UPC3228T5S-E2-A

UPC3228T5S RENESAS | Alldatasheet

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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

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DESCRIPTION

The μPC3228T5S is a silicon bipolar monolithic IC designed for use as IF down-converter for digital TV, digital CATV. This IC consists of AGC amplifier, mixer and video amplifier. The package is 32-pin plastic QFN (Quad Flat Non-lead) package suitable for surface mount. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses silicon nitride passivation film. This material can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformly and reliability.

FEATURES

• Total performance : ICC = 85 mA TYP. @ VCC = 5 V  AGC AMPLIFIER + MIXER + DRIVER BLOCK : f RF (BW) = 20 to 800 MHz : CG = 28 dB TYP. : GCR = 70 dB TYP. IM3 = 47 dBc MIN./57 dBc TYP. @ Single Ended-OUT = 0.5 Vp-p/tone  VIDEO AMPLIFIER BLOCK : GV = 59 dB TYP. : f IF (BW) = 20 to 100 MHz : IM3 = 45 dBc MIN./55 dBc TYP. @ Output = 110 dBu/tone, Differential-out  High-density surface mounting : 32-pin plastic QFN package (5.0 × 5.0 × 0.75 mm) APPLICATION  Digital CATV  Cable modem receivers

ORDERING INFORMATION

Part Number Order Number Package Marking Supplying Form μPC3228T5S-E2 μPC3228T5S-E2-A 32-pin plastic QFN (Pb-Free) C3228 • Embossed tape 12 mm wide

• Pin 8,9 face the perforation side of the tape
• Qty 2.5 kpcs/reel
• Dry pack specification Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPC3228T5S DATA SHEET Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. BIPOLAR ANALOG INTEGRATED CIRCUIT μPC3228T5S Document No. PU10623EJ01V0DS (1st edition) Date Published June 2006 NS CP(K) Printed in Japan LOW DISTORTION DOWN-CONVERTER + AGC AMPLIFIER + VIDEO AMPLIFIER

INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION GND-AGC Note GND-Driv Driv-OUT1 Driv-OUT2 GND-Driv GND IF-IN1 IF-IN2 GND-AGC RF-IN2 RF-IN1 V CC-AGC VCC-Driv VCC-MIX VCC-LO GND-MIX Note GND-MIX LO-IN2 LO-IN1 GND-LO V CC-IF2 IF-OUT2 IF-OUT1 GND-IF2 Note GND-IF1 Note GND-IF1 GND-REG VCC-IF1 VAGC GND-REG NC GND-IF2 IF_IN AMP IF_IN AMP2 Driver AMP Driver AMP LO AMP AGC Control (Top View) RF_AGC AMP Note 1, 9, 17, 25-pin: Connected to the lead frame. Data Sheet PU10623EJ01V0DS 2 μPC3228T5S

Parameter Symbol Conditions Ratings Unit Supply Voltage VCC T A = +25°C 6.0 V Power Dissipation PD T A = +80°C Note 800 mW Operating Ambient Temperature T A Note −20 to +80 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature T A V CC = 4.5 to 5.5 V −20 +25 +80 °C Gain Control Voltage Range VAGC 0 − 3.3 V RF Operating Frequency Range f RF (BW) 20 − 800 MHz IF Operating Frequency Range f IF (BW) 20 − 100 MHz Data Sheet PU10623EJ01V0DS 3 μPC3228T5S

ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5 V, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit DC Characteristics Circuit Current ICC No input signal Note 1 65 85 110 mA AGC Voltage High Level VAGC (H) @ Maximum gain Note 1 2.5 − 3.5 V AGC Voltage Low Level VAGC (L) @ Minimum gain Note 1 − 0 − V RF Characteristics (RF AGC Amplifier Block + Mixer Block + Driver Amplifier: fRF = 80 MHz, fLO = 130 MHz, PLO = −10 dBm, ZS = 50 Ω, ZL = 400 Ω/16 pF) RF Input Frequency Range fRF f C = −3 dB Note 1 20 − 800 MHz RF Gain Control Range GCR1 V AGC = 0 to 2.5 V Note 1 62 70 − dB Mixer Conversion Gain CG V AGC = 2.5 V Differential-IN: Vin = +18 dBmV Note 1 25 28 31 dB 3rd Order Intermodulaion Distortion IM 31 f1 = 44 MHz, f2 = 45 MHz, Vin = +30 dBmV/tone, Single Ended-OUT = 0.5 Vp-p/tone Note 1 47 57 − dBc Noise Figure NF1 V AGC = 2.5 V, f = 50 MHz, Differential-Output Note 2 − 8.3 − dB IF Characteristics (IF Amplifier Block + Driver Amplifier: f IF = 50 MHz, ZS = 50 Ω, ZL = 2 100 Ω) IF Input Frequency Range fIF f C = −3 dB Note 5 20 − 100 MHz IF Amplifier Gain GV V in = −7 dBmV, Differential-IN/OUT Note 5 56 59 62 dB 3rd Order Intermodulaion Distortion IM 32 f1 = 49.5 MHz, f2 = 50.5 MHz, Vout = 110 dBu/tone, Differential-IN/OUT Note 5 45 55 − dBc IF Output Voltage Vout Single Ended-Output Note 5 − 1.0 − Vp-p Noise Figure NF2 V AGC = 0 V, f = 50 MHz, Single Ended-Output Note 2 − 3.0 − dB Total Block (RF AGC Amplifier + Mixer + Driver Amplifier + SAW Filter + IF Ampliter + Driver Amplifier), SAW Filter : EPCOS X6889M (f IF = 49 MHz, PLO = −10 dBm, fRF = 70 to 130 MHz, ZS = 50 Ω, ZL = 1 050 Ω) LO-RF Leakage LORF V AGC = 2.5 V, 22-pin 75 Ω Termination fLO = 110 to 180 MHz Note 3 − −54 −44 dBmV LO-IF Leakage LOIF V AGC = 2.5 V, Vout = 0.7 Vp-p Single Ended-Output fRF = 130 MHz, fLO = 179 MHz Note 4 − −40 −25 dBc Notes 1. By measurement circuit 1 2. By measurement circuit 2 3. By measurement circuit 3 4. By measurement circuit 4 5. By measurement circuit 5 Data Sheet PU10623EJ01V0DS 4 μPC3228T5S

IF_IN AMP IF_IN AMP2 Driver AMP Driver AMP LO AMP AGC Control RF_AGC AMP 51 Ω 1 nF 1 nF Vin S.G 1 nF 1 nF 1 nF 1 nF 51 Ω PLO S.G 50 Ω 1 nF 1 nF VCC 0.1 Fμ 50 Ω 1 000 Ω0.1 Fμ 50 Ω 1 000 Ω0.1 Fμ Note 100 pF 1 kΩ 0.1 Fμ VAGC Note 51 Ω 0.1 Fμ 0.1 Fμ 1 nF 1 nF 400 Ω Vout1 Vout2 16 pF Differential Probe (10:1)

1 MΩ//7 pF

50 ΩVOUT = Vout1 – Vout2 Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS 5 μPC3228T5S

IF_IN AMP IF_IN AMP2 Driver AMP Driver AMP LO AMP AGC Control RF_AGC AMP 1 nF 1 nF 1 nF 1 nF 1 nF 1 nF 51 Ω S.G 50 Ω 1 nF 1 nF VCC 0.1 Fμ 1 000 Ω0.1 Fμ 50 Ω 1 000 Ω0.1 Fμ Note 100 pF 1 kΩ 0.1 Fμ VAGC Note 0.1 Fμ 0.1 Fμ 1 nF MA/Com H183-4 30-3 000 MHz Noise Source 50 ΩNoise Figure Meter 1 nF 51 Ω 51 Ω Hybrid Coupler 50 Ω Noise Figure Meter 50 Ω Noise Source PLO Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS 6 μPC3228T5S

