UPC3215TB_1 NEC | Alldatasheet

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BIPOLAR ANALOG INTEGRATED CIRCUIT µµµµPC3215TB

5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER

Document No. P14765EJ2V0DS00 (2nd edition) Date Published August 2000 N CP(K) Printed in Japan DATA SHEET The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. © 2000 The mark shows major revised points.

DESCRIPTION

The µPC3215TB is a silicon monolithic IC designed as wideband amplifier. The µPC3215TB is suitable to systems required wideband operation from HF to L band. This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. The package is 6-pin super minimold suitable for surface mount.

FEATURES

  • Wideband response : f u = 2.9 GHz TYP. @3 dB bandwidth
  • Noise figure : NF = 2.3 dB TYP. @f = 1.5 GHz
  • Power gain : G P = 20.5 dB TYP. @f = 1.5 GHz
  • Supply voltage : V CC = 4.5 to 5.5 V
  • High-density surface mounting: 6-pin super minimold package APPLICATION
  • Systems required wideband operation from HF to L band

ORDERING INFORMATION

Part Number Package Marking Supplying Form µPC3215TB-E3 6-pin super minimold C3H Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC3215TB) Caution Electro-static sensitive devices

Data Sheet P14765EJ2V0DS002 µµµµPC3215TB PIN CONNECTIONS Pin No. Pin Name

1 INPUT

PRODUCT LINE-UP OF 5V-BIAS SILICON MMIC WIDEBAND AMPLIFIERS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 ΩΩΩΩ ) Part No. fu (GHz) PO (sat) (dBm) G P (dB) NF (dB) ICC (mA) Package Marking µPC2711T 6-pin minimold µPC2711TB 2.9 +1.0 13 5.0 @f = 1 GHz 6-pin super minimold C1G µPC2712T 6-pin minimold µPC2712TB 2.6 +3.0 20 4.5 @f = 1 GHz 6-pin super minimold C1H µPC3210TB 2.3 +3.5 20 3.4 @f = 1.5 GHz 15 6-pin super minimold C2X µPC3215TB 2.9 +3.5 20.5 2.3 @f = 1.5 GHz 14 6-pin super minimold C3H Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Caution The package size distinguishes between minimold and super minimold. (Top View) C3H (Bottom View)

Data Sheet P14765EJ2V0DS00 3 µµµµPC3215TB PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage (V) Note Function and Applications Internal Equivalent Circuit 1 INPUT  0.82 Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wideband. A multi- feedback circuit is designed to cancel the deviations of h FE and resistance. This pin must be coupled to signal source with capacitor for DC cut. GND 0  Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 4O U T P U T  3.8 Signal output pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wideband. This pin must be coupled to next stage with capacitor for DC cut. 6V CC 4.5 to 5.5  Power supply pin. This pin should be externally equipped with bypass capacitor to minimize ground impedance. GND GND IN VCC OUT 352 Note Pin voltage is measured at VCC = 5.0 V

