ω –15.82 Ω 134.1 pF 4 : 100 MHz 53.79 Ω –8.586 Ω 185.4 pF Data Sheet PU10695EJ01V0DS 13 μPC3234GV
8-PIN PLASTIC SSOP (4.45 mm (175)) (UNIT: mm) 1.5±0.1 0.575 MAX. 0.10 M 1.8 MAX. 0.1±0.1 0.3+0.10 –0.05 detail of lead end 3˚+7˚ –3˚ 0.65 8 5 1 4 2.9±0.1 4.94±0.2 0.5±0.2 0.87±0.23.2±0.1 0.15+0.10 –0.05 0.15 Data Sheet PU10695EJ01V0DS 14 μPC3234GV
RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating). Data Sheet PU10695EJ01V0DS 15 μPC3234GV
The information in this document is current as of November, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific": μPC3234GV