IF_IN AMP IF_IN AMP2 Driver AMP Driver AMP LO AMP AGC Control RF_AGC AMP 1 nF 1 nF 1 nF 1 nF 1 nF 1 nF 51 Ω S.G 50 Ω 1 nF 1 nF VCC 0.1 Fμ 1 000 Ω0.1 Fμ 1 000 Ω0.1 Fμ Note 100 pF 1 kΩ 0.1 Fμ VAGC Note 51 Ω 0.1 Fμ 0.1 Fμ 1 nF 1 nF 400 Ω16 pF Spectrum Analyzer 50 Ω 24 ΩVOUT PLO Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS 7 μPC3228T5S

(fRF = 70 to 130 MHz (f IF = 49.1 MHz ± 0.6 MHz), fLO = 119 to 179 MHz, P LO = −10 dBm, Vout = 0.7 Vp-p (Single Ended)) LO-IF Leakage IF_IN AMP IF_IN AMP2 Driver AMP Driver AMP LO AMP AGC Control RF_AGC AMP 51 Ω 1 nF 1 nF S.G 1 nF 1 nF 1 nF 1 nF 51 Ω S.G 50 Ω 1 nF 1 nF VCC 0.1 Fμ 1 000 Ω0.1 Fμ 50 Ω 1 000 Ω0.1 Fμ Note 100 pF 1 kΩ 0.1 Fμ VAGC 0.1 Fμ 1 nF 1 nF Spectrum Analyzer 50 Ω SAW Filter EPCOS X6889M 0.1 Fμ Vout2 Vout1

49 M fLO

Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS 8 μPC3228T5S

IF_IN AMP IF_IN AMP2 Driver AMP Driver AMP LO AMP AGC Control RF_AGC AMP 51 Ω 1 nF 1 nF 1 nF 1 nF 1 nF 1 nF 51 Ω 1 nF 1 nF VCC 0.1 Fμ 1 000 Ω0.1 Fμ 50 Ω 1 000 Ω0.1 Fμ Note 100 pF 1 kΩ 0.1 Fμ VAGC Note 51 Ω 0.1 Fμ 0.1 Fμ 1 nF 1 nF 400 Ω Vin1 Vin2 16 pF Spectrum Analyzer 50 Ω Vout1 Vout2 VOUT = Vout1 – Vout2 Differential-OUT VIN = Vin1 – Vin2 Differential-IN S.G 50 Ω Vin Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS 9 μPC3228T5S

ILLUSTRATION OF THE EVALUATION BOARD Note Note C4C5 RF LO OUT2 OUT1 IF IF C2 R3C2 VCC VCC VAGC VOUT1 VOUT2 Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Remarks 1. Back side: GND pattern 2. Solder plated on pattern 3. : Through hole USING THE NEC EVALUATION BOARD Symbol Values Maker Part Number Size C1 1 nF Murata GRM39CH 1608 C2 0.1 μF Murata GRM39B 1608 C3 100 pF Murata GRM39CH 1608 C4 10 pF Murata GRM36B 1005 C5 6 pF Murata GRM36B 1005 R1 51 Ω Susumu RR0816 510SSM 1608 R2 200 Ω Susumu RR0816 201SSM 1608 R3 1 000 Ω Susumu RR0816 102SSM 1608 Data Sheet PU10623EJ01V0DS 10 μPC3228T5S

32-PIN PLASTIC QFN (UNIT: mm) Laser Marked Index 5.0±0.1 5.0±0.1 (Bottom View)(Side View)(Top View) (Side View) (0.21) 0.85 MAX.(0.75) (0.20) 0.16±0.050.76±0.1 (0.865) (1.1)0.4 (1.75) (1.75) Exposed Die Pad To be connected1 22 1 C3228 Data Sheet PU10623EJ01V0DS 11 μPC3228T5S

(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to mi nimize ground impedance (to pr event undesired oscillation). All the ground terminals must be connected together wit h wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to V CC line. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating). Data Sheet PU10623EJ01V0DS 12 μPC3228T5S

The information in this document is current as of June, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific": Data Sheet PU10623EJ01V0DS 13 μPC3228T5S

NEC Compound Semiconductor Devices Hong Kong Limited E-mail: contact@ncsd-hk.necel.com Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ For further information, please contact μPC3228T5S