Data Sheet P14765EJ2V0DS004 µµµµPC3215TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage V CC TA = +25°C 6.0 V Circuit Current I CC TA = +25°C 30 mA Input Power P in TA = +25°C +10 dBm Power Dissipation P D TA = +85°C Note 270 mW Operating Ambient Temperature TA –40 to +85 °C Storage Temperature T stg –55 to +150 °C Note Mounted on 50 × 50 × 1.6-mm epoxy glass PWB, with copper patterning on both sides. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V CC 4.5 5.0 5.5 V Operating Ambient Temperature TA –40 +25 +85 °C Input Power P in ––0 d B m Input Frequency f in 0 . 1–2 . 9 G H z ELECTRICAL CHARACTERISTICS (T A = +25°C, VCC = 5.0 V, ZS = ZL = 50 ΩΩΩΩ ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current I CC No input signals 10.5 14.0 17.5 mA Power Gain G P f = 1.5 GHz, Pin = –30 dBm 18.5 20.5 – dB Noise Figure NF f = 1.5 GHz – 2.3 3.0 dB Upper Limit Operating Frequency fu 3 dB down below from gain at f = 0.1 GHz 2.5 2.9 – GHz Isolation ISL f = 1.5 GHz, P in = –30 dBm 39 44 – dB Input Return Loss RL in f = 1.5 GHz, Pin = –30 dBm 10 15 – dB Output Return Loss RL out f = 1.5 GHz, Pin = –30 dBm 6.5 9.5 – dB 1 dB Compression Point P-1 –4 –1.5 – dBm STANDARD CHARACTERISTICS (T A = +25°C, VCC = 5.0 V, ZS = ZL = 50 ΩΩΩΩ ) Parameter Symbol Test Conditions Reference Values Unit Saturated Output Power P O(sat) Pin = 0 dBm +3.5 dBm Output Intercept Point OIP 3 f1 = 1.5 GHz, f2 = 1.501 GHz +10 dBm Gain Flatness ΔG P f = 0.1 to 2.15 GHz 1.0 dB

Data Sheet P14765EJ2V0DS00 5 µµµµPC3215TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°°°°C) No input signal TA = –40°C TA = +25°C TA = +85°C CIRCUIT CURRENT vs. SUPPLY VOLTAGE Supply Voltage VCC (V) Circuit Current ICC (mA) 0 1 2 34 56 No input signal VCC = 5 V CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE Operating Ambient Temperature TA (°C) Circuit Current ICC (mA) –50 –25 0 +25 +50 +75 +100 Pin = –30 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V INSERTION POWER GAIN vs. FREQUENCY Frequency fin (GHz) Insertion Power Gain GP (dB) 0.1 0.3 1.0 3.0 VCC = 5 V Pin = –30 dBm TA = –40°C TA = +25°C TA = +85°C INSERTION POWER GAIN vs. FREQUENCY Frequency fin (GHz) Insertion Power Gain GP (dB) 0.1 0.3 1.0 3.0 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V NOISE FIGURE vs. FREQUENCY Frequency fin (GHz) Noise Figure NF (dB) 0.1 0.3 1.0 3.0 TA = –40°C TA = +25°C TA = +85°C NOISE FIGURE vs. FREQUENCY Frequency fin (GHz) Noise Figure NF (dB) 0.1 0.3 1.0 3.0 VCC = 5 V

Data Sheet P14765EJ2V0DS006 µµµµPC3215TB ISOLATION vs. FREQUENCY Frequency fin (GHz) Isolation ISL (dB) –20 –30 –40 –50 0.1 0.3 1.0 –10 3.0 ISOLATION vs. FREQUENCY Frequency fin (GHz) Isolation ISL (dB) –20 –30 –40 –50 0.1 0.3 1.0 –10 3.0 Pin = –30 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VCC = 5 V Pin = –30 dBm TA = –40°C TA = +25°C TA = +85°C INPUT RETURN LOSS vs. FREQUENCY Frequency fin (GHz) Input Return Loss RLin (dB) –20 –30 –40 –50 0.1 0.3 1.0 –10 3.0 Pin = –30 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V INPUT RETURN LOSS vs. FREQUENCY Frequency fin (GHz) Input Return Loss RLin (dB) –20 –30 –40 –50 0.1 0.3 1.0 –10 3.0 VCC = 5 V Pin = –30 dBm TA = –40°C TA = +25°C TA = +85°C OUTPUT RETURN LOSS vs. FREQUENCY Frequency fin (GHz) Output Return Loss RLout (dB) –20 –30 –40 –50 0.1 0.3 1.0 –10 3.0 Pin = –30 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V OUTPUT RETURN LOSS vs. FREQUENCY Frequency fin (GHz) Output Return Loss RLout (dB) –20 –30 –40 –50 0.1 0.3 1.0 –10 3.0 VCC = 5 V Pin = –30 dBm TA = –40°C TA = +25°C TA = +85°C

