UPC3215TB-E3

UPC3215TB NEC | Alldatasheet

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BIPOLAR ANALOG INTEGRATED CIRCUIT µµµµPC3215TB

5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER

Document No. P14765EJ1V0DS00 (1st edition) Date Published April 2000 N CP(K) Printed in Japan PRELIMINARY DATA SHEET The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. © 2000

DESCRIPTION

The µPC3215TB is a silicon monolithic IC designed as wideband amplifier. The µPC3215TB is suitable to systems required wideband operation from HF to L band. This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. The package is 6-pin super minimold suitable for surface mount.

FEATURES

• Wideband response : f u = 2.9 GHz TYP. @3 dB bandwidth
• Noise figure : NF = 2.3 dB TYP. @f = 1.5 GHz
• Power gain : G P = 20.5 dB TYP. @f = 1.5 GHz
• Supply voltage : V CC = 4.5 to 5.5 V
• High-density surface mounting: 6-pin super minimold package APPLICATION
• Systems required wideband operation from HF to L band

ORDERING INFORMATION

Part Number Package Marking Supplying Form µPC3215TB-E3 6-pin super minimold C3H Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC3215TB) Caution Electro-static sensitive devices

Preliminary Data Sheet P14765EJ1V0DS002 µµµµPC3215TB PIN CONNECTIONS Pin No. Pin Name

1 INPUT

PRODUCT LINE-UP OF 5V-BIAS SILICON MMIC WIDEBAND AMPLIFIERS (TA = +25 °C, VCC = 5.0 V, ZS = ZL = 50 ΩΩΩΩ ) Part No. fu (GHz) PO (sat) (dBm) G P (dB) NF (dB) ICC (mA) Package Marking µPC2711T 6-pin minimold µPC2711TB 2.9 +1.0 13 5.0 @f = 1 GHz 6-pin super minimold C1G µPC2712T 6-pin minimold µPC2712TB 2.6 +3.0 20 4.5 @f = 1 GHz 6-pin super minimold C1H µPC3210TB 2.3 +3.5 20 3.4 @f = 1.5 GHz 15 6-pin super minimold C2X µPC3215TB 2.9 +3.5 20.5 2.3 @f = 1.5 GHz 14 6-pin super minimold C3H Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Caution The package size distinguishes between minimold and super minimold. (Top View) C3H (Bottom View)

Preliminary Data Sheet P14765EJ1V0DS00 3 µµµµPC3215TB PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage (V) Note Function and Applications Internal Equivalent Circuit 1 INPUT  0.82 Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wideband. A multi- feedback circuit is designed to cancel the deviations of h FE and resistance. This pin must be coupled to signal source with capacitor for DC cut. GND 0  Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 4O U T P U T  3.8 Signal output pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wideband. This pin must be coupled to next stage with capacitor for DC cut. 6V CC 4.5 to 5.5  Power supply pin. This pin should be externally equipped with bypass capacitor to minimize ground impedance. Note Pin voltage is measured at VCC = 5.0 V GND GND IN VCC OUT 352

Preliminary Data Sheet P14765EJ1V0DS004 µµµµPC3215TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage V CC TA = +25 °C 6.0 V Circuit Current I CC TA = +25 °C 30 mA Input Power P in TA = +25 °C +10 dBm Power Dissipation P D TA = +85 °C Note 200 mW Operating Ambient Temperature TA –40 to +85 °C Storage Temperature T stg –55 to +150 °C Note Mounted on 50 × 50 × 1.6-mm epoxy glass PWB, with copper patterning on both sides. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage V CC 4.5 5.0 5.5 V Operating Ambient Temperature TA –40 +25 +85 °C Input Power Pin ––0 d B m Input Frequency Fin 0 . 1–2 . 9 G H z ELECTRICAL CHARACTERISTICS (T A = +25°C, VCC = 5.0 V, ZS = ZL = 50 ΩΩΩΩ ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current I CC No input signals 10.5 14.0 17.5 mA Power Gain G P f = 1.5 GHz, Pin = –30 dBm 18.5 20.5 – dB Noise Figure NF f = 1.5 GHz – 2.3 3.0 dB Upper Limit Operating Frequency fu 3 dB down below from gain at f = 0.1 GHz 2.5 2.9 – GHz Isolation ISL f = 1.5 GHz, P in = –30 dBm 39 44 – dB Input Return Loss RL in f = 1.5 GHz, Pin = –30 dBm 10 15 – dB Output Return Loss RL out f = 1.5 GHz, Pin = –30 dBm 6.5 9.5 – dB 1 dB Compression Point P-1 –4 –1.5 – dBm STANDARD CHARACTERISTICS (T A = +25°C, VCC = 5.0 V, ZS = ZL = 50 ΩΩΩΩ ) Parameter Symbol Test Conditions Reference Values Unit Saturated Output Power P O(sat) Pin = 0 dBm +3.5 dBm Output Intercept Point OIP 3 f1 = 1.5 GHz, f2 = 1.501 GHz +10 dBm Gain Flatness ΔG P f = 0.1 to 2.15 GHz 1.0 dB

Preliminary Data Sheet P14765EJ1V0DS00 5 µµµµPC3215TB TEST CIRCUIT VCC 1 000 pF C 150 W IN 2, 3, 5

4 C 2 50 W

EXAMPLE OF APPLICATION CIRCUIT 1 000 pF 1 000 pF 50 W IN 2, 3, 5 4 50 W 1 000 pF OUT 2, 3, 5 1 000 pF VCC 1 000 pF 1 000 pF 50 to 200 W Please connect these component to stabilize operation. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Capacitors for VCC , input and output pins 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).]

Preliminary Data Sheet P14765EJ1V0DS006 µµµµPC3215TB PACKAGE DIMENSIONS

6 PIN SUPER MINIMOLD (UNIT: mm)

1.25 ±0.1 2.1 ±0.1 0.65 0.65 1.3 2.0 ±0.2 0.1 MIN. 0.7 0.9 ±0.1 0 to 0.1 0.2 +0.1 –0.05 0.15 +0.1 –0.05

Preliminary Data Sheet P14765EJ1V0DS00 7 µµµµPC3215TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to V CC line. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Count: 3, Exposure limit: None Note IR35-00-3 Time: 40 seconds or less (at 200 °C) Count: 3, Exposure limit: None Note VP15-00-3 Wave Soldering Soldering bath temperature: 260 °C or below Time: 10 seconds or less Count: 1, Exposure limit: None Note WS60-00-1 Partial Heating Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Exposure limit: None Note Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µµµµPC3215TB

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