Data Sheet P14765EJ2V0DS00 7 µµµµPC3215TB OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) +10 –10 –20 –30 –40 –30 –20 +10 OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) +10 –10 –20 –30 –40 –30 –20 +10 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V fin = 1 GHz –10 0 –10 0 TA = –40°C TA = +25°C TA = +85°C VCC = 5 V fin = 1 GHz OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) +10 –10 –20 –30 –40 –30 –20 +10 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V fin = 1.5 GHz –10 0 OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) +10 –10 –20 –30 –40 –30 –20 +10–10 0 TA = –40°C TA = +25°C TA = +85°C VCC = 5 V fin = 1.5 GHz

Data Sheet P14765EJ2V0DS008 µµµµPC3215TB OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) +10 –10 –20 –30 –40 –30 –20 +10 OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) +10 –10 –20 –30 –40 –30 –20 +10–10 0 –10 0 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V fin = 2.15 GHz TA = –40°C TA = +25°C TA = +85°C VCC = 5 V fin = 2.15 GHz OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) +10 –10 –20 –30 –40 –30 –20 +10–10 0 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V fin = 2.4 GHz OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) +10 –10 –20 –30 –40 –30 –20 +10–10 0 TA = –40°C TA = +25°C TA = +85°C VCC = 5 V fin = 2.4 GHz

Data Sheet P14765EJ2V0DS00 9 µµµµPC3215TB OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE Input Power of Each Tone Pin(each) (dBm) Output Power of Each Tone PO(each) (dBm) +20 –40 –60 –80 –40 –35 –30 0–25 –5 –20 –20 –15 –10 VCC = 5 V f1 = 1 000 MHz f2 = 1 001 MHz OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE Input Power of Each Tone Pin(each) (dBm) Output Power of Each Tone PO(each) (dBm) +20 –40 –60 –80 –40 –35 –30 0–25 –5 –20 –20 –15 –10 VCC = 5 V f1 = 1 500 MHz f2 = 1 501 MHz OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE Input Power of Each Tone Pin(each) (dBm) Output Power of Each Tone PO(each) (dBm) +20 –40 –60 –80 –40 –35 –30 0–25 –5 –20 –20 –15 –10 VCC = 5 V f1 = 2 150 MHz f2 = 2 151 MHz OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE Input Power of Each Tone Pin(each) (dBm) Output Power of Each Tone PO(each) (dBm) +20 –40 –60 –80 –40 –35 –30 0–25 –5 –20 –20 –15 –10 VCC = 5 V f1 = 2 400 MHz f2 = 2 401 MHz Remark The graphs indicate nominal characteristics.

Data Sheet P14765EJ2V0DS0010 µµµµPC3215TB S-PARAMETERS (T A = +25°°°°C, VCC = 5 V) S11-FREQUENCY START STOP

0.100000000 GHz

3.100000000 GHz

Data Sheet P14765EJ2V0DS00 11 µµµµPC3215TB TYPICAL S-PARAMETER VALUES (T A = +25°°°°C) VCC = 5.0 V, ICC = 16 mA FREQUENCY S 11 S21 S12 S22 K 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 0.207 0.190 0.186 0.192 0.200 0.201 0.204 0.206 0.210 0.212 0.218 0.217 0.221 0.228 0.233 0.238 0.244 0.246 0.248 0.246 0.241 0.236 0.229 0.219 0.215 0.213 0.221 0.234 0.253 0.264 0.283 174.1 173.1 174.3 173.8 174.5 173.0 173.0 172.4 172.7 171.4 169.4 168.4 165.9 164.7 162.3 159.5 157.2 153.9 150.6 147.4 144.9 142.2 142.2 143.5 145.7 149.3 150.1 151.3 152.1 150.7 148.7 10.788 10.714 10.565 10.359 10.225 10.116 10.116 10.122 10.186 10.182 10.208 10.296 10.248 10.438 10.369 10.554 10.492 10.483 10.408 10.405 10.267 10.039 9.896 9.684 9.348 9.068 8.673 8.437 8.080 7.791 7.458 −4.6 −9.8 −14.3 −18.3 −21.7 −24.9 −28.0 −31.1 −34.5 −37.7 −41.6 −45.6 −49.7 −53.9 −58.0 −62.7 −67.2 −72.2 −76.9 −82.2 −87.2 −92.7 −97.7 −102.4 −107.5 −112.0 −116.6 −121.1 −124.9 −129.4 −132.7 0.013 0.013 0.013 0.014 0.013 0.013 0.011 0.011 0.011 0.009 0.011 0.009 0.006 0.008 0.006 0.005 0.004 0.003 0.004 0.007 0.008 0.011 0.012 0.014 0.015 0.018 0.017 0.020 0.021 0.020 0.022 6.3 −0.5 2.7 4.7 5.3 2.1 1.6 12.9 5.1 4.1 4.9 11.0 20.5 1.6 25.7 31.6 48.5 87.2 93.4 114.5 115.4 124.0 121.6 124.9 117.8 117.3 114.4 114.0 111.6 112.5 113.7 0.285 0.282 0.283 0.285 0.286 0.286 0.288 0.289 0.290 0.295 0.299 0.300 0.299 0.307 0.310 0.316 0.317 0.318 0.323 0.323 0.319 0.312 0.306 0.292 0.279 0.270 0.256 0.248 0.237 0.232 0.229 −3.3 −3.7 −4.6 −6.2 −7.6 −8.8 −10.4 −11.7 −13.5 −14.9 −16.8 −18.0 −20.2 −23.1 −24.8 −27.5 −30.5 −33.3 −36.9 −40.6 −44.9 −48.9 −52.6 −56.3 −59.3 −61.7 −63.7 −65.1 −67.3 −68.0 −70.2 3.38 3.39 3.37 3.92 3.96 3.69 3.91 4.17 3.99 4.28 4.19 4.65 5.78 6.97 6.80 11.54 11.75 13.52 8.46 7.46 6.20 4.50 4.12 3.40 3.42 3.02 3.17 2.85 2.98 2.90 3.02

Data Sheet P14765EJ2V0DS0012 µµµµPC3215TB TEST CIRCUIT VCC 1 000 pF C 150 Ω IN 2, 3, 5

4 C 2 50 Ω

EXAMPLE OF APPLICATION CIRCUIT 1 000 pF 1 000 pF 50 Ω IN 2, 3, 5 4 50 Ω 1 000 pF OUT 2, 3, 5 1 000 pF VCC 1 000 pF 1 000 pF 50 to 200 Ω Please connect these component to stabilize operation. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Capacitors for VCC , input and output pins 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).]

Data Sheet P14765EJ2V0DS00 13 µµµµPC3215TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD C IN OUT C VCC C3H 132 645 Mounting direction Notes 30 × 30 × 0.4 mm double sided copper clad polyimide board. Back side: GND pattern Solder plated on pattern : Through holes Top View AMP-2 C COMPONENT LIST Value C 1 000 pF

Data Sheet P14765EJ2V0DS0014 µµµµPC3215TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 0.9–0.1 0.7 0 to 0.1 0.15 2.0–0.2 1.3 0.650.65 0.2+0.1 –0.05 2.1–0.1 1.25–0.1 0.1 MIN. +0.1 –0 .05

Data Sheet P14765EJ2V0DS00 15 µµµµPC3215TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to V CC line. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Count: 3, Exposure limit: None Note IR35-00-3 Time: 40 seconds or less (at 200°C) Count: 3, Exposure limit: None Note VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Count: 1, Exposure limit: None Note WS60-00-1 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Exposure limit: None Note Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µµµµPC3215TB M8E 00. 4 The information in this document is current as of August, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard":Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).